OR3T306BA256I-DB

The OR3T306BA256I-DB is an ORCA® Series 3T field-programmable gate array (FPGA) from Lattice Semiconductor Corporation. It implements the Series 3 architecture in a mid-density device, offering 1,568 logic elements, 25,600 bits of on-chip RAM and 221 user I/Os in a 256-ball BGA package.

Designed for industrial-grade applications, the device supports a 3.0 V to 3.6 V supply and an operating temperature range of -40 °C to 85 °C, while providing the Series 3 feature set such as boundary-scan (IEEE 1149.1 JTAG) and enhanced system clock routing.

Key Features

• Core Architecture (ORCA Series 3T) Implements ORCA Series 3 architecture and uses 0.3 μm 4-level metal technology as documented for OR3T devices.
• Logic Resources 1,568 logic elements (equivalent report from device data) supporting up to 48,000 gates for mid-range logic integration.
• On-chip Memory 25,600 bits of embedded RAM for registers, FIFOs or small data buffers.
• I/O Capability 221 user I/O pins. OR3T series I/Os are specified as 5 V tolerant and include pin-selectable I/O clamping diodes as described in the Series 3T documentation.
• System and Test Features Built-in boundary scan (IEEE 1149.1 JTAG) and TS_ALL testability functions for device-level test and system debug.
• Package and Mounting 256-ball BGA package (256-FPBGA, 17 × 17 mm) for surface-mount assembly.
• Power and Temperature Supply voltage 3.0 V to 3.6 V; industrial operating temperature range of -40 °C to 85 °C.
• Standards and Compliance RoHS compliant per supplier data.

Typical Applications

• Industrial Control Use in control logic and interface functions where industrial temperature range and surface-mount packaging are required.
• Mixed-Voltage System Interfaces Ideal for bridging and interfacing between 3.3 V and 5 V peripherals thanks to OR3T-series 5 V tolerant I/Os and pin-selectable clamping options.
• Peripheral Glue Logic Mid-density logic and embedded RAM suited for system glue, protocol bridging and custom peripheral control.

Unique Advantages

• Balanced mid-range integration: 1,568 logic elements with 25,600 bits of RAM deliver practical capacity for moderate-complexity designs without overprovisioning.
• Flexible I/O handling: 221 user I/Os with OR3T-series 5 V tolerance and pin-selectable clamping make mixed-voltage interfacing straightforward.
• Industrial readiness: Specified -40 °C to 85 °C operating range and industrial grade classification support deployment in demanding environments.
• Compact BGA footprint: 256-FPBGA (17 × 17 mm) package provides high I/O density in a surface-mount form factor for space-constrained PCBs.
• Test and debug support: Integrated IEEE 1149.1 JTAG boundary-scan simplifies manufacturing test and in-system debugging.
• RoHS compliant: Meets RoHS environmental requirements as indicated in supplier data.

Why Choose OR3T306BA256I-DB?

The OR3T306BA256I-DB positions itself as a practical, industrial-grade FPGA for designers who need a balance of logic capacity, embedded RAM and a high number of I/Os in a compact BGA package. Its Series 3T architecture features—such as 5 V tolerant I/Os, boundary-scan support and enhanced clock routing—address common system integration and test requirements.

This device is suitable for teams implementing mid-complexity control, interface or glue-logic functions that require robust temperature range, mixed-voltage interfacing and a surface-mount BGA solution. The part is listed as active/orderable in the supplier documentation.

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