AS4C8M16SA-6TINTR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 1,385 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C8M16SA-6TINTR - 128Mbit Parallel SDRAM
The AS4C8M16SA-6TINTR from Alliance Memory is a 128Mbit synchronous DRAM organized as 8M x 16, delivering reliable parallel memory performance for embedded systems and industrial applications. With a 166MHz clock frequency and 5ns access time, this SDRAM provides fast data throughput in a compact 54-pin TSOP II package. Designed for extended temperature operation from -40°C to 85°C, it serves demanding environments where consistent memory performance is critical.
Key Features
- Memory Architecture - 128Mbit capacity organized as 8M x 16 provides flexible data access for word-oriented processors and controllers.
- High-Speed Performance - 166MHz clock frequency with 5ns access time and 12ns write cycle time enables rapid data operations for time-sensitive applications.
- Power Efficiency - Operates on standard 3V to 3.6V supply voltage, compatible with common embedded system power rails.
- Extended Temperature Range - Rated for -40°C to 85°C ambient operation, ensuring reliable performance in industrial and automotive-adjacent environments.
- Parallel Interface - Direct parallel memory interface simplifies integration with microcontrollers, DSPs, and FPGAs without requiring serial protocol overhead.
- Compact Package - 54-pin TSOP II package (10.16mm width) offers space-efficient board layout for dense designs.
Typical Applications
- Industrial Control Systems - This SDRAM provides working memory for PLCs and industrial controllers where the extended temperature range ensures reliable operation in factory floor environments and the parallel interface simplifies integration with legacy control architectures.
- Embedded Computing - The 128Mbit capacity serves as main memory or frame buffer for embedded processors in medical devices, test equipment, and instrumentation where moderate memory density meets compact form factor requirements.
- Telecommunications Equipment - Buffering and packet processing in routers, switches, and base station equipment benefit from the fast access times and synchronous operation that align with network timing requirements.
- Consumer Electronics - Set-top boxes, gaming peripherals, and multimedia devices utilize this SDRAM for temporary data storage where cost-effective volatile memory with adequate speed is needed.
- Data Acquisition Systems - High-speed sampling and signal processing applications leverage the fast write cycle time to capture and buffer sensor data before processing or transmission.
Unique Advantages
- Proven SDRAM Technology: Mature synchronous DRAM architecture offers predictable timing characteristics and broad ecosystem support, reducing design risk and accelerating time-to-market.
- Industrial Temperature Qualification: -40°C to 85°C operation extends product lifespan in harsh environments without requiring expensive military-grade components.
- Simplified BOM Management: Standard parallel interface and common voltage levels minimize supporting component count and allow reuse of existing memory subsystem designs.
- Active Lifecycle Status: Current production availability from Alliance Memory ensures long-term supply continuity for multi-year product programs.
- Drop-In Compatibility: Standard SDRAM pinout and timing specifications enable straightforward migration from other 128Mbit SDRAM devices with minimal board redesign.
- Cost-Effective Capacity: 128Mbit density balances sufficient working memory for embedded applications while maintaining competitive pricing for moderate-volume production.
Why Choose AS4C8M16SA-6TINTR?
The AS4C8M16SA-6TINTR is an ideal memory solution for embedded and industrial designs requiring reliable, cost-effective volatile storage with extended temperature capability. Its 8M x 16 organization aligns well with 16-bit processor architectures, while the 166MHz speed and 5ns access support real-time control and data processing tasks. The TSOP II package provides a proven, space-efficient footprint for existing board layouts.
This SDRAM is particularly well-suited for applications where design stability and long-term availability matter as much as technical specifications. With active production status and industrial temperature ratings, the AS4C8M16SA-6TINTR supports products with extended service lifecycles in manufacturing, transportation, and infrastructure sectors.
Get Started Today
Contact our sales team to discuss your memory requirements and request a quote for the AS4C8M16SA-6TINTR. Our technical specialists can provide application guidance, reference designs, and volume pricing to support your project from prototype to production.