AS4C8M16SA-7BCNTR
| Part Description |
IC DRAM 128MBIT PAR 54TFBGA |
|---|---|
| Quantity | 1,056 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 143 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C8M16SA-7BCNTR - 128Mbit Synchronous DRAM
The AS4C8M16SA-7BCNTR is a 128Mbit synchronous DRAM (SDRAM) from Alliance Memory, Inc., organized as 8M x 16 with a parallel interface. Operating at clock frequencies up to 143MHz with a 5.4ns access time, this memory device delivers reliable performance for embedded systems, industrial controls, and consumer electronics that require moderate-density volatile memory storage.
This SDRAM is designed for commercial temperature applications (0°C to 70°C) and comes in a compact 54-TFBGA package, offering a practical balance between density, speed, and board space efficiency for cost-sensitive designs.
Key Features
- Memory Architecture - 128Mbit capacity organized as 8M x 16, providing flexible data width options for various system architectures. The parallel interface enables straightforward integration with microprocessors, FPGAs, and microcontrollers.
- Performance Specifications - Operates at clock frequencies up to 143MHz with 5.4ns access time and 14ns write cycle time, delivering sufficient bandwidth for typical embedded applications requiring burst read/write operations.
- Power Requirements - Standard 3V to 3.6V supply voltage ensures compatibility with common 3.3V system rails, simplifying power distribution design.
- Package Configuration - 54-pin TFBGA (8mm x 8mm) footprint minimizes PCB real estate while providing adequate pin count for the 16-bit data bus and control signals.
- Operating Temperature Range - Commercial temperature grade (0°C to 70°C) suits indoor equipment and controlled-environment applications.
Typical Applications
- Embedded Computing Systems - This SDRAM serves as main memory or frame buffer in embedded processors and single-board computers where 128Mbit capacity meets program and data storage requirements without excessive cost or power consumption.
- Consumer Electronics - Set-top boxes, digital TVs, and multimedia devices utilize this memory for video buffering and application data, benefiting from the parallel interface's straightforward integration with media processors.
- Industrial Control Equipment - HMI terminals, programmable logic controllers, and process control systems leverage this SDRAM for storing runtime variables and display data in factory automation environments operating within the commercial temperature range.
- Networking Equipment - Routers, switches, and gateway devices employ this memory for packet buffering and routing tables in moderate-throughput network infrastructure applications.
- Test and Measurement Instruments - Oscilloscopes, data loggers, and benchtop analyzers use this SDRAM for waveform capture and measurement data storage where the 143MHz clock speed supports real-time data acquisition requirements.
Unique Advantages
- Simplified BOM Management: Standard SDRAM architecture with widely-adopted pinout reduces procurement complexity and provides multiple sourcing options compared to proprietary memory solutions.
- Proven Technology Platform: SDRAM remains a mature, well-characterized technology with extensive software driver support and established design guidelines, accelerating development cycles.
- Compact Footprint: The 8mm x 8mm TFBGA package delivers higher density than larger-pitch packages, enabling space-constrained designs without migrating to more expensive memory technologies.
- Active Lifecycle Status: With Active status, this component provides availability assurance for new designs and ongoing production, reducing obsolescence risk for products with multi-year lifecycles.
- Standard Operating Voltage: 3.3V nominal supply eliminates the need for additional voltage regulators or level shifters in typical embedded systems, reducing power tree complexity.
- Cost-Effective Density: 128Mbit capacity hits a sweet spot for applications that have outgrown smaller memories but don't require the expense of higher-density devices, optimizing system cost.
Why Choose AS4C8M16SA-7BCNTR?
This SDRAM is ideal for commercial-grade designs requiring reliable, moderate-density volatile memory with parallel interface compatibility. Engineers developing cost-sensitive systems will appreciate the straightforward integration path, standard voltage requirements, and compact package options that minimize PCB space without compromising accessibility to proven memory technology.
The Active lifecycle status combined with Alliance Memory's focus on memory solutions provides design longevity for products expecting multi-year production runs in industrial controls, consumer electronics, and embedded computing markets.
Get Started
Contact our sales team to request detailed specifications, pricing information, or technical support for integrating the AS4C8M16SA-7BCNTR into your next design. Our applications engineers can assist with layout guidelines, timing analysis, and system-level optimization.