EN35QX512A-133FIP(2SC)

512Mb SPI NOR Flash Ind.
Part Description

512 Mbit SPI NOR Flash, Industrial 16-pin SOP

Quantity 507 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package16-pin SOP 300milMemory FormatDRAMTechnologySPI NOR Flash
Memory Size512 MbitAccess Time8 nsGradeIndustrial
Clock Frequency133 MHzVoltage2.5VMemory TypeNon-Volatile
Operating Temperature-40°C – 85°CWrite Cycle Time Word Page500 µsPackaging16-pin SOP 300mil
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of EN35QX512A-133FIP(2SC) – 512 Mbit SPI NOR Flash, Industrial 16-pin SOP

The EN35QX512A-133FIP(2SC) is a 512 Mbit serial NOR flash memory device designed for industrial embedded systems requiring non-volatile code and data storage. It implements a serial SPI architecture with single, dual and quad I/O modes and delivers high-speed read performance with a Quad I/O Fast Read option at up to 133 MHz.

Engineered for reliability and in-field updates, the device provides uniform sector architecture, robust program/erase endurance, and hardware/software write protection features well suited for firmware, boot storage and other embedded memory uses across industrial temperature ranges.

Key Features

  • Memory Capacity & Organization — 512 Mbit (64M × 8) serial NOR flash organized into 262,144 pages with 256 bytes per programmable page.
  • High-Speed SPI Interface — SPI-compatible single/dual/quad I/O support. Quad I/O Fast Read up to 133 MHz (device supports 104 MHz for single/dual/quad fast read under typical conditions).
  • Voltage and Power — Full operating voltage range noted in documentation at 2.7–3.6 V; low power consumption with typical active current ~14 mA and typical power-down current ~2 µA.
  • Program / Erase Performance — Page program time ~0.5 ms typical; sector erase ~40 ms typical; half-block and block erase times and chip erase documented for system planning.
  • Endurance & Retention — Minimum 100K program/erase cycles per sector/block and data retention time specified at 20 years.
  • Uniform Sector Architecture & Protection — 4 KB uniform sectors (16,384 sectors), with software and hardware write-protect options, and lockable 3×512-byte OTP security sector for secure data.
  • Advanced Functionality — Supports Serial Flash Discoverable Parameters (SFDP) signature and Read Unique ID Number for system identification and compatibility.
  • Package & Temperature — Industrial-grade device available in a 16-pin SOP 300 mil package, surface-mount, with operating temperature range −40 °C to 85 °C.

Typical Applications

  • Industrial Embedded Systems — Non-volatile storage for firmware, boot code and configuration data in controllers and automation equipment operating across industrial temperature ranges.
  • Firmware Storage & Field Updates — Uniform sectors and program/erase endurance enable reliable in-field firmware updates and partial block programming.
  • Boot and Code Storage — High-density serial flash for storing system bootloaders and application code with Quad SPI read performance for fast code fetch.

Unique Advantages

  • High-capacity Serial Storage: 512 Mbit density provides ample space for large firmware images, code, and data while maintaining a compact package footprint.
  • Flexible SPI I/O Modes: Single, Dual and Quad SPI support enables designers to trade off pin count and throughput to match system requirements.
  • Fast Read Performance: Quad I/O Fast Read at up to 133 MHz reduces read latency for code execution and data access in performance-sensitive applications.
  • Granular Erase & Protection: 4 KB uniform sectors with software and hardware write protection allow selective updates and secure memory regions without full-chip erases.
  • Industrial-grade Reliability: Specified endurance and 20-year data retention, together with −40 °C to 85 °C operation, support long-term deployed systems.
  • Compact Surface-Mount Package: 16-pin SOP 300 mil package simplifies PCB routing and assembly for space-constrained designs.

Why Choose EN35QX512A-133FIP(2SC)?

The EN35QX512A-133FIP(2SC) combines high-density non-volatile storage and versatile SPI interface modes with documented program/erase performance and protection features tailored for industrial embedded applications. Its support for Quad I/O Fast Read at up to 133 MHz and uniform sector architecture make it suitable for systems that require both fast code/data access and reliable in-field updates.

This device is well suited for engineers and procurement teams designing robust, long-lived products where capacity, protection options, and industrial temperature operation are key selection criteria. Its package and documented electrical and timing characteristics help simplify integration into a wide range of embedded platforms.

Request a quote or submit an inquiry to obtain pricing and availability for EN35QX512A-133FIP(2SC) and to discuss volume needs or lead times.

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