AS4C2M32D1A-5BCN
| Part Description |
IC DRAM 64MBIT PARALLEL 144LFBGA |
|---|---|
| Quantity | 967 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-LFBGA (12x12) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 700 ps | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 2.3V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 144-LFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C2M32D1A-5BCN - 64Mbit DDR SDRAM
The AS4C2M32D1A-5BCN is a 64-megabit DDR SDRAM organized as 2M x 32 bits, designed for applications requiring fast, reliable volatile memory. Built on proven SDRAM - DDR technology, this parallel interface memory device operates at 200 MHz clock frequency with 7 ns access time, making it suitable for embedded systems, networking equipment, and industrial applications. With an active lifecycle status and commercial temperature range, it provides a dependable memory solution for designs requiring moderate density and proven technology.
Key Features
- Memory Configuration - 64Mbit capacity organized as 2M x 32, providing a balanced word width for 32-bit data bus architectures common in embedded processors and controllers.
- DDR Technology - Double Data Rate SDRAM transfers data on both rising and falling clock edges, effectively doubling throughput compared to single data rate designs while maintaining a 200 MHz clock frequency.
- Performance Specifications - 7 ns access time and 15 ns write cycle time deliver responsive memory operations suitable for real-time processing and buffering applications.
- Power Supply - 2.3V to 2.7V operating voltage aligns with common low-voltage logic families and reduces power consumption in battery-operated or thermally constrained designs.
- Package - 144-pin LFBGA in a compact 12mm x 12mm footprint offers a space-efficient solution for board designs with limited real estate.
- Operating Temperature - 0°C to 70°C commercial temperature range suits standard office, telecommunications, and consumer equipment environments.
Typical Applications
- Embedded Computing Systems - This DDR SDRAM provides main system memory or frame buffers for microprocessor-based embedded controllers where the 32-bit organization matches common CPU data widths and the 200 MHz clock supports moderate processing throughput.
- Networking Equipment - Routers, switches, and access points utilize this memory for packet buffering and routing table storage, where the fast access time and parallel interface enable efficient packet processing in commercial network infrastructure.
- Industrial Controllers - PLCs, motion controllers, and industrial PCs benefit from the reliable volatile memory for program execution and data buffering in factory automation environments within the commercial temperature range.
- Telecommunications Infrastructure - Base station controllers, DSLAMs, and VoIP gateways employ this SDRAM for call processing and signal buffering where proven technology and moderate density meet system requirements.
- Test and Measurement Instruments - Oscilloscopes, logic analyzers, and data acquisition systems use this memory for waveform capture and sample buffering where fast write cycles support high-speed data streaming.
Unique Advantages
- Proven DDR Technology: Mature SDRAM - DDR architecture offers well-understood design-in process with extensive reference materials, reducing development risk and time-to-market.
- Standard Parallel Interface: Direct connection to microprocessor memory buses eliminates protocol conversion overhead, simplifying board design and reducing component count compared to serial memory alternatives.
- Balanced Density: 64Mbit capacity provides sufficient memory for moderate-complexity applications without over-provisioning, optimizing cost per bit for targeted use cases.
- Low Voltage Operation: 2.3V to 2.7V supply voltage reduces power dissipation and heat generation in multi-chip systems, easing thermal management requirements.
- Compact Footprint: 12mm x 12mm LFBGA package delivers high pin density in minimal board space, supporting compact product designs without sacrificing I/O count.
- Active Lifecycle: Current production status ensures long-term availability for new designs and simplified supply chain management without obsolescence concerns.
Why Choose AS4C2M32D1A-5BCN?
The AS4C2M32D1A-5BCN addresses designs requiring reliable, moderate-density DDR SDRAM with a parallel interface and commercial temperature operation. Its 2M x 32 organization and 200 MHz clock frequency position it for embedded systems and industrial equipment where proven technology and straightforward integration matter more than cutting-edge performance. Engineers selecting this device gain access to mature design resources, stable supply, and predictable behavior backed by Alliance Memory's focus on memory solutions.
For applications operating within commercial temperature ranges and benefiting from standard parallel memory interfaces, this DDR SDRAM delivers a practical balance of capacity, speed, and board-level simplicity without unnecessary complexity or cost premium.
Get Started
Contact our sales team to request a quote for the AS4C2M32D1A-5BCN or to discuss your specific memory requirements. Our technical support staff can assist with design integration questions and provide additional documentation to accelerate your development process.