ASFC8G31M-51BIN

IC FLASH 64GBIT MMC 153FBGA
Part Description

IC FLASH 64GBIT MMC 153FBGA

Quantity 405 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time4 Weeks
Datasheet

Specifications & Environmental

Device Package153-FBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of ASFC8G31M-51BIN - 64Gbit eMMC NAND Flash Memory

The ASFC8G31M-51BIN from Alliance Memory is a 64-gigabit embedded MultiMediaCard (eMMC) NAND flash memory solution organized as 8G x 8. This non-volatile memory device integrates a flash memory array with an MMC interface controller, providing a standardized interface that simplifies embedded storage integration in space-constrained applications. With a 200MHz clock frequency and industrial-grade temperature range, this eMMC flash is designed for reliable data storage in consumer electronics, industrial systems, and embedded computing platforms.

Key Features

  • High-Density Storage - 64Gbit (8GB) capacity organized as 8G x 8 provides substantial embedded storage for firmware, operating systems, and application data in a compact footprint.
  • eMMC Interface - Industry-standard MMC interface simplifies hardware design with a well-supported protocol, reducing development time and enabling compatibility with a wide range of host controllers.
  • NAND Flash Technology - Non-volatile NAND flash architecture delivers high storage density with low power consumption, ideal for battery-powered and portable devices.
  • 200MHz Clock Frequency - Supports clock speeds up to 200MHz for responsive read and write performance in demanding embedded applications.
  • Wide Operating Voltage - 2.7V to 3.6V supply voltage range accommodates various system power architectures and reduces power management complexity.
  • Industrial Temperature Range - Operates reliably from -40°C to 85°C (TA), ensuring consistent performance in harsh environmental conditions.
  • Compact Package - 153-FBGA package (11.5mm x 13mm) minimizes PCB footprint, enabling integration in space-critical designs.

Typical Applications

  • Industrial Control Systems - This eMMC flash provides reliable non-volatile storage for PLCs, HMI panels, and industrial IoT gateways where the extended temperature range ensures consistent operation in factory floor environments.
  • Consumer Electronics - Ideal for set-top boxes, digital cameras, and portable media players where the compact FBGA package and MMC interface enable efficient embedded storage with minimal board space.
  • Embedded Computing - Serves as boot storage and data logging memory in single-board computers, routers, and network appliances where the standardized eMMC interface simplifies integration with ARM and x86 processors.
  • Automotive Infotainment - Suitable for dashboard displays and entertainment systems where the wide operating temperature range supports in-cabin installations and the high-density storage accommodates multimedia content.
  • Medical Devices - Provides reliable data storage for portable diagnostic equipment and patient monitoring systems where non-volatile memory preserves critical data and the compact package fits within handheld form factors.

Unique Advantages

  • Simplified Integration: The eMMC standard interface eliminates the need for external NAND controllers and firmware development, reducing BOM costs and accelerating time-to-market.
  • Proven Reliability: NAND flash technology with integrated wear-leveling and bad block management extends product lifetime in write-intensive applications.
  • Design Flexibility: Wide voltage range support allows designers to optimize power distribution without requiring dedicated voltage regulators for memory subsystems.
  • Space Efficiency: The compact 153-FBGA package delivers 8GB capacity in just 149.5mm² of board area, maximizing storage density in miniaturized products.
  • Industrial-Grade Durability: Extended temperature qualification ensures dependable operation in outdoor installations, industrial machinery, and automotive environments where commercial-grade components may fail.
  • Cost-Effective Scaling: eMMC architecture provides a balance between performance, capacity, and cost for mid-range storage requirements without the overhead of more complex interfaces.

Why Choose ASFC8G31M-51BIN?

The ASFC8G31M-51BIN delivers the storage capacity, interface simplicity, and environmental robustness required for modern embedded systems. Alliance Memory's eMMC solution is particularly well-suited for designs that demand reliable non-volatile storage with minimal integration complexity, whether in industrial automation, consumer products, or computing platforms. The combination of 64Gbit capacity, industrial temperature range, and compact packaging makes this device an effective choice for engineers balancing performance, space constraints, and long-term reliability.

For system architects transitioning from legacy parallel NAND or seeking to reduce storage subsystem complexity, the ASFC8G31M-51BIN offers a standardized path forward with broad ecosystem support and proven field reliability.

Contact Us

Request a quote or technical consultation for the ASFC8G31M-51BIN to discuss volume pricing, availability, and integration support for your next embedded design project.

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