AS4C8M16SA-6BINTR
| Part Description |
IC DRAM 128MBIT PAR 54TFBGA |
|---|---|
| Quantity | 527 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TFBGA (8x8) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 12 ns | Packaging | 54-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of AS4C8M16SA-6BINTR – IC DRAM 128 Mbit, 54-TFBGA
The AS4C8M16SA-6BINTR is a volatile SDRAM device providing 128 Mbit of memory organized as 8M × 16 with a parallel memory interface. It delivers a clock frequency of 166 MHz and a 5 ns access time for systems that require synchronous DRAM performance in a compact package.
Offered in a 54-TFBGA (8×8) package with a supply voltage range of 3.0 V to 3.6 V and an operating temperature range of -40°C to 85°C, this device addresses designs that need moderate-density SDRAM with defined timing and environmental specifications.
Key Features
- Memory Core 128 Mbit DRAM organized as 8M × 16, providing parallel data access appropriate for synchronous DRAM implementations.
- Performance 166 MHz clock frequency and 5 ns access time enable synchronous operation with 12 ns write cycle time (word/page) for predictable timing behavior.
- Interface Parallel memory interface for direct integration into parallel SDRAM controller architectures.
- Power Supply voltage range of 3.0 V to 3.6 V to match common 3 V SDRAM system rails.
- Package 54-TFBGA (8×8) package offering a compact footprint for space-constrained board designs.
- Environmental Range Operating temperature from -40°C to 85°C (TA) for deployments across a wide ambient temperature span.
Unique Advantages
- Defined SDRAM capacity: 128 Mbit organized as 8M × 16 provides a clear density option for system memory budgeting and address mapping.
- Synchronous timing characteristics: 166 MHz clock and 5 ns access time with 12 ns write cycle time enable deterministic memory timing in synchronous designs.
- Wide voltage compatibility: 3.0 V to 3.6 V supply range facilitates integration with common 3 V system power rails.
- Compact package footprint: 54-TFBGA (8×8) packaging reduces board space while maintaining BGA reliability characteristics.
- Extended ambient range: −40°C to 85°C operating temperature supports applications requiring broader temperature tolerance.
Why Choose AS4C8M16SA-6BINTR?
The AS4C8M16SA-6BINTR positions itself as a straightforward SDRAM option where a 128 Mbit parallel-access memory with defined synchronous timing is required. Its combination of 166 MHz clocking, 5 ns access time, and compact 54-TFBGA package makes it suitable for designs that need predictable SDRAM performance in a space-efficient form factor.
With a 3.0 V–3.6 V supply window and an operating temperature range of −40°C to 85°C, the device provides electrical and environmental headroom for a range of system conditions, supporting longer-term reliability and consistent behavior across specified operating conditions.
Request a quote or contact sales to obtain pricing, availability, and lead-time information for the AS4C8M16SA-6BINTR.