AS4C2G16D4-62BCNTR
| Part Description |
DDR4, 32GB, 2G X 16, 1.2V, 96-BA |
|---|---|
| Quantity | 73 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 40 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 96-FBGA (7.5x13) | Memory Format | DRAM | Technology | SDRAM - DDR4 | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | 13.75 ns | Grade | Extended / Automotive-like | ||
| Clock Frequency | 1.6 GHz | Voltage | 1.14V ~ 1.26V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 95°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 96-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2G x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C2G16D4-62BCNTR - 32Gb DDR4 SDRAM
The AS4C2G16D4-62BCNTR is a high-performance 32-gigabit DDR4 SDRAM from Alliance Memory, Inc., organized as 2G x 16 and operating at 1.2V. This device delivers reliable memory performance with a 1600MHz clock frequency and 13.75ns access time, making it well-suited for applications requiring substantial memory capacity in a compact footprint.
Built on proven DDR4 technology, this SDRAM supports parallel interface communications and is housed in a space-efficient 96-TFBGA package. The device operates across an extended temperature range of 0°C to 95°C (case temperature), ensuring stable performance in demanding thermal environments.
Key Features
- High-Density Memory Architecture - 32-gigabit capacity organized as 2G x 16 provides ample storage for data-intensive applications while maintaining efficient parallel data access.
- DDR4 Technology - Fourth-generation SDRAM technology delivers improved speed and power efficiency compared to previous DDR generations, operating at 1600MHz clock frequency.
- Low Power Operation - Operating voltage of 1.14V to 1.26V reduces power consumption, making it suitable for energy-conscious designs and extending battery life in portable applications.
- Fast Access Performance - 13.75ns access time enables quick data retrieval, supporting applications with demanding real-time processing requirements.
- Compact Package - 96-TFBGA package measuring 7.5mm x 13mm minimizes board space while accommodating high pin count for parallel interface.
- Extended Temperature Range - Operates reliably from 0°C to 95°C case temperature, suitable for industrial and commercial environments with varying thermal conditions.
Typical Applications
- Industrial Computing Systems - This DDR4 SDRAM provides the memory capacity needed for industrial PCs and embedded controllers where extended temperature tolerance ensures consistent operation in factory and outdoor installations.
- Network Infrastructure Equipment - The 32Gb capacity and fast access times support routers, switches, and network appliances that must buffer and process large volumes of data traffic with minimal latency.
- Medical Imaging Devices - High memory density enables storage of large imaging datasets in diagnostic equipment where the parallel interface facilitates rapid data transfer between processors and display systems.
- Automotive Infotainment - The extended operating temperature range and low power consumption make this SDRAM suitable for in-vehicle entertainment and navigation systems that must function reliably across diverse climate conditions.
- High-Performance Embedded Systems - Applications requiring substantial working memory for multitasking, data buffering, or computational workloads benefit from the 32Gb capacity and DDR4 performance characteristics.
Unique Advantages
- Proven DDR4 Standard: Leverages widely-adopted DDR4 technology, simplifying design integration with readily available controllers and reducing development risk.
- Optimized Power Efficiency: 1.2V nominal operation lowers system power requirements compared to DDR3, reducing thermal management complexity and operating costs.
- Space-Efficient Design: FBGA packaging delivers high memory density in minimal board area, enabling more compact product designs or additional component placement.
- Wide Operating Range: 0°C to 95°C case temperature support eliminates the need for specialized temperature management in many industrial applications, simplifying thermal design.
- Parallel Interface Bandwidth: 16-bit parallel data path provides high throughput for applications requiring simultaneous access to multiple data streams or large block transfers.
- Active Lifecycle Status: Current production availability ensures long-term supply confidence for designs with extended product lifecycles.
Why Choose AS4C2G16D4-62BCNTR?
The AS4C2G16D4-62BCNTR combines substantial memory capacity with the power efficiency and performance of DDR4 technology in a compact, temperature-tolerant package. Engineers designing industrial, networking, medical, or automotive systems will appreciate the balance of capacity, speed, and operational reliability this device provides. The standard DDR4 interface ensures compatibility with a broad ecosystem of processors and controllers, accelerating time-to-market while maintaining design flexibility.
For applications where memory density, thermal resilience, and proven technology convergence are essential, this Alliance Memory DDR4 SDRAM delivers dependable performance across demanding operational environments.
Get Started
To request a quote for the AS4C2G16D4-62BCNTR or discuss how this DDR4 SDRAM can meet your specific design requirements, contact our sales team. We're ready to help you evaluate this solution for your next project.