FDME016GME-N230

The FDME016GME-N230 is a 16GB embedded SD (eSD) memory card from Flexxon, featuring MLC NAND flash technology in a compact 100-ball BGA surface mount package. Built on the SD 2.0/3.0 interface standard, this non-volatile flash memory solution delivers reliable data storage for industrial applications requiring extended temperature operation and robust performance.

Designed specifically for industrial-grade embedded systems, the FDME016GME-N230 provides high data transfer rates, efficient random IOPS, and comprehensive read/program disturb management. Its surface mount BGA format enables direct PCB integration, making it ideal for space-constrained designs where traditional card-based storage is impractical.

Key Features

• 16GB Storage Capacity (128 Gbit)
  Provides substantial non-volatile flash storage for data logging, firmware, operating systems, and application data in embedded industrial systems.
• MLC NAND Flash Technology
  Multi-Level Cell flash architecture delivers a balanced combination of storage density, performance, and endurance suitable for industrial read-intensive and moderate write applications.
• SD 2.0/3.0 Interface Compatibility
  Industry-standard SD interface ensures broad compatibility with existing host controllers and simplifies system integration. Supports SPI mode for flexible implementation options.
• Industrial Temperature Range
  Operating temperature range of -40°C to 85°C enables reliable operation in harsh industrial environments, including outdoor installations, factory automation equipment, and transportation systems.
• Wide Operating Voltage
  2.7V to 3.6V supply voltage range accommodates various system power architectures and ensures compatibility with standard 3.3V logic levels.
• Compact Surface Mount Package
  100-ball BGA package provides a small footprint for space-constrained PCB designs, enabling direct board mounting without card slots or connectors.
• RoHS Compliant
  Meets environmental compliance standards for hazardous substance restrictions, supporting sustainable manufacturing practices.

Typical Applications

• Industrial Automation and Control
  Embedded storage for PLC firmware, configuration data, operational logs, and HMI systems in factory automation equipment operating across extended temperature ranges.
• Medical Devices
  Reliable data storage for patient records, diagnostic images, system configurations, and device firmware in medical instrumentation requiring industrial-grade components.
• Transportation and Telematics
  Rugged embedded storage for GPS navigation systems, fleet management devices, digital tachographs, and in-vehicle infotainment systems exposed to harsh thermal conditions.
• Networking and Communications Equipment
  Boot storage, configuration management, and log retention for routers, switches, gateways, and base stations requiring soldered-down memory solutions.
• Data Acquisition Systems
  High-capacity storage for sensor data logging, test equipment, measurement instruments, and monitoring devices in industrial and environmental applications.

Unique Advantages

• Soldered-Down Reliability: Surface mount BGA construction eliminates mechanical connectors and card sockets, improving vibration resistance and long-term connection reliability in harsh environments.
• Industrial-Grade Qualification: Extended temperature rating and industrial-grade components ensure consistent performance across demanding operating conditions where commercial-grade storage may fail.
• Design Simplification: Direct PCB mounting reduces system complexity by eliminating card slots, ejection mechanisms, and external housing requirements, lowering overall BOM costs and assembly time.
• Standard Interface Integration: SD interface compatibility allows designers to leverage existing SD host controller IP and drivers, accelerating development and reducing software porting effort.
• Protected Non-Volatile Storage: MLC flash with read/program disturb management provides data retention without power, essential for configuration storage, event logging, and firmware updates in embedded systems.
• Space-Efficient Form Factor: Compact 100-BGA footprint enables integration in miniaturized industrial devices where board space is at a premium, from handheld instruments to embedded controllers.

Why Choose FDME016GME-N230?

The FDME016GME-N230 offers industrial system designers a robust, embedded storage solution that combines the capacity and standardization of SD memory with the reliability and integration benefits of surface mount packaging. Its -40°C to 85°C operating range and MLC flash technology make it particularly well-suited for industrial equipment requiring long-term data retention in challenging thermal environments. The 100-ball BGA format eliminates the mechanical vulnerabilities of card-based storage while maintaining compatibility with standard SD host controllers.

For engineers developing industrial control systems, medical devices, transportation electronics, or embedded networking equipment, the FDME016GME-N230 provides a field-proven storage foundation backed by Flexxon's industrial memory expertise. The combination of 16GB capacity, wide voltage operation, and industrial temperature qualification delivers the performance and reliability required for mission-critical embedded applications.

Ready to integrate reliable industrial storage into your embedded design? Request a quote today to discuss your specific application requirements, volume pricing, and technical support options for the FDME016GME-N230 eSD memory solution.