ORT82G5-1FN680I

IC FPGA 372 I/O 680FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

Quantity 1,295 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case680-BBGANumber of I/O372Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORT82G5-1FN680I – ORCA® 4 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

The ORT82G5-1FN680I is an ORCA Series 4 reconfigurable embedded SoC FPGA designed for high-speed serial backplane data transmission and interdevice communication. Built around an embedded FPGA fabric with integrated SERDES transceivers, the device targets applications that require multi‑channel high‑speed links such as XAUI, Fibre Channel and 10 GbE interface implementations.

This surface-mount device comes in a 680-BBGA (680-FPBGA, 35 × 35) package, is rated for industrial temperature operation (−40 °C to 85 °C), supports a supply range of 1.425 V to 3.6 V, and is RoHS compliant.

Key Features

  • FPGA Logic Density  Provides 10,368 logic elements for implementing custom logic, state machines and protocol processing.
  • Programmable Functional Units (PFUs)  1,296 PFUs (programmable functional units) form the device’s configurable fabric to support a wide range of logic and routing resources.
  • Embedded Memory  Approximately 113,664 bits of on‑chip RAM to support buffers, FIFOs and small data structures used by user logic.
  • High‑Speed SERDES  Eight SERDES channels (ORT82G5) operating up to 3.7 Gbps per lane, suitable for backplane links and multi‑lane serial protocols.
  • Built‑in Link Support  Includes support for Rx Clock and Data Recovery (CDR), transmitter preemphasis, and embedded 8b/10b encoding/decoding and link state machines for 10 GbE and Fibre Channel applications.
  • I/O  Large I/O count with 372 user I/O pins to connect to board-level interfaces, peripherals and backplane signals.
  • System Gates  Approximately 643,000 system gates available for implementing integrated control and packet-processing logic.
  • Package & Mounting  680-BBGA (680-FPBGA, 35×35) package for surface-mount PCB assembly.
  • Power & Temperature  Supply voltage range 1.425 V to 3.6 V and operating temperature range −40 °C to 85 °C (industrial grade).
  • Compliance  RoHS compliant.

Typical Applications

  • Backplane Networking  Multi‑lane SERDES channels and CDR enable high‑speed full‑duplex links across FR‑4 backplanes for switch and router line cards.
  • 10 GbE and XAUI Interfaces  Integrated 8b/10b encoding/decoding and link state machines facilitate XAUI and 10 Gigabit Ethernet bridging and endpoint designs.
  • Fibre Channel and Storage Networking  Built‑in link support and high logic density allow implementation of Fibre Channel link termination and protocol processing.
  • Inter‑module Bridges  Clock recovery and multi‑channel alignment features make the device suitable for board‑to‑board or shelf‑to‑shelf high‑speed data transfer and protection link implementations.

Unique Advantages

  • Multi‑lane High‑speed SERDES: Eight configurable SERDES lanes up to 3.7 Gbps provide the physical interface needed for modern backplane protocols.
  • Balanced Logic and Memory: 10,368 logic elements plus approximately 113,664 bits of embedded RAM enable integrated protocol stacks, buffering and control logic without external FPGA resources.
  • Integrated Link Functions: On‑chip CDR, transmitter preemphasis and 8b/10b link state machines reduce external IP requirements and simplify system design.
  • High I/O Count: 372 I/Os give flexible routing options for complex board designs and multi‑protocol interfacing.
  • Industrial Temperature Range: −40 °C to 85 °C rating supports deployment in systems that require extended ambient temperature operation.
  • Compact High‑Pin Package: 680‑BBGA (35 × 35) delivers high connectivity in a compact surface‑mount form factor.

Why Choose ORT82G5-1FN680I?

The ORT82G5-1FN680I combines a Series 4 reconfigurable embedded SoC FPGA fabric with eight high‑speed SERDES channels to provide an integrated solution for backplane and high‑speed interconnect designs. Its combination of 10,368 logic elements, on‑chip RAM and dedicated link support functions enables designers to implement XAUI, 10 GbE and Fibre Channel interfaces with fewer external components.

This device is well suited to engineering teams designing network line cards, switch fabrics, storage interfaces and other systems demanding multi‑lane serial connectivity, robust I/O count and industrial temperature operation. The ORT82G5-1FN680I offers a balance of logic capacity, serial performance and package density for scalable, board‑level high‑speed designs.

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