AS4C4M32SA-6TCNTR
| Part Description |
IC DRAM 128MBIT PAR 86TSOP II |
|---|---|
| Quantity | 272 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 86-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 86-TFSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 4M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B2A | HTS Code | 8542.32.0002 |
Overview of AS4C4M32SA-6TCNTR - 128Mbit Parallel SDRAM
The AS4C4M32SA-6TCNTR is a 128-megabit synchronous dynamic random access memory (SDRAM) device organized as 4M x 32. Built on SDRAM technology, this parallel interface memory solution delivers reliable, cost-effective volatile storage for embedded systems requiring moderate density and standard commercial temperature operation. With a 166MHz clock frequency and 5.4ns access time, this DRAM component provides the performance characteristics needed for data buffering, program execution, and general-purpose memory applications.
Key Features
- Memory Configuration - 128Mbit density organized as 4M x 32, offering a 32-bit wide data path ideal for systems requiring word-based access patterns and efficient bus utilization.
- SDRAM Architecture - Synchronous operation at up to 166MHz clock frequency with 5.4ns access time and 2ns write cycle time, delivering predictable timing for high-performance applications.
- Power Supply - 3V to 3.6V operating voltage compatible with standard 3.3V logic levels, simplifying integration into modern digital systems.
- Commercial Temperature Range - Operates from 0°C to 70°C, suitable for consumer electronics, computing peripherals, and office equipment environments.
- Package Format - 86-TSOP II package with 10.16mm width, providing a compact footprint for space-constrained PCB designs while maintaining standard TSOP pin compatibility.
- Parallel Interface - Traditional parallel memory bus interface enables direct connection to processors, FPGAs, and ASICs without additional protocol conversion circuitry.
Typical Applications
- Embedded Computing Systems - This SDRAM provides working memory for microcontroller and microprocessor-based systems where the 32-bit data width efficiently serves 32-bit CPU architectures common in embedded applications.
- Network Equipment - The 166MHz synchronous operation and 4M x 32 organization support packet buffering and data handling in routers, switches, and other networking devices operating at moderate data rates.
- Consumer Electronics - Suitable for set-top boxes, digital receivers, and multimedia devices that require temporary data storage for video buffering, program execution, and user interface operations within commercial temperature conditions.
- Office Equipment - Powers printers, copiers, and multi-function devices where the 128Mbit capacity handles document processing, image buffering, and controller firmware execution.
- Data Acquisition Systems - Provides sample buffering and temporary storage in test equipment and measurement instruments where synchronous operation ensures coordinated data capture at defined clock intervals.
Unique Advantages
- Standard SDRAM Compatibility: Industry-standard synchronous DRAM interface reduces development time by leveraging existing controller IP and proven software drivers.
- 32-bit Wide Data Path: Matches common processor bus widths to minimize read-modify-write cycles and improve memory throughput for 32-bit operations.
- Established Technology Node: Mature SDRAM technology offers stable supply, predictable pricing, and proven reliability for cost-sensitive volume production.
- Compact TSOP II Footprint: Space-efficient package reduces board real estate requirements while maintaining manufacturability with standard SMT assembly processes.
- Commercial Temperature Qualification: 0°C to 70°C rating provides adequate environmental tolerance for typical indoor applications without premium industrial-grade pricing.
- 166MHz Synchronous Operation: Clock-synchronized data transfers simplify timing design and enable deterministic memory access latency for real-time systems.
Why Choose AS4C4M32SA-6TCNTR?
The AS4C4M32SA-6TCNTR delivers proven parallel SDRAM technology in a density and organization optimized for embedded systems requiring straightforward memory expansion. Its 32-bit wide configuration aligns naturally with common processor architectures, while the 128Mbit capacity strikes a balance between functionality and cost for mid-range applications. Engineers benefit from mature SDRAM controller support across development toolchains and silicon platforms, accelerating time-to-market for products in consumer electronics, computing peripherals, and commercial equipment categories.
For designs where commercial temperature operation is sufficient and parallel memory interfaces remain practical, this component offers a reliable, cost-effective solution backed by Alliance Memory's focus on memory products. The standard TSOP II package ensures compatibility with established manufacturing processes and supports straightforward qualification for volume production.
Get a Quote
Contact our sales team to discuss your memory requirements and request pricing for the AS4C4M32SA-6TCNTR. Our technical support staff can assist with integration guidance, timing analysis, and volume availability to support your project timeline.