AS4C16M32MSB-6BIN
| Part Description |
IC DRAM 512MBIT PARALLEL 90FBGA |
|---|---|
| Quantity | 338 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of AS4C16M32MSB-6BIN - 512Mbit Mobile SDRAM
The AS4C16M32MSB-6BIN is a 512Mbit low power SDRAM from Alliance Memory, featuring a 16M x 32 organization. This volatile DRAM operates at 166MHz and provides a 5.5ns access time in a compact 90-FBGA package. With extended temperature support from -40°C to 85°C and low voltage operation (1.7V to 1.95V), this mobile SDRAM is designed for embedded systems, handheld devices, and industrial applications where power efficiency and reliable memory performance are essential.
Key Features
- Memory Architecture - 512Mbit capacity organized as 16M x 32, providing flexible data access patterns for various embedded applications.
- High-Speed Operation - 166MHz clock frequency with 5.5ns access time delivers responsive memory performance for time-sensitive processing tasks.
- Low Power Design - Operates on 1.7V to 1.95V supply voltage, reducing power consumption compared to standard voltage SDRAM devices.
- Extended Temperature Range - -40°C to 85°C operating range ensures reliable operation in harsh industrial and automotive environments.
- Compact Package - 90-FBGA (8mm x 13mm) footprint minimizes PCB space requirements for space-constrained designs.
- Parallel Interface - Standard SDRAM parallel interface simplifies integration with existing controller designs and legacy systems.
Typical Applications
- Industrial Automation - This SDRAM provides reliable memory for PLCs, HMI panels, and industrial controllers where extended temperature tolerance ensures consistent operation in factory environments.
- Portable Electronics - The low voltage operation extends battery life in handheld devices, tablets, and portable test equipment while maintaining adequate memory capacity for application processing.
- Embedded Computing - Serves as main memory in single-board computers, embedded modules, and IoT gateways where the compact FBGA package and standard parallel interface enable straightforward system integration.
- Medical Devices - Supports diagnostic equipment and patient monitoring systems that require stable memory performance across varying environmental conditions.
- Automotive Infotainment - Provides working memory for dashboard displays and entertainment systems operating in the extended temperature range typical of automotive environments.
Unique Advantages
- Lower Power Consumption: 1.7V to 1.95V operation reduces energy requirements compared to 2.5V or 3.3V DRAM, extending battery runtime in portable applications and reducing thermal management needs.
- Proven SDRAM Technology: Standard parallel SDRAM interface allows designers to leverage existing controller IP and firmware, accelerating development and reducing integration risk.
- Industrial Temperature Rating: -40°C to 85°C qualification eliminates the need for thermal protection circuits in many industrial and automotive applications, simplifying system design.
- Space-Efficient Package: The compact 90-FBGA form factor frees up board area for additional features while the standardized footprint supports second-source flexibility.
- Active Lifecycle Status: Current production availability ensures long-term supply stability for products with extended lifecycles and reduces obsolescence risk.
- Fast Access Performance: 5.5ns access time and 166MHz operation support real-time processing requirements without system bottlenecks.
Why Choose AS4C16M32MSB-6BIN?
The AS4C16M32MSB-6BIN offers an optimal balance of capacity, performance, and power efficiency for embedded systems requiring reliable memory in challenging operating conditions. Its extended temperature rating and low voltage operation make it particularly suitable for industrial controls, portable instruments, and automotive applications where environmental stress and power budgets are critical design constraints.
For designs targeting long production lifecycles, this Active status DRAM from Alliance Memory provides supply continuity and the manufacturing quality assurance necessary for mission-critical applications.
Request a Quote
Contact our sales team to discuss your project requirements, volume pricing, and delivery options for the AS4C16M32MSB-6BIN. Our technical support specialists can assist with integration guidance and answer any questions about this mobile SDRAM solution.
