AS4C8M32SA-6BIN

IC DRAM 256MBIT PAR 90TFBGA
Part Description

IC DRAM 256MBIT PAR 90TFBGA

Quantity 1,061 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package90-TFBGA (8x13)Memory FormatDRAMTechnologySDRAM
Memory Size256 MbitAccess Time5 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page2 nsPackaging90-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization8M x 32
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0024

Overview of AS4C8M32SA-6BIN - 256Mbit SDRAM in 90-Pin TFBGA Package

The AS4C8M32SA-6BIN is a 256Mbit Synchronous Dynamic RAM (SDRAM) from Alliance Memory configured as 8M x 32-bit words. Built on proven SDRAM technology, this device operates at clock frequencies up to 166MHz with a fast 5ns access time. It is designed for embedded systems, industrial equipment, and networking applications where parallel memory interface, extended temperature range, and compact footprint are essential requirements.

Key Features

  • Memory Core - 256Mbit capacity organized as 8M x 32-bit words, providing efficient data storage for 32-bit processors and controllers.
  • Performance - Operates at 166MHz clock frequency with 5ns access time and 2ns write cycle time for responsive system performance.
  • Power Supply - 3V to 3.6V operation compatible with standard 3.3V logic systems, simplifying power distribution design.
  • Interface - Parallel interface with synchronous clocking for straightforward integration with processors, FPGAs, and ASICs.
  • Operating Temperature - Industrial temperature range of -40°C to 85°C supports deployment in harsh environmental conditions.
  • Package - 90-pin TFBGA (8mm x 13mm) provides space-efficient board layout with minimal PCB footprint.

Typical Applications

  • Industrial Automation - This SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where the extended temperature tolerance ensures reliable operation in factory floor environments with temperature fluctuations.
  • Embedded Computing Systems - The 32-bit organization matches processor bus widths in embedded designs, reducing glue logic and enabling efficient memory subsystem implementation for data buffering and program execution.
  • Networking Equipment - Serves as packet buffer memory in routers, switches, and communication devices where the synchronous interface synchronizes with system clocks for deterministic data handling.
  • Test and Measurement Instruments - Provides data acquisition buffering in oscilloscopes and analyzers where fast access times support high-speed sampling and the industrial temperature range ensures measurement accuracy across operating conditions.
  • Medical Devices - Functions as system memory in diagnostic equipment and patient monitors where reliability and stable operation over temperature are critical for consistent device performance.

Unique Advantages

  • Industrial Temperature Qualification: The -40°C to 85°C range eliminates the need for additional thermal management in many industrial environments, reducing system cost and complexity.
  • 32-Bit Native Organization: Direct alignment with 32-bit processors minimizes interface logic and board routing, simplifying PCB design and reducing component count.
  • Compact TFBGA Footprint: The 8mm x 13mm package conserves valuable board space in space-constrained embedded designs while maintaining reliable ball-grid-array connectivity.
  • Standard 3.3V Operation: Compatibility with common 3.3V logic families eliminates voltage level translation, reducing power supply requirements and improving signal integrity.
  • Proven SDRAM Technology: Mature synchronous DRAM architecture provides predictable timing characteristics and well-established design support, accelerating development cycles.
  • Alliance Memory Support: Backed by a manufacturer focused on long-term availability for industrial and embedded markets, reducing obsolescence risk in long lifecycle products.

Why Choose AS4C8M32SA-6BIN?

The AS4C8M32SA-6BIN is positioned for embedded and industrial designs requiring reliable parallel memory with extended temperature operation. Its 32-bit organization provides an efficient match for modern embedded processors, while the 166MHz operating frequency and 5ns access support real-time processing requirements. The compact TFBGA package and industrial temperature range make this device particularly suitable for space-constrained applications deployed in challenging environmental conditions.

For design engineers working on long-lifecycle products, the AS4C8M32SA-6BIN offers a balance of proven technology, industrial-grade specifications, and long-term availability support that reduces risk in production systems expected to operate for years in the field.

Get Started

Contact our sales team to request a quote for the AS4C8M32SA-6BIN or to discuss your specific memory requirements. Our technical support can assist with integration guidance, timing analysis, and sample requests to help accelerate your design process.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up