ASFC64G31T5-51BIN

The ASFC64G31T5-51BIN from Alliance Memory is a high-capacity 512Gbit eMMC 5.1 NAND flash memory solution designed for embedded systems requiring substantial non-volatile storage. Built with TLC (Triple-Level Cell) NAND technology and organized as 64G x 8, this device delivers reliable data retention and fast access speeds through its eMMC 5.1 interface operating at up to 200MHz. The ASFC64G31T5-51BIN is ideal for applications in industrial computing, automotive infotainment, consumer electronics, and IoT gateways where high-density storage and embedded integration are essential.

This flash memory device combines high storage density with the convenience of an integrated controller, simplifying system design and reducing BOM costs by eliminating the need for external NAND controllers. With industrial-grade temperature tolerance and a compact 153-FBGA package, it provides engineers with a robust, space-efficient storage solution for demanding embedded applications.

Key Features

• High-Density Storage - 512Gbit (64GB) capacity provides ample space for operating systems, applications, data logging, and multimedia content in embedded systems.
• eMMC 5.1 Interface - Industry-standard embedded MultiMediaCard interface with clock frequencies up to 200MHz enables fast sequential read and write operations while simplifying integration with host processors.
• TLC NAND Technology - Triple-Level Cell NAND flash architecture delivers cost-effective storage with balanced performance and endurance characteristics suitable for consumer and industrial applications.
• Memory Organization - 64G x 8 bit architecture provides flexible addressing and efficient data management through the integrated controller.
• Industrial Temperature Range - Operating temperature range of -40°C to 85°C ensures reliable performance in harsh industrial and automotive environments where ambient temperatures vary significantly.
• Compact Package - 153-FBGA (11.5mm x 13mm) footprint maximizes board space efficiency, enabling high-density designs in space-constrained applications.
• Wide Voltage Supply Range - 2.7V to 3.6V operating voltage supports compatibility with standard 3.3V and emerging lower-voltage system architectures.

Typical Applications

• Industrial Computing - The ASFC64G31T5-51BIN serves as primary storage in industrial PCs, HMIs, and edge computing platforms where the extended temperature range ensures reliable operation in factory automation and process control environments.
• Automotive Infotainment Systems - This eMMC flash memory provides high-capacity storage for navigation maps, multimedia content, and application data in automotive head units and rear-seat entertainment systems, with industrial temperature tolerance supporting in-cabin installations.
• IoT Gateways and Edge Devices - The device offers sufficient storage for firmware, buffered sensor data, and local analytics in IoT gateway applications where embedded integration and reliability are critical for remote deployments.
• Consumer Electronics - This flash memory supports set-top boxes, smart TVs, and portable media players where high-density storage enables rich multimedia experiences and application ecosystems.
• Network Attached Storage (NAS) - The ASFC64G31T5-51BIN provides boot storage and system partitions in compact NAS devices where the eMMC interface simplifies controller design and reduces system cost.

Unique Advantages

• Integrated Controller Simplifies Design: The eMMC interface includes built-in wear leveling, bad block management, and error correction, eliminating the need for external NAND controllers and reducing engineering complexity.
• Cost-Effective High Capacity: TLC NAND technology provides an optimal balance between storage density and cost, making high-capacity embedded storage accessible for price-sensitive applications.
• Reduced BOM Count: Single-chip eMMC solution consolidates NAND flash and controller functions, minimizing component count and simplifying procurement and inventory management.
• Industrial Reliability: Extended temperature range of -40°C to 85°C ensures consistent performance in industrial, automotive, and outdoor applications where commercial-grade components may fail.
• Fast Sequential Access: The 200MHz clock frequency and eMMC 5.1 specification deliver throughput sufficient for boot operations, multimedia streaming, and data logging applications.
• Space-Efficient Footprint: Compact 153-FBGA package enables high storage density in small form factor designs such as IoT devices, wearables, and portable equipment.

Why Choose ASFC64G31T5-51BIN?

The ASFC64G31T5-51BIN is positioned as a reliable, high-capacity storage solution for embedded systems requiring substantial non-volatile memory with minimal design complexity. Alliance Memory's integration of TLC NAND with an eMMC 5.1 controller delivers a turnkey storage solution that reduces development time and BOM costs while maintaining industrial-grade reliability. This device is ideal for design teams developing industrial computing platforms, automotive systems, IoT gateways, and consumer electronics where proven eMMC technology, wide temperature tolerance, and high density are essential requirements.

Engineers choosing the ASFC64G31T5-51BIN benefit from Alliance Memory's commitment to quality and supply chain stability, ensuring long-term availability for products with extended lifecycles. The combination of high storage capacity, industrial temperature range, and integrated controller functionality makes this eMMC flash memory an excellent choice for applications demanding reliable, cost-effective embedded storage.

Request a Quote

Contact our sales team to discuss pricing, availability, and volume discounts for the ASFC64G31T5-51BIN. Our technical support engineers are available to assist with integration, design questions, and application-specific requirements to ensure successful implementation in your embedded system.