AS4C1G32MD4V-046BIN
| Part Description |
IC DRAM 32GBIT LVSTLE 200FBGA |
|---|---|
| Quantity | 1,283 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 200-FBGA (10x15) | Memory Format | DRAM | Technology | SDRAM - Mobile LPDDR4X | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | 3.5 ns | Grade | Automotive | ||
| Clock Frequency | 4.266 GHz | Voltage | 1.06V ~ 1.17V, 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Write Cycle Time Word Page | 18 ns | Packaging | 200-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVSTLE_06 | Memory Organization | 1G x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | N/A | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0036 |
Overview of AS4C1G32MD4V-046BIN - 32Gbit LPDDR4X Mobile SDRAM
The AS4C1G32MD4V-046BIN from Alliance Memory is a high-density 32-gigabit LPDDR4X mobile SDRAM featuring a 1G x 32-bit memory organization. This volatile memory IC is engineered for demanding mobile and embedded applications that require high bandwidth, low power consumption, and reliable operation across extended temperature ranges.
Built on advanced LPDDR4X technology, this SDRAM delivers data rates up to 4266 MT/s while maintaining the low-voltage operation essential for battery-powered and thermally constrained systems.
Key Features
- High-Density Memory Configuration - 32Gbit capacity organized as 1G x 32 bits provides substantial memory bandwidth for data-intensive applications requiring large memory pools.
- LPDDR4X Technology - Advanced mobile SDRAM standard delivers high-speed data transfer with optimized power efficiency compared to previous generation memory technologies.
- High-Speed Performance - 4266 MHz clock frequency with 3.5ns access time enables rapid data throughput for performance-critical systems.
- Low-Voltage Operation - Dual voltage supply ranges of 1.06V to 1.17V and 1.7V to 1.95V reduce power consumption and heat generation in mobile applications.
- Extended Temperature Range - Operating temperature from -40°C to 95°C (TC) ensures reliable performance in harsh industrial and automotive environments.
- Compact Form Factor - 200-VFBGA package measuring 10x15mm provides high memory density while minimizing board space requirements.
Typical Applications
- Mobile Computing Devices - This LPDDR4X memory provides the high bandwidth and low power consumption required for smartphones, tablets, and portable computing platforms where battery life and thermal management are critical design factors.
- Industrial Embedded Systems - The extended temperature range from -40°C to 95°C makes this SDRAM suitable for industrial controllers, HMIs, and automation equipment operating in challenging factory floor environments.
- Networking and Communications Equipment - High-speed 4266 MT/s data rates support demanding packet processing and buffering requirements in routers, switches, and wireless infrastructure.
- Edge Computing and IoT Gateways - The 32Gbit capacity accommodates substantial local data processing and caching for edge AI inference and real-time analytics applications.
Unique Advantages
- Optimized Power Efficiency: LPDDR4X low-voltage operation significantly reduces system power consumption, extending battery runtime and simplifying thermal design in compact enclosures.
- Industrial-Grade Temperature Support: Full -40°C to 95°C operating range eliminates the need for additional thermal management in temperature-variable environments.
- High Memory Bandwidth: 4266 MHz clock frequency with 32-bit bus width delivers the throughput necessary for demanding real-time data processing applications.
- Design Flexibility: LVSTLE interface standard ensures compatibility with a wide range of mobile and embedded processors supporting LPDDR4X memory.
- Space-Efficient Packaging: 200-FBGA package in 10x15mm footprint maximizes memory density while maintaining manageable PCB layout complexity.
Why Choose AS4C1G32MD4V-046BIN?
The AS4C1G32MD4V-046BIN represents an ideal solution for design engineers developing next-generation mobile and embedded systems that demand high memory capacity without compromising on power efficiency or thermal performance. Alliance Memory's commitment to quality and long-term availability makes this component a reliable choice for products with extended lifecycle requirements.
With its combination of 32Gbit density, LPDDR4X technology, and industrial temperature rating, this SDRAM addresses the growing need for high-performance volatile memory in space-constrained, power-sensitive applications across consumer, industrial, and communications markets.
Call to Action
Contact our sales team to request a quote for the AS4C1G32MD4V-046BIN or to discuss volume pricing and availability for your specific project requirements.