AS4C8M16SA-6TANTR
| Part Description |
IC DRAM 128MBIT PAR 54TSOP II |
|---|---|
| Quantity | 730 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Automotive | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | AEC-Q100 | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C8M16SA-6TANTR - Automotive-Grade 128Mbit SDRAM
The AS4C8M16SA-6TANTR from Alliance Memory, Inc. is a 128-megabit synchronous dynamic random access memory (SDRAM) organized as 8M x 16 bits. Built on proven SDRAM technology and qualified to AEC-Q100 automotive standards, this parallel-interface memory operates across an extended temperature range of -40°C to 105°C. With a 166MHz clock frequency and 5ns access time, it delivers reliable performance for automotive and industrial applications requiring robust memory solutions.
Key Features
- Memory Architecture: 128Mbit capacity organized as 8M x 16-bit configuration, providing flexible data access for embedded systems requiring word-level parallel memory operations.
- Performance Specifications: Operates at 166MHz clock frequency with 5ns access time and 12ns write cycle time, ensuring fast read/write operations for time-sensitive applications.
- Automotive Qualification: AEC-Q100 qualified for automotive-grade reliability, meeting stringent quality and durability requirements for vehicle electronics.
- Extended Temperature Range: Operates reliably from -40°C to 105°C, suitable for harsh environmental conditions in automotive and industrial settings.
- Power Supply: Operates on 3V to 3.6V supply voltage, compatible with standard 3.3V systems and low-power designs.
- Package Format: Available in 54-pin TSOP II package with 10.16mm width, offering space-efficient footprint for PCB layouts.
Typical Applications
- Automotive Infotainment Systems: Provides high-speed buffering and data storage for in-vehicle displays, navigation systems, and multimedia processors where AEC-Q100 qualification ensures reliability in temperature extremes and vibration.
- Advanced Driver Assistance Systems (ADAS): Serves as working memory for image processing, sensor fusion algorithms, and real-time decision-making modules where fast access times support critical safety functions.
- Industrial Control Systems: Delivers reliable memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and factory automation equipment where extended temperature operation maintains performance in harsh manufacturing environments.
- Automotive Body Electronics: Supports memory requirements for instrument clusters, body control modules, and gateway controllers where automotive-grade qualification ensures long-term durability.
- Rugged Computing Platforms: Functions as system memory or frame buffer in embedded computing systems deployed in outdoor, transportation, or industrial settings requiring extended temperature tolerance.
Unique Advantages
- Automotive-Grade Reliability: AEC-Q100 qualification reduces risk in vehicle designs and meets OEM supply chain requirements for automotive components.
- Extended Operating Range: -40°C to 105°C temperature tolerance eliminates the need for additional thermal management in many harsh-environment applications, simplifying system design.
- Proven SDRAM Technology: Mature synchronous DRAM architecture offers predictable performance characteristics and broad ecosystem support compared to emerging memory technologies.
- Parallel Interface Compatibility: Direct connection to processors and controllers with parallel memory buses eliminates conversion circuitry and reduces BOM complexity.
- Standard Voltage Operation: 3.3V supply voltage aligns with common system power rails, avoiding the need for dedicated voltage regulators or level shifters.
- Space-Efficient Packaging: TSOP II form factor provides high pin density in a compact footprint, optimizing board space utilization in space-constrained designs.
Why Choose AS4C8M16SA-6TANTR?
The AS4C8M16SA-6TANTR is positioned as a dependable memory solution for automotive and industrial designs where reliability, temperature tolerance, and proven technology are paramount. Design engineers working on vehicle electronics, harsh-environment controllers, or ruggedized embedded systems will find this SDRAM meets automotive qualification standards while delivering the performance characteristics required for real-time processing and data buffering. Its extended temperature range and AEC-Q100 certification make it particularly well-suited for applications where component failure is not an option.
By selecting an automotive-qualified memory component from a dedicated memory manufacturer, design teams gain long-term supply confidence and technical support for mission-critical applications. The AS4C8M16SA-6TANTR provides a balance of capacity, speed, and environmental resilience that reduces system-level risk in demanding deployment scenarios.
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