AS4C16M32MSB-6BINTR
| Part Description |
IC DRAM 512MBIT PARALLEL 90FBGA |
|---|---|
| Quantity | 1,254 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C16M32MSB-6BINTR - 512Mbit Mobile SDRAM
The AS4C16M32MSB-6BINTR is a 512Mbit mobile SDRAM from Alliance Memory, Inc., configured as 16M x 32 with a parallel interface. This low-power SDRAM operates at 166MHz and is designed for applications requiring reliable volatile memory with extended temperature tolerance. The device combines high-density memory storage with a compact 90-FBGA package, making it suitable for space-constrained embedded systems and mobile applications.
Key Features
- High-Density Memory - 512Mbit (16M x 32) organization provides substantial volatile memory storage for data-intensive applications.
- Fast Clock Frequency - 166MHz operation enables rapid data access with 5.5ns access time and 15ns write cycle time.
- Low Power Operation - 1.7V to 1.95V supply voltage reduces power consumption, ideal for battery-powered and mobile devices.
- Extended Temperature Range - Operates reliably from -40°C to 85°C (TA), supporting industrial and automotive environments.
- Compact Package - 90-FBGA (8x13mm) footprint optimizes board space utilization in dense PCB layouts.
- Parallel Interface - Standard SDRAM interface simplifies integration with processors and controllers supporting legacy memory protocols.
Typical Applications
- Industrial Automation - This mobile SDRAM provides reliable memory for PLCs, HMI systems, and industrial controllers where extended temperature tolerance ensures consistent operation in factory environments and the low power consumption reduces heat dissipation requirements.
- Embedded Computing - The 512Mbit capacity and 166MHz operation support embedded processors in routers, gateways, and edge computing devices that require fast volatile memory for data buffering and program execution.
- Automotive Electronics - The extended temperature range and compact FBGA package make this SDRAM suitable for infotainment systems, dashboard displays, and telematics modules operating in challenging automotive thermal conditions.
- Portable Instrumentation - Low voltage operation and high-density storage enable battery-powered test equipment, handheld analyzers, and medical diagnostic devices to minimize power draw while maintaining adequate memory resources.
- Communications Equipment - Network switches, base stations, and telecommunications infrastructure utilize this SDRAM for packet buffering and temporary data storage where parallel interface compatibility simplifies legacy system upgrades.
Unique Advantages
- Proven SDRAM Technology: Standard mobile SDRAM architecture ensures compatibility with existing controller designs and reduces development risk.
- Industrial Temperature Performance: The -40°C to 85°C operating range eliminates the need for additional thermal management in many industrial deployments.
- Space-Efficient Design: The compact 90-FBGA package reduces PCB footprint by up to 40% compared to larger TSOP alternatives, allowing denser board layouts.
- Low Power Consumption: 1.7V to 1.95V operation extends battery life in portable applications and reduces overall system power budgets.
- Fast Access Performance: 5.5ns access time and 166MHz clock support real-time data processing requirements in embedded systems.
- Simplified BOM Management: Single voltage supply and standard interface reduce component count and design complexity.
Why Choose AS4C16M32MSB-6BINTR?
This mobile SDRAM from Alliance Memory delivers a proven memory solution for embedded and industrial applications requiring reliable volatile storage with extended temperature capability. Engineers designing systems that must operate in harsh environments will appreciate the -40°C to 85°C rating, while the low voltage operation and compact FBGA package address modern requirements for power efficiency and board space optimization.
The AS4C16M32MSB-6BINTR offers long-term value for designs that need standard SDRAM performance without the complexity of newer DDR technologies. Its parallel interface ensures straightforward integration with legacy processor architectures, while the 512Mbit density provides adequate memory for data buffering, program execution, and temporary storage in cost-sensitive applications.
Request a Quote
Contact our sales team to discuss your memory requirements and receive pricing for the AS4C16M32MSB-6BINTR. Our technical support staff can assist with integration questions and provide additional documentation to accelerate your design process.
