OR3T1257BC432-DB

The OR3T1257BC432-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC provided in a 432‑LBGA exposed pad package. It delivers a mid-range integration of programmable logic and I/O capability suitable for commercial designs that require flexible interfacing and embedded memory on a single device.

Key on‑chip resources include 784 CLBs and 6,272 logic elements, approximately 0.10 Mbits of embedded RAM, and 342 I/O pins, all powered from a 3.0 V to 3.6 V supply and specified for 0 °C to 70 °C operation.

Key Features

• Programmable Logic 784 CLBs (6,272 logic elements) provide the configurable fabric for implementing custom logic functions and state machines.
• Embedded Memory Approximately 0.10 Mbits of on‑chip RAM (102,400 total RAM bits) for buffers, FIFOs, and small frame storage.
• I/O Capacity 342 I/O pins support extensive external interfacing and system connectivity within a single device footprint.
• Gate Count 186,000 gates for mapping combinatorial and sequential logic structures across the device.
• Power Supply Operates from a 3.0 V to 3.6 V supply for compatibility with common commercial power rails.
• Package & Mounting 432‑LBGA exposed pad package (supplier device package: 432‑EBGA, 40×40) in a surface‑mount form factor for PCB space efficiency and thermal contact.
• Commercial Temperature Grade Rated for 0 °C to 70 °C operation, aligned to commercial applications and environments.
• RoHS Compliant Device meets RoHS requirements for lead‑free manufacturing and assembly.

Unique Advantages

• Balanced Logic and I/O Resources: The combination of 6,272 logic elements and 342 I/Os supports designs that need both moderate logic capacity and broad external connectivity without additional interface components.
• On‑chip Memory for Local Storage: Approximately 0.10 Mbits of embedded RAM enables local buffering and small data storage, reducing reliance on external memory for many control and interfacing tasks.
• Compact, Thermally‑Conscious Packaging: The 432‑LBGA exposed pad package provides a compact footprint with an exposed pad for improved thermal path to PCB, aiding thermal management in dense layouts.
• Standard Commercial Voltage Range: 3.0 V to 3.6 V compatibility simplifies integration into common commercial power domains.
• Regulatory Readiness: RoHS compliance supports lead‑free manufacturing and broad deployment in commercial products.

Why Choose OR3T1257BC432-DB?

The OR3T1257BC432-DB positions itself as a versatile, commercial‑grade FPGA that combines mid‑range programmable logic capacity, significant I/O density, and on‑chip memory in a single, surface‑mount LBGA package. Its specification set—6,272 logic elements, 342 I/Os, approximately 0.10 Mbits of RAM, and a 3.0 V–3.6 V supply range—makes it suitable for designers seeking a compact, integrated solution for control, interfacing, and custom logic tasks within the commercial temperature range.

Choose this device when your design requires a balance of logic resources, embedded memory, and broad I/O in a RoHS‑compliant package, with supplier packaging options that support PCB assembly and thermal considerations.

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