OR3T1256BA352-DB

The OR3T1256BA352-DB is an ORCA™3C Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 352-ball BGA package. It provides a balance of programmable logic, on-chip memory, and high I/O count for commercial-grade embedded designs.

Typical use cases include designs that require mid-range logic capacity with extensive I/O, compact board-level integration, and operation across a standard commercial temperature range. The device is RoHS compliant and supplied in a surface-mount 352-BBGA package.

Key Features

• Logic Capacity — 6,272 logic elements to implement mid-complexity digital functions and custom logic blocks.
• Embedded Memory — Approximately 0.10 Mbits of on-chip RAM (102,400 bits) for buffering, small FIFOs and state storage.
• I/O Density — 298 available I/O pins to support high pin-count interfaces and multiple external peripherals.
• Gate Count — 186,000 gates to describe overall device complexity and integration potential.
• Power — Operates from a 3.0 V to 3.6 V supply range, providing clear voltage requirements for power delivery design.
• Package and Mounting — 352-BBGA (supplier package: 352-PBGA 35×35) in a surface-mount format for compact PCB layouts.
• Temperature Grade — Commercial operation from 0 °C to 70 °C for standard embedded and consumer applications.
• Environmental Compliance — RoHS compliant.

Typical Applications

• I/O-Intensive Control — Use the device’s 298 I/O pins for multi-channel control, sensor aggregation, or board-level interface consolidation.
• Embedded Logic and Glue — Implement custom glue logic, protocol adaptation, and timing control using the 6,272 logic elements.
• Prototyping and Development — Suitable for evaluating mid-range programmable logic in development platforms and proof-of-concept designs.
• On-Board Data Buffering — The on-chip RAM (102,400 bits) enables small buffering and state storage for data path and control functions.

Unique Advantages

• Balanced Logic-to-I/O Ratio: 6,272 logic elements paired with 298 I/Os enable designs that require substantial interfacing without excessive external components.
• Compact BGA Packaging: The 352-BBGA footprint allows high-density PCB integration while keeping the device footprint minimized.
• Clear Power Envelope: A defined 3.0 V–3.6 V supply range simplifies power-supply design and ensures predictable operation.
• Commercial Temperature Range: Rated for 0 °C to 70 °C operation to match standard commercial electronic applications.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for many commercial products.
• Surface-Mount Ready: Surface-mount package type aligns with modern automated PCB assembly processes.

Why Choose OR3T1256BA352-DB?

OR3T1256BA352-DB delivers a practical combination of mid-range programmable logic, modest embedded memory, and a high I/O count in a compact 352-BBGA package. As a commercial-grade FPGA from Lattice Semiconductor Corporation, it is suited for embedded designs that need flexible on-chip logic, extensive peripheral connectivity, and a well-defined power and thermal envelope.

This device is appropriate for engineering teams building compact boards requiring programmable logic and many external interfaces. Its mix of logic elements, on-chip RAM, and I/O density helps reduce external component count and simplifies board-level integration while maintaining clear specification boundaries for power and temperature.

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