AS4C8M16SA-6BIN

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 639 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C8M16SA-6BIN - 128Mbit SDRAM in Compact TFBGA Package

The AS4C8M16SA-6BIN is a 128Mbit synchronous DRAM (SDRAM) from Alliance Memory, organized as 8M x 16 bits. This parallel-interface memory device operates at clock frequencies up to 166MHz with 5ns access time, making it suitable for embedded systems requiring reliable, high-speed volatile memory.

Designed for industrial temperature ranges from -40°C to 85°C, this SDRAM delivers consistent performance across demanding operating environments while maintaining a compact 54-TFBGA footprint.

Key Features

  • Memory Configuration - 128Mbit capacity organized as 8M x 16, providing efficient data bus utilization for 16-bit system architectures.
  • High-Speed Performance - 166MHz clock frequency with 5ns access time and 12ns write cycle time enables responsive memory operations for real-time applications.
  • Extended Temperature Range - Full industrial operating range of -40°C to 85°C ensures reliable operation in harsh environmental conditions.
  • Parallel Interface - Standard parallel DRAM interface simplifies integration with existing memory controllers and processor systems.
  • Compact Package - 54-TFBGA (8x8mm) package minimizes board space while providing excellent thermal characteristics.
  • Flexible Power Supply - Operates from 3V to 3.6V supply voltage, compatible with standard 3.3V system rails.

Typical Applications

  • Industrial Automation - This SDRAM provides reliable working memory for PLCs, HMI displays, and factory automation equipment where the extended temperature range ensures consistent operation in manufacturing environments.
  • Embedded Computing - The 8M x 16 organization and parallel interface make this device well-suited for embedded processors requiring fast, direct memory access for system code and data storage.
  • Telecommunications Equipment - Network infrastructure devices benefit from the high-speed 166MHz operation for packet buffering and protocol processing tasks.
  • Medical Devices - Portable and benchtop medical instruments utilize this memory for data acquisition and processing where reliability across temperature variations is essential.

Unique Advantages

  • Industrial-Grade Reliability: The -40°C to 85°C operating range eliminates the need for additional thermal management in demanding environments.
  • Space-Efficient Design: The compact 8x8mm TFBGA package enables higher board density compared to larger memory packages.
  • Simplified Integration: Standard SDRAM interface and 3.3V operation ensure compatibility with common memory controllers and power architectures.
  • Fast Access Times: 5ns access time supports demanding real-time processing requirements without system bottlenecks.
  • Active Lifecycle Status: Current production status ensures long-term availability for product designs requiring sustained supply.

Why Choose AS4C8M16SA-6BIN?

The AS4C8M16SA-6BIN represents a robust memory solution for designs requiring industrial-grade reliability in a space-constrained form factor. Its combination of 128Mbit density, 166MHz performance, and extended temperature operation makes it an excellent choice for embedded systems, industrial controllers, and telecommunications equipment.

Engineers designing products for harsh environments will appreciate the full industrial temperature support, while the compact TFBGA package and standard parallel interface streamline board layout and system integration.

Call to Action

Contact our sales team to discuss your memory requirements and request a quote for the AS4C8M16SA-6BIN. Our technical specialists can assist with design-in support and volume pricing for your application.

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