EN29LV160DB-70NIP2W

16Mb Parallel NOR Flash Ind.
Part Description

16Mbit (2048K × 8 / 1024K × 16) Parallel NOR Flash, 3.0V, 70ns, Bottom Boot, WFBGA-48 4×6mm, Industrial

Quantity 334 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package48-WFBGA (4x6mm)Memory FormatFLASHTechnologyNOR Flash
Memory Size16 MbitAccess Time70 nsGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page8 µsPackaging48-WFBGA
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization2M x 8 / 1M x 16
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of EN29LV160DB-70NIP2W – 16Mbit (2048K × 8 / 1024K × 16) Parallel NOR Flash, 3.0V, 70ns, Bottom Boot, WFBGA-48 4×6mm, Industrial

The EN29LV160DB-70NIP2W is a 16‑Mbit parallel NOR flash memory organized as 2,097,152 bytes (2M × 8) or 1,048,576 words (1M × 16). Designed as a boot‑sector flash device, it operates from a single 3.0 V supply (2.7 V–3.6 V) and delivers high performance with access times as fast as 70 ns.

With industrial temperature range (−40 °C to 85 °C), a compact 48‑ball WFBGA (4 × 6 mm) package, and sector protection features, this device targets embedded and industrial systems that require reliable, non‑volatile code and data storage with fast random access and flexible sector management.

Key Features

  • Memory Organization — 16 Mbit capacity organized as 2048K × 8 or 1024K × 16, supporting both byte and word modes for flexible system integration.
  • High Performance — Access times as fast as 70 ns to reduce or eliminate WAIT states in high‑performance microprocessor systems.
  • Single 3.0 V Supply — Operates from 2.7 V to 3.6 V, simplifying power distribution in embedded designs.
  • Fast Program/Erase — Typical byte/word program time of 8 µs, sector erase around 100 ms typical, and chip erase approximately 4 s typical.
  • Low Power Consumption — Typical active read current 9 mA, typical program/erase current 20 mA, and standby/automatic sleep current below 1 µA.
  • Flexible Sector Architecture — Mixed sector sizes: one 16 KB, two 8 KB, one 32 KB and thirty‑one 64 KB (byte mode), enabling efficient code/data placement and targeted updates.
  • Sector Protection and Security — Hardware locking of individual sectors, temporary Sector Group Unprotect for controlled updates, plus a secured silicon sector (128‑word area) that can be permanently protected.
  • Robust Endurance and Retention — Minimum 100K program/erase cycles per sector and 20 years data retention.
  • System Interface — Parallel NOR interface with separate OE#, CE#, and WE# controls to avoid bus contention; supports JEDEC standard program/erase commands, DATA# polling and toggle bit features, and JEDEC Common Flash Interface (CFI).
  • Package and Temperature Grade — 48‑ball WFBGA (4 × 6 mm) surface‑mount package and industrial operating range −40 °C to 85 °C.

Typical Applications

  • Boot Code Storage — Bottom‑boot sector architecture and fast 70 ns access time for reliable boot ROM and firmware storage in embedded controllers.
  • Industrial Embedded Systems — Industrial temperature rating and robust endurance make it suitable for PLCs, factory automation, and other industrial controllers.
  • Field Firmware Updates — Flexible sector layout, temporary unprotect and erase suspend/resume capabilities enable targeted firmware updates without full chip erase.
  • System Code and Data Retention — 100K program/erase cycles and 20‑year retention provide long‑term non‑volatile storage for system code and critical parameters.

Unique Advantages

  • Fast, deterministic reads: 70 ns access time reduces processor wait states and helps maintain system responsiveness.
  • Efficient power profile: Low active and standby currents (typical 9 mA read, <1 µA standby) help minimize system power draw in both active and idle states.
  • Targeted updates with flexible sectors: Mixed sector sizes and hardware locking allow selective program/erase operations to reduce update time and wear.
  • Secure, permanently protectable region: A 128‑word secured silicon sector supports critical code or data that can be permanently protected once programmed.
  • Small footprint package: 48‑ball WFBGA (4 × 6 mm) minimizes PCB area for space‑constrained industrial designs.
  • Standards‑based command set: JEDEC program/erase commands, DATA# polling, toggle bit features and CFI support ease integration with common toolchains and bootloaders.

Why Choose EN29LV160DB-70NIP2W?

The EN29LV160DB-70NIP2W balances high read performance (70 ns) with robust program/erase capabilities and low power consumption in a compact WFBGA package. Its boot‑sector design, flexible sector architecture, and hardware protection features make it well suited for embedded and industrial systems that require reliable non‑volatile code storage, field firmware updates, and long service life.

Engineers designing industrial controllers, embedded systems, and other equipment operating from −40 °C to 85 °C will find this device delivers predictable performance, sector‑level management, and long‑term data retention backed by JEDEC‑compatible interfaces.

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