AS4C8M32SA-6BIN
| Part Description |
IC DRAM 256MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,061 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 2 ns | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of AS4C8M32SA-6BIN - 256Mbit SDRAM in 90-Pin TFBGA Package
The AS4C8M32SA-6BIN is a 256Mbit Synchronous Dynamic RAM (SDRAM) from Alliance Memory configured as 8M x 32-bit words. Built on proven SDRAM technology, this device operates at clock frequencies up to 166MHz with a fast 5ns access time. It is designed for embedded systems, industrial equipment, and networking applications where parallel memory interface, extended temperature range, and compact footprint are essential requirements.
Key Features
- Memory Core - 256Mbit capacity organized as 8M x 32-bit words, providing efficient data storage for 32-bit processors and controllers.
- Performance - Operates at 166MHz clock frequency with 5ns access time and 2ns write cycle time for responsive system performance.
- Power Supply - 3V to 3.6V operation compatible with standard 3.3V logic systems, simplifying power distribution design.
- Interface - Parallel interface with synchronous clocking for straightforward integration with processors, FPGAs, and ASICs.
- Operating Temperature - Industrial temperature range of -40°C to 85°C supports deployment in harsh environmental conditions.
- Package - 90-pin TFBGA (8mm x 13mm) provides space-efficient board layout with minimal PCB footprint.
Typical Applications
- Industrial Automation - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature tolerance ensures reliable operation in factory floor environments with temperature fluctuations.
- Embedded Computing Systems - The 32-bit organization matches processor bus widths in embedded designs, reducing glue logic and enabling efficient memory subsystem implementation for data buffering and program execution.
- Networking Equipment - Serves as packet buffer memory in routers, switches, and communication devices where the synchronous interface synchronizes with system clocks for deterministic data handling.
- Test and Measurement Instruments - Provides data acquisition buffering in oscilloscopes and analyzers where fast access times support high-speed sampling and the industrial temperature range ensures measurement accuracy across operating conditions.
- Medical Devices - Functions as system memory in diagnostic equipment and patient monitors where reliability and stable operation over temperature are critical for consistent device performance.
Unique Advantages
- Industrial Temperature Qualification: The -40°C to 85°C range eliminates the need for additional thermal management in many industrial environments, reducing system cost and complexity.
- 32-Bit Native Organization: Direct alignment with 32-bit processors minimizes interface logic and board routing, simplifying PCB design and reducing component count.
- Compact TFBGA Footprint: The 8mm x 13mm package conserves valuable board space in space-constrained embedded designs while maintaining reliable ball-grid-array connectivity.
- Standard 3.3V Operation: Compatibility with common 3.3V logic families eliminates voltage level translation, reducing power supply requirements and improving signal integrity.
- Proven SDRAM Technology: Mature synchronous DRAM architecture provides predictable timing characteristics and well-established design support, accelerating development cycles.
- Alliance Memory Support: Backed by a manufacturer focused on long-term availability for industrial and embedded markets, reducing obsolescence risk in long lifecycle products.
Why Choose AS4C8M32SA-6BIN?
The AS4C8M32SA-6BIN is positioned for embedded and industrial designs requiring reliable parallel memory with extended temperature operation. Its 32-bit organization provides an efficient match for modern embedded processors, while the 166MHz operating frequency and 5ns access support real-time processing requirements. The compact TFBGA package and industrial temperature range make this device particularly suitable for space-constrained applications deployed in challenging environmental conditions.
For design engineers working on long-lifecycle products, the AS4C8M32SA-6BIN offers a balance of proven technology, industrial-grade specifications, and long-term availability support that reduces risk in production systems expected to operate for years in the field.
Get Started
Contact our sales team to request a quote for the AS4C8M32SA-6BIN or to discuss your specific memory requirements. Our technical support can assist with integration guidance, timing analysis, and sample requests to help accelerate your design process.