FDME032GME-N230
| Part Description |
FDME032GME-N230 32GB eSD MLC |
|---|---|
| Quantity | 1,664 Available (as of May 4, 2026) |
Specifications & Environmental
| Device Package | 100-BGA | Memory Format | FLASH | Technology | MLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Grade | Industrial | Clock Frequency | N/A | ||
| Voltage | 2.7 ~ 3.6V | Memory Type | Non-Volatile | Operating Temperature | -40°C - 85°C | ||
| Packaging | 100-BGA | Mounting Method | Surface Mount | Memory Interface | SD 2.0/3.0 | ||
| Memory Organization | N/A | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | N/A | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FDME032GME-N230 – 32GB Industrial-Grade Embedded SD Memory Card
The FDME032GME-N230 is a high-performance 32GB embedded SD (eSD) memory card from Flexxon, engineered for demanding industrial applications. Built with MLC (Multi-Level Cell) NAND flash technology in a compact 100-ball BGA surface-mount package, this memory solution combines high-density storage with exceptional reliability and wide operating temperature tolerance. Compatible with SD 2.0/3.0 interface specifications, the FDME032GME-N230 delivers robust non-volatile storage for embedded systems requiring dependable data retention across extreme environmental conditions.
Designed specifically for industrial-grade applications, this eSD memory card operates reliably across a -40°C to 85°C temperature range while maintaining compatibility with standard SD protocols. The surface-mount BGA-100 form factor enables space-efficient integration into embedded designs, making it ideal for space-constrained applications requiring permanent, soldered memory solutions with industrial-grade performance characteristics.
Key Features
- High-Density Storage Capacity
32GB (256 Gbit) of non-volatile flash memory provides ample storage for data logging, firmware, multimedia content, and application data in embedded systems. - MLC NAND Technology
Multi-Level Cell flash architecture balances storage density, performance, and endurance, offering cost-effective solutions for industrial data storage requirements. - Industrial-Grade Operating Range
Qualified for -40°C to 85°C operation, ensuring reliable performance across harsh environmental conditions typical of industrial, transportation, and outdoor installations. - SD 2.0/3.0 Interface Compatibility
Industry-standard SD interface ensures broad compatibility with existing host controllers and simplifies integration into legacy and new designs alike. Supports both standard and high-speed operating modes for flexible performance optimization. - Wide Voltage Supply Range
Operates across 2.7V to 3.6V supply voltage, accommodating various system power architectures and enabling integration with both 3.0V and 3.3V systems. - Space-Efficient Surface Mount Package
100-ball BGA package enables permanent board-level integration with minimal PCB footprint, ideal for designs where removable cards are impractical or undesirable. - RoHS Compliant
Fully compliant with RoHS environmental regulations, meeting modern requirements for hazardous substance restrictions in electronic components.
Typical Applications
- Industrial Automation and Control Systems
Provides reliable storage for configuration data, operating parameters, event logs, and firmware in PLCs, industrial controllers, and HMI devices operating in factory environments. - Medical and Healthcare Devices
Enables secure data storage for patient information, diagnostic results, and device configurations in medical instrumentation and portable healthcare equipment requiring long-term data retention. - Transportation and Fleet Management
Supports data logging, GPS tracking data, and system firmware storage in telematics devices, fleet tracking systems, and transportation monitoring equipment exposed to wide temperature variations. - Network and Communication Infrastructure
Delivers dependable storage for configuration files, operating systems, and logs in routers, gateways, and communication equipment requiring permanent embedded memory solutions. - Point-of-Sale and Kiosk Systems
Stores transaction data, application software, and multimedia content in retail terminals, payment systems, and interactive kiosks requiring reliable embedded storage.
Unique Advantages
- Permanent Embedded Installation:
Surface-mount BGA package eliminates concerns about removable card security, accidental removal, or connector wear, ensuring memory remains permanently integrated into your system. - Extended Environmental Reliability:
Industrial-grade temperature rating from -40°C to 85°C ensures consistent operation in environments where commercial-grade memory would fail, reducing field failures and warranty costs. - Simplified Design Integration:
Standard SD interface compatibility leverages existing host controller support and driver availability, accelerating development timelines and reducing software integration effort. - Flexible Power Architecture Support:
Wide 2.7V to 3.6V operating range accommodates various system voltage rails without requiring dedicated voltage regulation, simplifying power supply design and reducing BOM costs. - Proven Industrial-Grade Quality:
Manufactured by Flexxon with focus on industrial applications, providing the reliability and consistency required for mission-critical embedded systems with long product lifecycles. - Cost-Effective High-Density Storage:
MLC technology delivers an optimal balance between capacity, performance, and cost, providing 32GB of storage at a price point suitable for volume production while maintaining industrial reliability standards.
Why Choose the FDME032GME-N230?
The FDME032GME-N230 represents an ideal storage solution for embedded system designers who require industrial-grade reliability combined with high capacity and standard interface compatibility. Its surface-mount BGA format provides permanent integration advantages over socket-based solutions, while the wide operating temperature range ensures dependable operation across diverse deployment environments. The combination of 32GB capacity and MLC flash technology delivers substantial storage headroom for complex applications while maintaining cost-effectiveness for volume production.
For engineers developing industrial equipment, medical devices, transportation systems, or infrastructure products with expected service lives of many years, the FDME032GME-N230 offers the environmental qualification, interface compatibility, and manufacturing consistency needed for long-term success. Its compliance with SD specifications ensures compatibility with widely available controllers and software stacks, while Flexxon's industrial focus provides the quality and support critical for professional embedded applications.
Ready to integrate reliable industrial-grade storage into your embedded design? Contact our technical sales team today to request a quote for the FDME032GME-N230, discuss volume pricing, or obtain samples for your evaluation and testing requirements.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015