AS4C2M32S-5TCNTR
| Part Description |
IC DRAM 64MBIT PAR 86TSOP II |
|---|---|
| Quantity | 1,899 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.5 ns | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C2M32S-5TCNTR – IC DRAM 64Mbit SDRAM, 86‑pin TSOP II
The AS4C2M32S-5TCNTR is a 64 Mbit synchronous DRAM (SDRAM) organized as 2M × 32 with an internal pipelined architecture and four internal banks. It provides fully synchronous, burst-oriented read and write operation with programmable modes to support a range of burst lengths and access patterns.
Designed for systems that require high memory bandwidth and deterministic synchronous operation, this device targets commercial-temperature applications operating at up to a 200 MHz clock frequency while operating from a single +3.3 V supply.
Key Features
- Memory Capacity & Organization 64 Mbit total capacity configured internally as quad 512K × 32-bit banks (2048 rows × 256 columns × 32 bits per bank).
- Performance Supports a 200 MHz clock rate with a maximum access time of 5.5 ns and selectable CAS latency of 2 or 3.
- Burst and Mode Flexibility Programmable burst lengths of 1, 2, 4, 8 or full page, burst type selectable as sequential or interleaved, and burst-stop and auto precharge options.
- Interface and Control Fully synchronous parallel interface with LVTTL signaling and individual byte control via DQM0–DQM3; supports burst-read and single-write modes.
- Refresh and Reliability Supports Auto Refresh and Self Refresh with 4096 refresh cycles/64 ms to maintain data integrity in volatile operation.
- Power and Voltage Single-supply operation at +3.3 V ±0.3 V (specified 3.0 V to 3.6 V).
- Package and Temperature 86-pin TSOP II (0.50 mm pitch) package with commercial operating temperature range 0 °C to 70 °C; part number suffix indicates Pb and Halogen Free when present.
Typical Applications
- High-bandwidth memory subsystems — For designs that require synchronous, burst-oriented DRAM access and predictable timing behavior.
- Communication and networking equipment — As a buffer or temporary data store where pipelined, banked access and refresh support are required.
- Embedded systems with parallel SDRAM interfaces — For commercial-temperature embedded designs that need a 64 Mbit SDRAM operating up to 200 MHz.
Unique Advantages
- Quad-bank, pipelined architecture: Enables concurrent bank operations and efficient burst transfers to maximize throughput for burst-oriented workloads.
- Programmable burst and mode options: Flexible burst lengths and CAS latency settings allow tuning for latency versus throughput trade-offs in system designs.
- Byte-level data masking: Individual DQM0–DQM3 control provides byte-wise write masking and data integrity control for partial-word operations.
- Synchronous LVTTL interface: All signals registered on clock edge for predictable timing and simple integration into synchronous system buses.
- Standard TSOP II package: 86-pin TSOP II footprint (0.50 mm pitch) simplifies board-level integration for compact commercial designs.
Why Choose AS4C2M32S-5TCNTR?
The AS4C2M32S-5TCNTR offers a compact, commercially rated SDRAM solution delivering 64 Mbit capacity with a 200 MHz synchronous interface and programmable burst behavior. Its quad-bank, pipelined architecture and byte-level control make it suitable for systems that need predictable, high-bandwidth memory transfers.
This device is appropriate for engineers building commercial-temperature embedded and communication systems that require a standard TSOP II package, +3.3 V single-supply operation, and flexible burst/mode configuration to match system timing and throughput requirements.
Request a quote or submit an RFQ to check availability and pricing for the AS4C2M32S-5TCNTR and to discuss lead times and volume options.