OR2T40B8PS208-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 163 57600 3600 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,368 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-SQFP2 (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 163 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 900 | Number of Logic Elements/Cells | 3600 | ||
| Number of Gates | 99400 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 57600 |
Overview of OR2T40B8PS208-DB – ORCA™2 FPGA, 3600 logic elements, 208-BFQFP
The OR2T40B8PS208-DB is an ORCA™2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a commercial-grade, mid-density programmable logic fabric with 3,600 logic elements and approximately 57,600 bits of embedded RAM for on-chip data storage.
With 163 user I/Os, a 208-BFQFP exposed pad package, and a 3.0 V to 3.6 V supply range, this device targets commercial embedded designs that require flexible, reprogrammable logic and a compact surface-mount package.
Key Features
- Core Logic 3,600 logic elements (LEs) providing reprogrammable logic capacity for a range of mid-density functions.
- Embedded Memory Approximately 57,600 bits of on-chip RAM to support buffering, state machines, and small data storage needs.
- I/O Count 163 general-purpose I/Os to support multiple interfaces and peripheral connections in a single device.
- Package & Mounting Surface-mount 208-BFQFP (208-SQFP2, 28 × 28 mm) with exposed pad for board-level mounting and grounding options.
- Power Operates from a 3.0 V to 3.6 V supply range, compatible with common commercial logic rails.
- Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Compliance RoHS compliant, meeting common environmental directives for lead-free assembly.
Typical Applications
- Commercial Embedded Systems Implement custom control and interface logic where reprogrammability and a mid-range logic count are required.
- Prototyping & Development Useful for validating custom logic, I/O mapping, and memory usage in early-stage designs.
- Interface Consolidation Consolidate glue logic and multiple peripheral interfaces into a single device using up to 163 I/Os.
Unique Advantages
- Balanced Logic and Memory: 3,600 logic elements paired with approximately 57,600 bits of embedded RAM offer a practical balance for mid-density designs.
- Generous I/O Count: 163 user I/Os enable integration of multiple peripherals and interface standards on a single FPGA.
- Compact Surface-Mount Package: 208-BFQFP (28 × 28 mm) with exposed pad supports compact PCB layouts while providing a standard surface-mount form factor.
- Commercial Temperature Range: Rated for 0 °C to 70 °C operation to match typical commercial product environments.
- RoHS Compliant: Conforms to lead-free assembly requirements for modern manufacturing processes.
Why Choose OR2T40B8PS208-DB?
The OR2T40B8PS208-DB positions itself as a practical, commercial-grade FPGA for designers needing reprogrammable logic with moderate capacity and a high I/O count. Its combination of 3,600 logic elements, approximately 57,600 bits of embedded RAM, and 163 I/Os makes it suitable for consolidating interface logic and implementing custom control functions in compact, surface-mount designs.
This device is well suited for teams and projects that require predictable electrical parameters (3.0 V to 3.6 V) and standard commercial operating conditions, while benefitting from Lattice Semiconductor Corporation’s ORCA™2 FPGA architecture in a 208-BFQFP exposed pad package.
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