ASFC32G31T3-51BINTR
| Part Description |
IC FLASH 256GBIT EMMC 153FBGA |
|---|---|
| Quantity | 673 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Alliance Memory, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 4 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-FBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of ASFC32G31T3-51BINTR - 256Gbit eMMC Flash Memory
The Alliance Memory ASFC32G31T3-51BINTR is a high-capacity 256Gbit (32GB) embedded MultiMediaCard (eMMC) flash memory device featuring TLC NAND technology. With its eMMC 5.1 interface and 200MHz clock frequency, this memory IC delivers reliable embedded storage for applications requiring substantial non-volatile memory in a compact form factor.
Organized as 32G x 8, this device provides a streamlined storage solution for embedded systems, consumer electronics, and industrial applications where space efficiency and data integrity are essential.
Key Features
- High-Density Storage - 256Gbit (32GB) capacity using TLC NAND flash technology provides substantial storage in a single package, reducing board space requirements.
- eMMC 5.1 Interface - Industry-standard embedded multimedia card interface ensures broad compatibility with host controllers and simplified system integration.
- 200MHz Clock Frequency - High-speed operation enables efficient data transfers for demanding embedded applications.
- Extended Temperature Range - Operating range of -40°C to 85°C (TA) supports deployment in challenging thermal environments.
- Flexible Power Supply - 2.7V to 3.6V supply voltage range accommodates various system power architectures.
- Compact Package - 153-TFBGA (11.5x13mm) footprint enables high-density PCB layouts in space-constrained designs.
Typical Applications
- Industrial Control Systems - This eMMC provides robust embedded storage for PLCs, HMIs, and industrial computers where the extended temperature range ensures reliable operation in factory and outdoor environments.
- Consumer Electronics - Smartphones, tablets, and set-top boxes benefit from the high-density storage and eMMC 5.1 interface for fast boot times and application loading.
- Embedded Computing - Single-board computers and embedded PCs utilize this device for OS storage and data logging, with the compact FBGA package enabling slim form factor designs.
- IoT Gateways - Edge computing devices leverage the 32GB capacity for local data buffering and firmware storage in connected industrial and smart building applications.
Unique Advantages
- Simplified Design Integration: The eMMC 5.1 interface eliminates the need for external NAND controllers, reducing component count and design complexity.
- Thermal Reliability: Wide operating temperature range from -40°C to 85°C ensures consistent performance across industrial and commercial environments.
- Space-Efficient Solution: 153-FBGA package delivers 32GB storage capacity in an 11.5x13mm footprint, maximizing board real estate.
- Flexible Power Architecture: 2.7V to 3.6V supply compatibility allows integration into diverse power supply topologies without additional regulation.
- TLC NAND Technology: Triple-level cell architecture balances storage density with cost efficiency for mainstream embedded storage requirements.
Why Choose ASFC32G31T3-51BINTR?
The Alliance Memory ASFC32G31T3-51BINTR offers an optimal balance of storage capacity, interface speed, and environmental resilience for embedded system designers. Its eMMC 5.1 interface provides a well-established, widely-supported standard that simplifies hardware and software development while the extended temperature rating addresses industrial deployment requirements.
For designs requiring reliable non-volatile storage with straightforward integration, this 32GB eMMC device delivers proven TLC NAND technology in a compact, industry-standard package suitable for volume production.
Get Started
Contact our sales team to discuss your embedded storage requirements and request a quote for the ASFC32G31T3-51BINTR. Our technical support engineers can assist with integration guidance and provide samples for evaluation.
