ASFC32G31T3-51BIN
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 1,108 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 4 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of ASFC32G31T3-51BIN - 256Gbit eMMC NAND Flash Memory
The Alliance Memory ASFC32G31T3-51BIN is a high-density embedded MultiMediaCard (eMMC) flash memory device built on TLC NAND technology. With a 256Gbit (32GB) capacity in a compact 153-FBGA package, this eMMC 5.1-compliant device delivers reliable non-volatile storage for embedded systems requiring substantial memory in space-constrained designs.
Organized as 32G x 8, this flash memory operates across an extended temperature range of -40°C to 85°C, making it suitable for industrial and commercial applications where environmental resilience is essential.
Key Features
- High-Density Storage - 256Gbit (32GB) capacity using TLC NAND technology provides ample non-volatile storage for operating systems, application data, and firmware in embedded designs.
- eMMC 5.1 Interface - Industry-standard eMMC 5.1 interface ensures broad compatibility with modern embedded processors and simplifies system integration with a well-documented command set.
- 200MHz Clock Frequency - High-speed 200MHz clock enables fast data transfer rates for demanding read and write operations in performance-sensitive applications.
- Wide Operating Voltage - 2.7V to 3.6V supply voltage range accommodates various power supply configurations and provides flexibility in system power architecture.
- Extended Temperature Range - Full operation from -40°C to 85°C supports deployment in industrial environments where temperature extremes are common.
- Compact 153-FBGA Package - The 11.5mm x 13mm fine-pitch BGA footprint enables high-density PCB layouts while maintaining thermal performance.
Typical Applications
- Industrial Control Systems - This eMMC provides reliable boot and data storage for PLCs, HMIs, and industrial computers where the extended temperature range ensures consistent operation in factory floor environments.
- Point-of-Sale Terminals - The high-density storage capacity supports full operating systems and transaction logging in retail POS systems, while the eMMC interface simplifies integration with common embedded processors.
- Network Equipment - Routers, switches, and network appliances benefit from the fast 200MHz interface for firmware storage and configuration data, with reliable operation across varying ambient conditions.
- Medical Devices - Portable and stationary medical equipment requiring substantial non-volatile storage for software and patient data logging can leverage the wide temperature tolerance and compact form factor.
- Smart Building Systems - Building automation controllers and IoT gateways utilize this eMMC for embedded Linux or RTOS storage, with the extended temperature range supporting installation in equipment rooms and outdoor enclosures.
Unique Advantages
- Simplified Board Design: The eMMC 5.1 interface eliminates the need for external NAND controllers, reducing BOM complexity and PCB routing requirements compared to raw NAND solutions.
- Built-in Wear Leveling: Integrated flash management handles wear leveling and bad block management internally, reducing software development effort and improving long-term reliability.
- Industrial Temperature Support: The -40°C to 85°C operating range enables a single part number to cover both commercial and industrial temperature requirements, simplifying inventory management.
- High-Speed Performance: 200MHz clock frequency delivers the bandwidth needed for modern embedded operating systems and applications without becoming a system bottleneck.
- Proven TLC Technology: Triple-level cell NAND provides an optimal balance of storage density and cost-effectiveness for applications with moderate write endurance requirements.
Why Choose ASFC32G31T3-51BIN?
The Alliance Memory ASFC32G31T3-51BIN offers embedded system designers a compelling combination of storage density, interface simplicity, and environmental resilience. With 32GB of eMMC 5.1 storage in a standard 153-FBGA package, this device integrates seamlessly into designs targeting industrial, commercial, and IoT applications.
For teams seeking a reliable, high-capacity embedded storage solution with extended temperature capability and a proven interface standard, the ASFC32G31T3-51BIN delivers the specifications and quality expected from Alliance Memory.
Call to Action
Contact our sales team to request a quote for the ASFC32G31T3-51BIN or to discuss your embedded memory requirements. Technical documentation and support are available to help you integrate this eMMC solution into your next design.
