AS4C16M32SC-7TINTR

The AS4C16M32SC-7TINTR is a 512Mbit synchronous DRAM from Alliance Memory, organized as 16M x 32 with a 133MHz clock frequency. Built on SDRAM technology, this parallel memory device delivers reliable performance for embedded systems requiring substantial memory capacity with proven synchronous operation.

Designed for industrial and commercial applications, this DRAM operates across an extended temperature range of -40°C to 85°C, making it suitable for environments where standard commercial-grade memory may not provide adequate reliability. The 86-TSOP II surface-mount package enables straightforward integration into high-density PCB layouts.

Key Features

• 512Mbit Memory Capacity - Organized as 16M x 32, providing sufficient memory density for embedded applications that require multiple megabytes of working memory without resorting to more complex memory hierarchies.
• 133MHz Synchronous Operation - SDRAM technology with 133MHz clock frequency enables predictable timing and efficient data transfer for processor-memory interfaces in embedded controllers and processing systems.
• Fast Access Timing - 17ns access time and 15ns write cycle time support responsive memory operations for time-sensitive processing tasks and real-time applications.
• Extended Temperature Range - Rated for -40°C to 85°C operation, ensuring consistent performance in industrial environments, outdoor enclosures, and thermally challenging installations.
• 3.3V Supply Operation - Standard 3V to 3.6V supply voltage simplifies power delivery and aligns with common embedded system voltage rails, reducing the need for additional voltage conversion circuits.
• Surface-Mount Package - 86-TSOP II package in 10.16mm width format supports automated assembly processes and enables compact PCB footprints in space-constrained designs.

Typical Applications

• Industrial Automation Systems - This SDRAM provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs where the extended temperature rating ensures reliable operation in factory floor environments with varying thermal conditions.
• Embedded Computing Platforms - Serves as main memory for ARM, MIPS, or other embedded processors in set-top boxes, network appliances, and control systems where 512Mbit capacity supports application code execution and data buffering without requiring external memory expansion.
• Instrumentation and Test Equipment - Supports data acquisition systems, oscilloscopes, and test instruments that require fast memory access for signal processing and waveform storage, with temperature tolerance accommodating laboratory and field deployment scenarios.
• Automotive Infotainment and Telematics - Provides memory resources for navigation systems, dashboard displays, and vehicle communication modules operating in automotive temperature environments, though this device does not carry AEC-Q100 automotive qualification.
• Communication Infrastructure - Enables memory buffering in routers, switches, and wireless access points where synchronous operation facilitates packet processing and the temperature range supports both indoor and outdoor network equipment installations.

Unique Advantages

• Proven SDRAM Architecture: Synchronous DRAM technology offers well-established compatibility with common embedded processors and memory controllers, reducing integration risk and simplifying board bring-up compared to newer memory technologies.
• Industrial Temperature Capability: The -40°C to 85°C operating range extends deployment options beyond climate-controlled environments, allowing system designers to address industrial, outdoor, and automotive applications with a single memory component.
• Simplified Power Management: Single 3.3V supply operation eliminates the need for multiple voltage rails or level shifting, reducing BOM cost and board complexity while improving overall system power efficiency.
• Cost-Effective Memory Density: 512Mbit capacity in a single device reduces component count and PCB routing complexity compared to using multiple smaller memory chips, lowering assembly costs and improving board layout efficiency.
• Mature Supply Chain: Alliance Memory's focus on commodity memory products provides stable availability and long-term supply continuity for designs with extended production lifecycles, reducing obsolescence risk.
• Standardized Footprint: The 86-TSOP II package uses industry-standard dimensions and pinout conventions, enabling potential second-source options and simplifying PCB layout with established design guidelines.

Why Choose AS4C16M32SC-7TINTR?

The AS4C16M32SC-7TINTR addresses the needs of embedded system designers seeking reliable, cost-effective memory solutions for industrial and commercial applications. Its combination of proven SDRAM technology, extended temperature operation, and 512Mbit capacity makes it well-suited for platforms where memory performance requirements are moderate but environmental reliability is essential.

This device is particularly appropriate for designs with multi-year production horizons that value supply stability and component longevity over cutting-edge memory performance. Engineers working on industrial controls, embedded computing, or infrastructure equipment will find this SDRAM offers a practical balance of capacity, environmental tolerance, and integration simplicity.

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Contact our sales team for pricing, availability, and technical support for the AS4C16M32SC-7TINTR. Our application engineers can assist with integration guidance, reference designs, and volume pricing for your next project.