AS4C8M32MSB-6BINTR
| Part Description |
IC DRAM 256MBIT PARALLEL 90FBGA |
|---|---|
| Quantity | 542 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 5 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-FBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 1.7V ~ 1.95V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 90-VFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of AS4C8M32MSB-6BINTR - 256Mbit Low Power SDRAM
The AS4C8M32MSB-6BINTR from Alliance Memory is a 256Mbit low power synchronous DRAM (SDRAM) organized as 8M x 32 bits. This mobile SDRAM delivers 166MHz clock frequency operation with 5.5ns access time, making it ideal for applications requiring high-speed memory with reduced power consumption. Operating from a low voltage supply of 1.7V to 1.95V, it offers significant power savings compared to standard SDRAM devices while maintaining high performance.
Designed for industrial and commercial applications, this parallel interface DRAM is packaged in a compact 90-FBGA (8x13mm) form factor suitable for space-constrained designs.
Key Features
- Memory Architecture - 256Mbit capacity organized as 8M x 32, providing flexible word-width access for 32-bit bus systems.
- High-Speed Performance - 166MHz clock frequency with 5.5ns access time and 15ns write cycle time for fast read/write operations.
- Low Power Operation - 1.7V to 1.95V supply voltage range significantly reduces power consumption compared to standard 3.3V SDRAM.
- Wide Temperature Range - -40°C to 85°C operating temperature ensures reliable operation in industrial environments.
- Compact Package - 90-pin VFBGA (8x13mm) footprint optimizes board space utilization.
- Parallel Interface - Standard SDRAM parallel interface provides compatibility with a wide range of processors and controllers.
Typical Applications
- Industrial Automation - This low power SDRAM provides reliable memory for PLCs, HMI panels, and industrial controllers where extended temperature tolerance ensures consistent operation in factory floor environments while low voltage operation reduces thermal management requirements.
- Networking Equipment - The high-speed 166MHz operation supports packet buffering and routing table storage in switches and routers, with low power consumption helping reduce overall system heat in densely populated rack-mount configurations.
- Medical Devices - The 8M x 32 organization efficiently handles data buffering for medical imaging, patient monitoring, and diagnostic equipment where reliable memory performance across industrial temperature ranges is essential.
- Test and Measurement Instruments - High-speed data capture and waveform storage benefit from the 5.5ns access time, while the compact FBGA package allows for multi-channel instrument designs with limited PCB area.
- Portable Devices - The 1.7V to 1.95V low voltage operation extends battery life in handheld terminals, portable data collectors, and field service equipment operating in industrial temperature conditions.
Unique Advantages
- Reduced Power Budget: Low voltage operation (1.7V-1.95V) cuts power consumption by approximately 40% compared to 3.3V SDRAM, reducing cooling requirements and extending battery life in portable applications.
- Industrial Temperature Reliability: -40°C to 85°C rating ensures stable memory performance across extreme environmental conditions without requiring specialized thermal management.
- Space-Efficient Design: 90-FBGA package in an 8x13mm footprint provides more than 30% board space savings compared to equivalent TSOP packages, enabling compact product designs.
- Fast Data Access: 5.5ns access time and 166MHz operation support demanding real-time applications and high-throughput data processing without bottlenecking system performance.
- 32-Bit Bus Compatibility: Native 8M x 32 organization matches common 32-bit processor architectures, simplifying interface design and reducing glue logic requirements.
- Active Lifecycle Status: Current production availability ensures long-term supply continuity for new designs and product lifecycle management.
Why Choose AS4C8M32MSB-6BINTR?
The AS4C8M32MSB-6BINTR combines low power consumption with industrial-grade reliability, making it an ideal choice for embedded systems requiring high-performance memory in challenging environments. Its compact FBGA package and wide temperature range support designs where space, power, and operating conditions are critical constraints. The 32-bit organization and parallel interface ensure straightforward integration with standard processor architectures.
This device is particularly well-suited for industrial control systems, networking infrastructure, and portable instrumentation where the combination of low voltage operation, extended temperature tolerance, and reliable performance delivers long-term value through reduced power consumption, simplified thermal design, and stable operation across demanding environmental conditions.
Contact Us for Pricing
For volume pricing, technical specifications, or application support for the AS4C8M32MSB-6BINTR, please contact our sales team. We offer expert guidance on memory selection and integration to help optimize your design.