OR3L225B7BM680-DB

The OR3L225B7BM680-DB is a field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides 8,192 logic elements and approximately 0.13 Mbits of embedded RAM (134,144 total RAM bits) in a high-density 680‑BBGA package.

With 516 user I/O, support for a 2.375 V to 2.625 V core supply, surface-mount packaging in a 680‑PBGAM (35×35) footprint, and commercial temperature grading (0 °C to 70 °C), this device targets compact, I/O-rich FPGA designs requiring moderate on‑chip logic and memory resources.

Key Features

• Core Logic 8,192 logic elements suitable for implementing custom logic, glue logic and moderate complexity functions; the device contains approximately 244,000 gates.
• Embedded Memory Approximately 0.13 Mbits of on‑chip RAM (134,144 total RAM bits) for state storage, buffering and small data structures.
• I/O Capacity 516 user I/O pins to support multiple external interfaces and parallel connections.
• Package 680‑ball BBGA package (supplier device package: 680‑PBGAM, 35×35) in a surface‑mount form factor for space‑efficient PCB layouts.
• Power Core voltage supply range of 2.375 V to 2.625 V to match targeted system power rails.
• Operating Range & Grade Commercial grade operation from 0 °C to 70 °C; RoHS compliant.

Typical Applications

• Custom Logic / Glue Logic Implement control, protocol bridging and glue logic using the device's 8,192 logic elements and 244,000 approximate gate capacity.
• I/O‑Intensive Interfaces Leverage 516 user I/O pins for designs that require multiple parallel or serial connections to sensors, peripherals or external logic.
• Compact Embedded Systems Utilize the 680‑BBGA (35×35) surface‑mount package to integrate FPGA capability into space‑constrained boards.

Unique Advantages

• Balanced Logic and Memory: Combines 8,192 logic elements with approximately 0.13 Mbits of embedded RAM to support a range of moderate-complexity functions.
• High I/O Density: 516 I/O pins enable complex interfacing without external I/O expanders, reducing board-level component count.
• Compact, High‑Density Package: The 680‑BBGA (680‑PBGAM, 35×35) package provides a small footprint for embedded and space‑constrained applications.
• Controlled Power Envelope: Specified core supply range (2.375 V to 2.625 V) facilitates predictable power integration with system rails.
• Commercial Grade and RoHS Compliant: Designed for commercial temperature operation (0 °C to 70 °C) and complies with RoHS requirements.

Why Choose OR3L225B7BM680-DB?

The OR3L225B7BM680-DB positions itself as a compact, I/O-rich FPGA solution for designs that require a balance of programmable logic, embedded memory and high pin count in a surface‑mount BBGA package. Its combination of 8,192 logic elements, roughly 0.13 Mbits of RAM, and 516 I/O pins makes it suitable for board‑level designs needing significant interfacing capability without large form factors.

For teams developing commercial‑grade embedded systems, this Lattice FPGA offers a verifiable specification set—package, power, thermal range and I/O—that supports scalable designs and predictable integration into existing supply chains.

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