ORT82G5-3BM680C

FPGA, 1296 CLBS, 333000 GATES
Part Description

ORCA® ORT82G5 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

Quantity 119 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package680-PBGAM (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case680-BBGANumber of I/O372Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1296Number of Logic Elements/Cells10368
Number of Gates643000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of ORT82G5-3BM680C – ORCA® ORT82G5 Field Programmable Gate Array (FPGA) IC 372 113664 10368 680-BBGA

The ORT82G5-3BM680C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation offering 10,368 logic elements and configurable on-chip resources in a high-pin-count BGA package. It targets designs that require substantial logic density, extensive I/O, and embedded memory within a surface-mount, commercial-grade FPGA.

This device provides a balance of logic capacity, I/O density and flexible supply voltage support, making it suitable for FPGA-based system designs that need compact integration and moderate operating-temperature requirements.

Key Features

  • Logic Capacity — 10,368 logic elements provide the core programmable fabric for implementing custom logic, state machines and feature-rich designs.
  • Embedded Memory — Approximately 0.11 Mbits (113,664 bits) of on-chip RAM to support buffers, FIFOs and small working memory for user logic.
  • I/O Density — 372 I/O pins to support wide parallel buses, multiple interfaces or large connector mappings in high-density applications.
  • Gate Count — Equivalent to 643,000 gates, enabling complex combinational and sequential designs within the FPGA fabric.
  • Package — 680-BBGA (680-PBGAM, 35×35 mm) high-pin-count ball grid array for compact board-level integration and routing.
  • Power Supply — Supports supply voltages from 1.425 V to 3.6 V, allowing flexibility in system power domains and interfacing.
  • Mounting and Grade — Surface-mount device, commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Environmental Compliance — RoHS compliant for regulatory and environmental requirements.

Typical Applications

  • Embedded Systems — Implement control logic, glue logic and customized peripherals using the device’s 10,368 logic elements and embedded RAM.
  • High-Density Interface Bridging — Use the 372 I/O pins to bridge multiple parallel or high-pin-count interfaces on a single FPGA package.
  • Signal Processing and Acceleration — Allocate logic and on-chip RAM to build data-path blocks, buffering and small hardware accelerators.
  • Prototyping and Custom Hardware — Leverage the programmable fabric and significant gate count to validate and iterate custom IP and system designs.

Unique Advantages

  • High Logic Density: 10,368 logic elements allow implementation of sizable custom logic without external glue chips.
  • Substantial Embedded Memory: Approximately 0.11 Mbits of on-chip RAM supports buffering and local data storage for user logic.
  • Extensive I/O Count: 372 I/Os enable complex connectivity options and simplify board-level signal routing for multi-interface systems.
  • Compact, High-Pin-Count Package: 680-BBGA (35×35 mm) provides a high I/O/pin density in a surface-mount form factor suitable for space-constrained PCBs.
  • Flexible Power Options: Wide supply range (1.425 V–3.6 V) enables compatibility with various system voltage domains.
  • Regulatory Readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose ORT82G5-3BM680C?

The ORT82G5-3BM680C positions itself as a commercially graded FPGA that balances logic capacity, I/O density and on-chip memory in a single 680-BBGA package. It is well suited for designers who need up to 10,368 logic elements, significant I/O connectivity and embedded RAM while operating within standard commercial temperature limits.

Backed by Lattice Semiconductor Corporation, this FPGA offers a practical option for system designers seeking a high-pin-count, RoHS-compliant programmable device that fits a wide range of FPGA-based designs requiring moderate thermal and power envelopes.

Request a quote or submit a purchase inquiry to get pricing and availability information for the ORT82G5-3BM680C.

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