FDME016GSE-N230

eSD Memory Card (MLC/pSLC/SLC)
Part Description

FDME016GSE-N230 16GB eSD SLC

Quantity 1,104 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-BGAMemory FormatFLASHTechnologySLC
Memory Size128 GbitGradeIndustrialClock FrequencyN/A
Voltage2.7 ~ 3.6VMemory TypeNon-VolatileOperating Temperature-40°C - 85°C
Packaging100-BGAMounting MethodSurface MountMemory InterfaceSD 2.0/3.0
Memory OrganizationN/AMoisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FDME016GSE-N230 – 16GB Industrial-Grade eSD SLC Flash Memory

The FDME016GSE-N230 is a 16GB embedded SD (eSD) flash memory card from Flexxon, built on proven Single-Level Cell (SLC) NAND technology. Designed for industrial applications requiring exceptional reliability and data integrity, this surface-mount eSD card delivers 128 Gbit of non-volatile storage in a compact 100-BGA package. With industrial-grade temperature tolerance and SLC's inherent endurance advantages, the FDME016GSE-N230 is ideal for embedded systems in factory automation, industrial controllers, transportation systems, and ruggedized computing platforms where data persistence and long operational life are critical.

Combining the flexibility of the SD 2.0/3.0 interface with the robustness of surface-mount integration, this eSD memory card enables designers to embed reliable storage directly onto their PCBs, eliminating the need for socketed removable cards in harsh environments. The FDME016GSE-N230 offers a compelling balance of capacity, endurance, and environmental resilience for mission-critical embedded applications.

Key Features

  • 16GB SLC NAND Flash Storage
    Provides 128 Gbit of non-volatile memory using Single-Level Cell technology, delivering superior endurance, faster write speeds, and extended product lifecycle compared to MLC or TLC alternatives. SLC architecture ensures reliable data retention in demanding industrial environments.
  • Industrial-Grade Operating Temperature Range
    Rated for -40°C to 85°C operation, the FDME016GSE-N230 is engineered to perform reliably across extreme temperature conditions found in outdoor installations, automotive auxiliaries, industrial control cabinets, and other harsh-environment deployments.
  • SD 2.0/3.0 Interface Compatibility
    Features a standard SD interface supporting both SD 2.0 and SD 3.0 protocols, ensuring broad compatibility with existing embedded controller ecosystems and simplifying integration into a wide range of host platforms.
  • Wide Voltage Supply Range
    Operates from 2.7V to 3.6V, accommodating standard 3.3V logic levels and providing flexibility for power-sensitive designs and battery-operated systems.
  • Surface Mount 100-BGA Package
    The compact 100-ball BGA footprint enables permanent PCB integration, eliminating mechanical wear from card insertion/removal cycles and improving vibration and shock resistance in mobile or high-reliability installations.
  • RoHS Compliant
    Meets RoHS environmental compliance requirements, supporting green design initiatives and simplifying global supply chain management.

Typical Applications

  • Industrial Automation and Control Systems
    Embedded storage for PLC firmware, configuration data, and event logging in factory automation controllers, robotics, and process control equipment where data integrity and extended temperature tolerance are essential.
  • Transportation and Fleet Management
    On-board data logging, GPS route storage, and firmware hosting in fleet telematics devices, railway signaling systems, and ruggedized transportation electronics requiring reliable operation across wide temperature ranges.
  • Medical and Healthcare Equipment
    Non-volatile storage for firmware, patient data logs, and system configuration in portable diagnostic devices, patient monitoring systems, and medical imaging equipment where data reliability is paramount.
  • Edge Computing and IoT Gateways
    Local data buffering, firmware storage, and configuration management in industrial IoT gateways, edge servers, and smart infrastructure nodes deployed in outdoor or uncontrolled environments.
  • Ruggedized Computing Platforms
    Embedded boot media and data storage for military, aerospace, and outdoor computing systems requiring high-endurance memory in compact, vibration-resistant surface-mount form factors.

Unique Advantages

  • SLC Endurance and Reliability:
    Single-Level Cell technology provides significantly higher program/erase cycle endurance and lower bit error rates compared to multi-level cell architectures, extending product service life and reducing field failures in write-intensive applications.
  • Permanent PCB Integration:
    The surface-mount BGA package eliminates sockets and connectors, reducing mechanical failure points, improving shock and vibration resistance, and enabling sealed or conformal-coated designs for harsh environments.
  • Extended Temperature Resilience:
    Industrial-grade -40°C to 85°C operation ensures consistent performance in outdoor installations, automotive auxiliary systems, and industrial enclosures without active thermal management.
  • Flexible Voltage Compatibility:
    The 2.7V to 3.6V supply range accommodates both standard 3.3V systems and lower-voltage battery-powered designs, simplifying power supply architecture and supporting energy-efficient implementations.
  • Standards-Based Interface:
    SD 2.0/3.0 interface compatibility leverages existing driver ecosystems, reduces software development effort, and ensures long-term host platform compatibility across product generations.
  • Environmental Compliance:
    RoHS-compliant construction supports global regulatory requirements and corporate sustainability goals without compromising technical performance or reliability.

Why Choose the FDME016GSE-N230?

The FDME016GSE-N230 delivers industrial-grade storage performance where reliability, endurance, and environmental resilience are non-negotiable. By combining SLC NAND technology with surface-mount integration and extended temperature operation, this eSD memory card addresses the unique demands of embedded systems deployed in harsh, mission-critical environments. The standard SD interface ensures broad compatibility and reduces development risk, while the permanent BGA mounting eliminates the mechanical vulnerabilities inherent in socketed memory solutions.

For design teams developing industrial controllers, transportation electronics, ruggedized computing platforms, or outdoor IoT infrastructure, the FDME016GSE-N230 offers a proven, long-lifecycle storage solution backed by Flexxon's expertise in industrial flash memory. Its combination of proven SLC technology, compact surface-mount packaging, and industrial temperature range makes it an ideal choice for applications where data integrity and operational longevity directly impact system value and customer satisfaction.

Ready to integrate proven industrial flash storage into your next embedded design? Request a quote for the FDME016GSE-N230 today and discover how SLC reliability and surface-mount robustness can enhance your product's performance in the field. Contact our team to discuss your specific application requirements and volume pricing.

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