AS4C8M16SA-6BINTR

IC DRAM 128MBIT PAR 54TFBGA
Part Description

IC DRAM 128MBIT PAR 54TFBGA

Quantity 527 Available (as of May 6, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page12 nsPackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C8M16SA-6BINTR – IC DRAM 128 Mbit, 54-TFBGA

The AS4C8M16SA-6BINTR is a volatile SDRAM device providing 128 Mbit of memory organized as 8M × 16 with a parallel memory interface. It delivers a clock frequency of 166 MHz and a 5 ns access time for systems that require synchronous DRAM performance in a compact package.

Offered in a 54-TFBGA (8×8) package with a supply voltage range of 3.0 V to 3.6 V and an operating temperature range of -40°C to 85°C, this device addresses designs that need moderate-density SDRAM with defined timing and environmental specifications.

Key Features

  • Memory Core 128 Mbit DRAM organized as 8M × 16, providing parallel data access appropriate for synchronous DRAM implementations.
  • Performance 166 MHz clock frequency and 5 ns access time enable synchronous operation with 12 ns write cycle time (word/page) for predictable timing behavior.
  • Interface Parallel memory interface for direct integration into parallel SDRAM controller architectures.
  • Power Supply voltage range of 3.0 V to 3.6 V to match common 3 V SDRAM system rails.
  • Package 54-TFBGA (8×8) package offering a compact footprint for space-constrained board designs.
  • Environmental Range Operating temperature from -40°C to 85°C (TA) for deployments across a wide ambient temperature span.

Unique Advantages

  • Defined SDRAM capacity: 128 Mbit organized as 8M × 16 provides a clear density option for system memory budgeting and address mapping.
  • Synchronous timing characteristics: 166 MHz clock and 5 ns access time with 12 ns write cycle time enable deterministic memory timing in synchronous designs.
  • Wide voltage compatibility: 3.0 V to 3.6 V supply range facilitates integration with common 3 V system power rails.
  • Compact package footprint: 54-TFBGA (8×8) packaging reduces board space while maintaining BGA reliability characteristics.
  • Extended ambient range: −40°C to 85°C operating temperature supports applications requiring broader temperature tolerance.

Why Choose AS4C8M16SA-6BINTR?

The AS4C8M16SA-6BINTR positions itself as a straightforward SDRAM option where a 128 Mbit parallel-access memory with defined synchronous timing is required. Its combination of 166 MHz clocking, 5 ns access time, and compact 54-TFBGA package makes it suitable for designs that need predictable SDRAM performance in a space-efficient form factor.

With a 3.0 V–3.6 V supply window and an operating temperature range of −40°C to 85°C, the device provides electrical and environmental headroom for a range of system conditions, supporting longer-term reliability and consistent behavior across specified operating conditions.

Request a quote or contact sales to obtain pricing, availability, and lead-time information for the AS4C8M16SA-6BINTR.

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