OR3T207BAN256-DB

The OR3T207BAN256-DB is an ORCA™3C Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, offered as a commercial-grade, surface-mount IC in a 256-ball BGA package. It provides a moderate-density programmable logic fabric with 1,152 logic elements and 192 general-purpose I/O pins, suitable for commercial embedded designs that require flexible on-chip logic and I/O integration.

With approximately 18,432 bits of embedded RAM and a supply voltage range of 3.0 V to 3.6 V, this device targets applications that need compact packaging, a defined commercial temperature range, and RoHS-compliant components for streamlined manufacturing and procurement.

Key Features

• Core Logic  1,152 logic elements organized into 144 logic array blocks provide the programmable fabric for custom combinational and sequential logic.
• Embedded Memory  Approximately 0.018 Mbits (18,432 bits) of on-chip RAM to support buffering, FIFOs, and small data storage needs.
• I/O Capacity  192 general-purpose I/O pins accommodate a wide range of external interfaces and peripheral connections.
• Gate Count  36,000 gates of logic equivalent enable moderate-complexity implementations within a compact device footprint.
• Power  Operates from a 3.0 V to 3.6 V supply range, simplifying integration with common commercial logic power rails.
• Package & Mounting  256-ball BGA (256-PBGA, 27 × 27 mm) surface-mount package for high-density board-level integration.
• Operating Conditions  Commercial operating temperature range of 0 °C to 70 °C and RoHS compliance for regulatory and manufacturing compatibility.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and finite-state machines where moderate logic density and multiple I/Os are required.
• I/O Expansion and Interface Bridging  Use the 192 I/Os to aggregate or translate signals between subsystems and peripherals in compact designs.
• Prototyping and Development  Evaluate and validate logic architectures and interface timing in early-stage product development with a programmable device.
• Custom Control Logic  Implement application-specific sequencing, timing, and glue logic while keeping board count and BOM complexity low.

Unique Advantages

• Balanced Logic and I/O Density: 1,152 logic elements paired with 192 I/Os offer a practical balance for designs that need both on-chip logic and extensive external connectivity.
• Compact BGA Package: The 256-PBGA (27 × 27 mm) package enables a small board footprint for space-constrained applications.
• Commercial Temperature Support: Rated for 0 °C to 70 °C operation, suitable for a wide range of commercial environments and deployments.
• Low Embedded Memory Footprint: Approximately 18,432 bits of on-chip RAM provide immediate local storage for buffering and control functions without external memory.
• RoHS Compliant: Designed to meet RoHS requirements to simplify environmental compliance and manufacturing processes.

Why Choose OR3T207BAN256-DB?

The OR3T207BAN256-DB is positioned for designers seeking a commercial-grade, moderate-density FPGA with a strong mix of logic, I/O, and on-chip memory in a compact 256-BGA package. Its supply voltage range, gate count, and I/O capacity make it well suited to embedded designs that require configurable logic and extensive peripheral connectivity while maintaining a compact board footprint.

This device provides a dependable platform for teams focused on scalable, repeatable commercial products where RoHS compliance, standard operating temperature coverage, and a robust logic/I/O balance are important design considerations.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the OR3T207BAN256-DB. Our team can assist with procurement details and volume options.