OR3L165B8BM680-DB

The OR3L165B8BM680-DB is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. This device provides 8,192 logic elements, approximately 0.13 Mbits of embedded memory and 516 user I/O pins in a 680-ball BGA package.

Designed for commercial-grade applications, the device operates from a 2.375 V to 2.625 V supply and is rated for an operating temperature range of 0 °C to 70 °C.

Key Features

• Logic Capacity  8,192 logic elements delivering programmable logic resources suitable for moderate-complexity designs.
• Embedded Memory  Approximately 0.13 Mbits (134,144 bits) of on-chip RAM to support buffering, state storage and small data tables.
• I/O Resources  516 user I/O pins to support high-density external interfacing and multiple peripheral connections.
• Gate Equivalent  244,000 equivalent gates for assessing overall design capacity and partitioning logic functions.
• Power  Single core supply range from 2.375 V to 2.625 V for system power planning and regulator selection.
• Package and Mounting  680-ball BGA (680-PBGAM, 35 × 35 mm) surface-mount package optimized for compact PCB layouts and high I/O density.
• Temperature Grade  Commercial operating range from 0 °C to 70 °C for standard electronics environments.
• Environmental Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Control Systems  Use where programmable logic and moderate on-chip memory are required for control sequencing and glue logic.
• High-Density I/O Interfaces  Suitable for designs that require many external connections—516 I/O pins support complex peripheral and bus interfacing.
• Signal Processing and Protocol Bridging  Implement custom data paths and protocol converters using the available logic elements and embedded RAM.

Unique Advantages

• Balanced Logic and Memory:  8,192 logic elements combined with 134,144 bits of on-chip RAM provide a practical balance for many mid-range FPGA use cases.
• Extensive I/O Count:  516 I/O pins enable high-connectivity designs and reduce the need for external multiplexing or GPIO expanders.
• Compact High-Pin-Count Package:  The 680-ball BGA (35 × 35 mm) delivers high pin density in a compact footprint for space-constrained boards.
• Commercial Temperature Rating:  Rated 0 °C to 70 °C for straightforward deployment in standard commercial electronic products.
• RoHS-Compliant:  Built to meet common environmental compliance expectations for modern electronics manufacturing.

Why Choose OR3L165B8BM680-DB?

The OR3L165B8BM680-DB provides a practical combination of logic density, on-chip memory and a very large I/O complement within a commercial-temperature, surface-mount BGA package. It is appropriate for designers who need significant I/O capacity alongside thousands of logic elements and embedded RAM in a compact form factor.

Manufactured by Lattice Semiconductor Corporation, this FPGA is suited to projects that require measurable logic and I/O resources while conforming to RoHS environmental requirements and standard commercial operating conditions.

Request a quote or submit a pricing and availability inquiry to obtain lead-time and ordering details for the OR3L165B8BM680-DB.