AS4C8M16SB-6TIN

IC DRAM 128MBIT LVTTL 54TSOP II
Part Description

IC DRAM 128MBIT LVTTL 54TSOP II

Quantity 27 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package54-TSOP IIMemory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceLVTTLMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C8M16SB-6TIN - 128Mbit LVTTL SDRAM in 54-TSOP II Package

The AS4C8M16SB-6TIN is a 128-megabit synchronous dynamic RAM featuring an 8M x 16 memory organization with LVTTL interface. This SDRAM operates at 166 MHz with a 5 ns access time, providing reliable volatile memory storage for embedded systems and industrial applications requiring extended temperature operation from -40°C to 85°C.

Packaged in a 54-pin TSOP II format with 10.16mm width, this device offers straightforward integration into space-conscious PCB designs while maintaining compatibility with industry-standard SDRAM protocols and 3.3V power supplies.

Key Features

  • Memory Configuration - 128-megabit capacity organized as 8M x 16, providing flexible data access patterns for 16-bit bus architectures commonly used in microcontroller and processor systems.
  • SDRAM Technology - Synchronous dynamic random access memory with 166 MHz clock frequency and 5 ns access time, delivering predictable performance for timing-sensitive applications.
  • LVTTL Interface - Low-voltage TTL signaling ensures compatibility with standard 3.3V logic families, simplifying interface design and reducing level-shifting requirements.
  • Power Supply - Operates from 3V to 3.6V, accommodating typical 3.3V system rails with adequate voltage margin for industrial environments.
  • Write Cycle Performance - 12 ns write cycle time enables efficient data storage operations without introducing bottlenecks in write-intensive applications.
  • Package Format - 54-pin TSOP II package with 10.16mm body width provides a proven form factor with established PCB footprints and proven manufacturing reliability.
  • Extended Temperature Range - Rated for -40°C to 85°C ambient operation, supporting deployment in industrial control systems, automotive peripherals, and harsh-environment electronics.

Typical Applications

  • Industrial Automation - This SDRAM provides main memory for programmable logic controllers and human-machine interfaces where the extended temperature specification ensures reliable operation in factory floor environments with wide ambient temperature swings.
  • Embedded Computing Systems - The 128-megabit capacity and LVTTL interface make this device suitable for embedded processors and microcontroller systems requiring volatile working memory for data buffering, program execution, and temporary storage.
  • Telecommunications Equipment - The synchronous interface and predictable timing characteristics support packet buffering and protocol processing tasks in network switches, routers, and communication modules operating in temperature-controlled or semi-controlled environments.
  • Test and Measurement Instruments - The 166 MHz operation and 16-bit data path provide adequate bandwidth for waveform capture, data logging, and real-time processing in benchtop and portable instrumentation.
  • Medical Devices - The industrial temperature range and standard SDRAM protocol enable integration into diagnostic equipment and patient monitoring systems where moderate memory capacity and proven technology are preferred over cutting-edge specifications.

Unique Advantages

  • Established Technology Platform: SDRAM architecture offers mature drivers, well-documented timing specifications, and broad ecosystem support, reducing firmware development time and integration risk.
  • Straightforward PCB Integration: Standard 54-TSOP II footprint and LVTTL signaling eliminate the need for exotic PCB materials or complex termination schemes, keeping board costs down.
  • Wide Supply Voltage Tolerance: The 3V to 3.6V operating range accommodates voltage variations in industrial power systems without requiring precision regulation or additional monitoring circuitry.
  • Temperature-Hardened Operation: -40°C to 85°C rating supports outdoor enclosures, vehicle-mounted systems, and industrial cabinets without forced-air cooling or thermal management complexity.
  • Active Lifecycle Status: Current production availability ensures long-term supply security for designs requiring multi-year component sourcing and field service support.
  • Optimized Density: 128-megabit capacity hits the sweet spot for many embedded applications—large enough for substantial buffering and program storage, yet compact enough to minimize power consumption and cost per system.

Why Choose AS4C8M16SB-6TIN?

The AS4C8M16SB-6TIN addresses the requirements of industrial and embedded system designers who need dependable, temperature-tolerant memory without the complexity of newer memory technologies. Its combination of proven SDRAM architecture, extended temperature operation, and industry-standard packaging makes it particularly well-suited for cost-sensitive designs with moderate performance requirements and long product lifecycles.

For applications where reliability, supply continuity, and design simplicity matter more than bleeding-edge bandwidth or density, this SDRAM offers a balanced solution backed by Alliance Memory's focus on commodity memory products for industrial markets.

Get a Quote

Contact our sales team to discuss pricing, lead times, and volume availability for the AS4C8M16SB-6TIN. We can provide technical support, sample quantities, and guidance on integration into your specific application.

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