AS4C4M32S-7TCN

IC DRAM 128MBIT PAR 86TSOP II
Part Description

IC DRAM 128MBIT PAR 86TSOP II

Quantity 1,644 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package86-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.5 nsGradeCommercial
Clock Frequency143 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page2 nsPackaging86-TFSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C4M32S-7TCN - 128Mbit Parallel SDRAM

The AS4C4M32S-7TCN is a 128-megabit synchronous dynamic random access memory (SDRAM) device organized as 4M x 32 bits. This parallel interface SDRAM operates at clock frequencies up to 143MHz with a 5.5ns access time, providing reliable volatile memory for embedded systems and industrial computing applications. Designed for operation in the 0°C to 70°C commercial temperature range, this memory solution delivers dependable performance for systems requiring moderate-density parallel memory.

Key Features

  • Memory Architecture - 128-megabit capacity with 4M x 32-bit organization provides flexible addressing for 32-bit data bus systems.
  • SDRAM Technology - Synchronous operation at up to 143MHz clock frequency enables efficient data transfer synchronized with system clocks.
  • Fast Access Time - 5.5ns access time and 2ns write cycle time support responsive read and write operations for time-sensitive applications.
  • Power Supply - Operates on standard 3V to 3.6V supply voltage, compatible with common embedded system power rails.
  • Package - Available in 86-pin TSOP II (10.16mm width) surface-mount package for space-efficient PCB layouts.
  • Temperature Range - Commercial grade 0°C to 70°C operating range suits standard indoor and climate-controlled environments.

Typical Applications

  • Embedded Computing - This SDRAM provides main system memory for microprocessors and microcontrollers in embedded designs where 32-bit parallel interfaces are preferred over serial memory buses.
  • Industrial Control Systems - The commercial temperature range and parallel interface make this memory suitable for PLCs and industrial controllers operating in climate-controlled facilities.
  • Test and Measurement Equipment - Fast access times support data buffering and temporary storage in instruments that require quick data capture and processing cycles.
  • Legacy System Support - As an obsolete component, this SDRAM serves as a replacement part for maintaining and repairing existing systems designed with parallel SDRAM architecture.

Unique Advantages

  • Parallel Interface Compatibility: Direct drop-in solution for designs requiring 32-bit parallel SDRAM, eliminating the need for interface conversion logic.
  • Synchronized Operation: Clock-based synchronous design simplifies timing coordination with host processors and reduces timing margin complexity.
  • Moderate Density: 128Mbit capacity balances memory size with cost for applications that don't require high-density memory solutions.
  • Standard Voltage Operation: 3.3V supply compatibility integrates seamlessly with existing 3.3V logic systems without level shifting.
  • Established Technology: Mature SDRAM architecture offers well-understood design characteristics and predictable behavior for system integration.

Why Choose AS4C4M32S-7TCN?

The AS4C4M32S-7TCN serves designers maintaining or extending the lifespan of systems built around parallel SDRAM architectures. With its 4M x 32 organization and 143MHz operation, this memory provides a balance of capacity and performance for commercial-grade applications. The 86-pin TSOP II package offers a compact footprint for space-constrained designs.

Note that this component is marked as obsolete. For new designs, engineers should evaluate current-generation memory technologies. For existing systems requiring this specific part, this SDRAM enables continued operation and field repairs of deployed equipment.

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