OR3L225B8BM680-DB

The OR3L225B8BM680-DB is an ORCA™ OR3LxxxB family FPGA from Lattice Semiconductor Corporation. It provides a mid-range programmable logic fabric with a high count of general-purpose I/O and on-chip memory, packaged in a 680‑BBGA surface-mount package.

Designed for commercial applications, this device targets designs that require substantial I/O connectivity, a moderate logic element budget, and embedded RAM for local buffering and data manipulation.

Key Features

• Logic Capacity 11,552 logic elements supporting a programmable logic fabric suitable for mid-range designs.
• Embedded Memory Approximately 0.189 Mbits (189,440 bits) of on-chip RAM for data buffering and local storage.
• I/O Density 612 user I/O pins to support multiple external interfaces and high-pin-count designs.
• Gate Count Approximately 340,000 gates to quantify overall device complexity.
• Package 680‑BBGA (supplier device package: 680‑PBGAM, 35×35) in a compact surface‑mount BGA footprint.
• Power Supply Core voltage range 2.375 V–2.625 V for device power planning.
• Operating Conditions Commercial-grade device with an operating temperature range of 0°C–70°C.
• Compliance RoHS compliant for environmental regulatory considerations.
• Mounting Surface mount package suitable for standard PCB assembly processes.

Typical Applications

• Communications and Networking Implements protocol bridging, interface logic, and custom packet-handling functions where high I/O count and on-chip memory are beneficial.
• Embedded Control and Interfaces Provides glue logic, peripheral aggregation, and custom control functions in embedded systems using its logic elements and RAM.
• Prototyping and System Evaluation Offers a compact, high‑pin‑count FPGA platform for board-level prototyping and evaluating mid-range programmable logic designs.

Unique Advantages

• High I/O Integration: 612 I/O pins reduce external multiplexing and simplify integration of multiple peripherals and high-pin-count interfaces.
• Balanced Logic and Memory: The combination of 11,552 logic elements and ~0.189 Mbits of embedded RAM enables localized processing and buffering without immediate need for external memory.
• Compact BGA Footprint: 680‑BBGA (35×35) delivers high pin density in a compact surface-mount form factor optimized for space-constrained boards.
• Commercial Temperature Rating: Rated 0°C–70°C for designs targeting commercial product environments.
• Regulatory Compliance: RoHS compliance supports environmental regulatory requirements in commercial manufacturing.

Why Choose OR3L225B8BM680-DB?

The OR3L225B8BM680-DB provides a practical balance of logic capacity, embedded memory, and extensive I/O in a compact 680‑BBGA package, making it well suited for commercial embedded systems and connectivity-focused designs. Its specification set supports designs that need substantial pin counts and local RAM without escalating board-level complexity.

Manufactured by Lattice Semiconductor Corporation and offered as a RoHS-compliant, surface-mount device with a defined commercial temperature range and clear power requirements, this FPGA is a fit for engineers and system designers seeking a mid-range programmable logic solution that integrates many I/O and memory resources on-chip.

Request a quote or submit an inquiry to obtain pricing and availability for the OR3L225B8BM680-DB.