FDME064GME-N230

The FDME064GME-N230 is a high-capacity 64GB embedded SD (eSD) memory card from Flexxon, designed specifically for demanding industrial applications. Built on MLC (Multi-Level Cell) NAND flash technology and packaged in a compact 100-ball BGA surface-mount format, this memory solution delivers reliable non-volatile storage with SD 2.0/3.0 interface compatibility. With its industrial-grade temperature range and robust feature set, the FDME064GME-N230 provides the performance and durability required for embedded systems operating in challenging environments.

Offering 512 Gbit (64GB) of storage capacity, this eSD memory card combines high data transfer rates with excellent random IOPS performance. The device supports multiple SD speed modes including SDR12, SDR25, SDR50, SDR104, and DDR50, along with traditional high-speed and default modes. Power loss protection and read/program disturb management features ensure data integrity, making it an ideal storage solution for industrial control systems, embedded computing platforms, and mission-critical applications.

Key Features

• High-Capacity MLC Flash Storage
  512 Gbit (64GB) of non-volatile MLC NAND flash memory provides substantial storage capacity for data logging, firmware, operating systems, and application data in embedded industrial systems.
• SD 2.0/3.0 Interface Compatibility
  Fully compatible with SD specification version 3.0, supporting multiple speed modes (Default, High-Speed, SDR12, SDR25, SDR50, SDR104, and DDR50) for flexible integration with a wide range of host controllers. SPI mode support provides additional interface flexibility.
• Industrial-Grade Temperature Range
  Operational from -40°C to 85°C, ensuring reliable performance in harsh industrial environments including outdoor installations, automotive systems, and factory automation equipment.
• Compact Surface Mount Package
  100-ball BGA package optimized for space-constrained embedded designs, enabling direct PCB mounting and eliminating the need for card slots or connectors while reducing system footprint.
• Wide Operating Voltage Range
  Supports 2.7V to 3.6V supply voltage with 3.3V signaling, providing compatibility with standard embedded system power rails and enabling flexible power supply design.
• Enhanced Data Protection Features
  Built-in power loss protection and read/program disturb management ensure data integrity during unexpected power interruptions and throughout the memory's operational lifetime, critical for industrial reliability.
• RoHS Compliant
  Meets RoHS environmental compliance standards for lead-free and environmentally responsible manufacturing.

Typical Applications

• Industrial Control and Automation
  Ideal for programmable logic controllers (PLCs), distributed control systems, and industrial PCs requiring reliable embedded storage for operating systems, configuration data, and operational logs in factory environments.
• Embedded Computing Systems
  Provides high-capacity storage for single-board computers, embedded modules, and system-on-module platforms running Linux, Android, or other operating systems in industrial and commercial applications.
• Data Acquisition and Logging
  Well-suited for data logging systems, industrial recorders, and instrumentation equipment that require substantial storage capacity to capture sensor data, process parameters, and event logs over extended periods.
• Medical and Healthcare Equipment
  Supports medical devices, diagnostic equipment, and patient monitoring systems requiring reliable non-volatile storage with industrial-grade temperature performance and data integrity features.
• Transportation and Fleet Management
  Applicable in vehicle telematics, fleet management systems, and transportation infrastructure equipment operating across wide temperature ranges with requirements for robust data retention.

Unique Advantages

• Embedded Form Factor Eliminates Mechanical Wear
  The surface-mount BGA package removes the reliability concerns associated with removable card sockets, eliminating mechanical connector wear, vibration sensitivity, and contact oxidation issues common in industrial environments.
• Multiple Speed Mode Support
  Compatibility with SD 2.0/3.0 speed modes from Default through DDR50 ensures optimal performance matching with diverse host controller capabilities, enabling system designers to balance speed and power consumption requirements.
• Industrial-Grade Reliability
  Purpose-built for industrial applications with extended temperature operation, power loss protection, and disturb management features that exceed consumer-grade memory card specifications, reducing field failures and warranty costs.
• Simplified BOM and Assembly
  Direct PCB mounting through standard SMT assembly processes reduces component count by eliminating card sockets and associated hardware, streamlining manufacturing and improving system reliability.
• High Capacity in Compact Footprint
  64GB storage capacity in a small BGA package addresses the growing data storage requirements of modern embedded applications without consuming valuable board space.
• Proven SD Ecosystem Compatibility
  Leverages the widely-adopted SD specification and existing software stacks, reducing development time and enabling straightforward migration from removable SD cards to embedded eSD solutions.

Why Choose the FDME064GME-N230?

The FDME064GME-N230 represents an ideal storage solution for industrial embedded system designers who require high capacity, proven interface compatibility, and industrial-grade reliability. By combining 64GB of MLC flash memory with SD 2.0/3.0 interface standards in a robust surface-mount package, this eSD card delivers the performance and durability needed for mission-critical applications. The wide operating temperature range of -40°C to 85°C, coupled with power loss protection and data integrity management features, ensures dependable operation in demanding industrial environments where consumer-grade solutions would fail.

Whether you're designing next-generation industrial controllers, embedded computing platforms, or data acquisition systems, the FDME064GME-N230 provides the storage capacity, interface flexibility, and long-term reliability your application demands. Its compact BGA package simplifies system design while the SD-compatible interface ensures straightforward software integration with existing drivers and file systems. Backed by Flexxon's industrial memory expertise and RoHS-compliant manufacturing, this eSD solution delivers lasting value through reduced field failures and simplified supply chain management.

Ready to integrate reliable industrial-grade storage into your next embedded design? Contact our sales team today to request a quote for the FDME064GME-N230 or to discuss your specific application requirements. Our technical specialists are available to help you select the optimal memory solution for your industrial embedded system.