OR3L165B8PS240-DB

The OR3L165B8PS240-DB is an ORCA™ OR3LxxxB family Field Programmable Gate Array (FPGA) in a 240-BFQFP exposed pad package designed for commercial-grade applications. It integrates 8,192 logic elements, approximately 0.13 Mbits of embedded RAM, and up to 516 I/Os to support I/O-dense, logic-intensive designs within a 32 × 32 mm supplier device package (240-SQFP2).

With a core supply range of 2.375 V to 2.625 V and an operating temperature range of 0 °C to 70 °C, this device suits commercial electronic systems requiring moderate ambient temperature operation and RoHS-compliant components.

Key Features

• Logic Capacity  8,192 logic elements and approximately 244,000 gates provide ample resources for combinational and sequential logic implementation.
• Embedded Memory  Approximately 134,144 total RAM bits of on-chip memory to support buffering, state machines, and small data stores.
• I/O Density  Up to 516 general-purpose I/Os to support extensive peripheral interfacing and parallel connectivity.
• Power  Core supply voltage range of 2.375 V to 2.625 V to match target system power rails and ensure consistent device operation within specified limits.
• Package & Mounting  240-BFQFP with exposed pad (Supplier device package: 240-SQFP2, 32×32 mm) in a surface-mount configuration for PCB assembly and thermal conduction.
• Operating Range & Compliance  Commercial-grade operation from 0 °C to 70 °C and RoHS-compliant material status for regulatory alignment in commercial products.

Typical Applications

• I/O-dense interface modules  High pin count (516 I/Os) makes the device suitable for designs that require extensive parallel or mixed-signal interfacing in commercial systems.
• Embedded logic and control  8,192 logic elements and ~134,144 bits of RAM support implementation of custom control logic, state machines, and glue logic for embedded platforms.
• Data buffering and small memory functions  On-chip RAM provides capacity for buffering, FIFOs, and temporary storage in systems with moderate local memory requirements.
• Compact surface-mount assemblies  The 240-BFQFP exposed pad package enables PCB-mounted FPGA solutions in space-constrained commercial products requiring surface-mount assembly.

Unique Advantages

• High logic and gate count: 8,192 logic elements and ~244,000 gates allow substantial logic implementation without immediate need for external programmable logic.
• Significant I/O capacity: 516 I/Os minimize the need for additional I/O expanders in I/O-heavy designs, simplifying BOM and board routing.
• On-chip RAM for local storage: Approximately 0.13 Mbits of embedded RAM supports buffering and intermediate data handling within the FPGA fabric.
• Surface-mount exposed-pad package: The 240-BFQFP exposed pad in a 32×32 mm footprint balances thermals and PCB assembly compatibility for compact commercial designs.
• Commercial temperature and RoHS compliance: Rated 0 °C to 70 °C and RoHS-compliant for deployment in mainstream commercial electronics while meeting material restrictions.

Why Choose OR3L165B8PS240-DB?

The OR3L165B8PS240-DB positions itself as a commercially graded FPGA option that combines a substantial logic element count, extensive I/O, and built-in RAM in a surface-mount 240-BFQFP exposed pad package. Its voltage supply range and operating temperature align with a wide range of commercial electronic designs where moderate ambient conditions are expected.

This device is well suited for designers seeking a balanced combination of logic capacity, I/O density, and on-chip memory in a compact, RoHS-compliant package, enabling reduced external component count and simplified board-level integration.

Request a quote or submit a pricing inquiry today to evaluate OR3L165B8PS240-DB for your next commercial FPGA-based design.