AS4C16M32MD1B-5BIN
| Part Description |
IC DRAM 512MBIT PARALLEL 90FBGA |
|---|---|
| Quantity | 1,455 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVCMOS | Memory Organization | 16M x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C16M32MD1B-5BIN - 512Mbit LPDDR1 SDRAM
The AS4C16M32MD1B-5BIN is a 512Mbit Low Power DDR1 SDRAM memory device from Alliance Memory, Inc. Organized as 16M x 32, this volatile memory chip leverages SDRAM DDR technology to deliver reliable performance in space-constrained applications. Designed for systems requiring extended temperature operation and low power consumption, this LPDDR1 solution is ideal for industrial, embedded, and portable electronics where power efficiency and environmental resilience are critical.
Key Features
- Memory Architecture - 512Mbit density organized as 16M x 32, providing flexible memory addressing for embedded system designs.
- DDR Technology - SDRAM DDR interface with 200MHz clock frequency and 5ns access time enables efficient data transfer for real-time applications.
- Low Power Operation - Operating voltage of 1.7V to 1.95V reduces power consumption compared to standard DDR solutions, extending battery life in portable devices.
- Extended Temperature Range - Rated for -40°C to 85°C (TA) operation, ensuring reliable performance in harsh industrial and automotive environments.
- Compact Package - 90-pin VFBGA package (8x13mm) maximizes board space efficiency for miniaturized product designs.
- LVCMOS Interface - Industry-standard LVCMOS signaling simplifies integration with common microcontrollers and processors.
Typical Applications
- Industrial Automation Systems - This LPDDR1 SDRAM provides reliable working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial gateways where extended temperature tolerance ensures consistent operation in factory floor environments.
- Embedded Computing Platforms - The 512Mbit capacity and compact FBGA footprint make this device suitable for single-board computers, edge computing nodes, and IoT gateways that require reliable volatile storage in space-limited enclosures.
- Portable Medical Devices - Low operating voltage and power efficiency support battery-powered diagnostic equipment and patient monitoring systems where extended runtime and thermal stability are essential.
- Network Infrastructure Equipment - The fast access time and DDR interface enable buffering and packet processing in routers, switches, and telecommunications equipment operating in temperature-variable environments.
- Automotive Infotainment and Telematics - Extended temperature rating supports in-vehicle systems such as navigation displays, rear-seat entertainment, and fleet management modules that must operate reliably across seasonal temperature extremes.
Unique Advantages
- Reduced Power Budget: The 1.7V to 1.95V operating range lowers system power consumption compared to standard 2.5V DDR solutions, reducing thermal management requirements and enabling longer battery life.
- Simplified Design Integration: Standard LVCMOS interface and FBGA packaging allow drop-in compatibility with a wide range of controllers and processors, accelerating time-to-market.
- Enhanced Environmental Resilience: -40°C to 85°C temperature specification ensures reliable operation in uncontrolled environments without requiring active thermal management.
- Space-Efficient Form Factor: The 90-ball FBGA package in an 8x13mm footprint minimizes PCB area, allowing for more compact product designs and reducing overall BOM costs.
- Active Product Lifecycle: Current active lifecycle status provides supply chain stability and long-term availability for production designs.
- Fast Data Access: 5ns access time and 200MHz clock frequency support real-time processing requirements in latency-sensitive applications.
Why Choose AS4C16M32MD1B-5BIN?
The AS4C16M32MD1B-5BIN offers an optimized balance of density, power efficiency, and environmental tolerance for embedded and industrial designs. Its LPDDR1 architecture addresses the needs of engineers developing battery-powered or thermally-challenging applications where standard DDR memory may not meet power or temperature requirements. The compact FBGA package and industry-standard interface reduce design complexity while the extended temperature range eliminates the need for additional thermal protection circuitry.
This memory device is particularly well-suited for designs targeting industrial control, portable instrumentation, and embedded computing markets where reliability, longevity, and power efficiency directly impact product competitiveness and total cost of ownership.
Get a Quote Today
Ready to integrate the AS4C16M32MD1B-5BIN into your next design? Contact our sales team to request pricing, delivery information, and technical support. Our component specialists can help you evaluate this LPDDR1 solution for your specific application requirements.
