FDME032GPE-N230

eSD Memory Card (MLC/pSLC/SLC)
Part Description

FDME032GPE-N230 32GB eSD pSLC

Quantity 762 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-BGAMemory FormatFLASHTechnologypSLC
Memory Size256 GbitGradeIndustrialClock FrequencyN/A
Voltage2.7 ~ 3.6VMemory TypeNon-VolatileOperating Temperature-40°C - 85°C
Packaging100-BGAMounting MethodSurface MountMemory InterfaceSD 2.0/3.0
Memory OrganizationN/AMoisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FDME032GPE-N230 – 32GB Industrial eSD Memory Card with pSLC Technology

The FDME032GPE-N230 is a high-performance 32GB embedded SD (eSD) memory card from Flexxon, built on pseudo-SLC (pSLC) flash technology. Housed in a compact 100-pin BGA surface-mount package, this industrial-grade memory solution combines the endurance and reliability of SLC with the capacity advantages of MLC architecture. Compatible with SD 2.0/3.0 interfaces, it delivers robust data storage for embedded applications requiring reliable non-volatile memory in challenging operating environments.

Designed specifically for industrial applications, the FDME032GPE-N230 offers wide temperature operation from -40°C to 85°C and a flexible voltage supply range of 2.7V to 3.6V. Its pSLC technology provides high random IOPS performance, extended endurance, and built-in data integrity features including power loss protection and read/program disturb management, making it ideal for mission-critical embedded systems.

Key Features

  • High-Capacity Non-Volatile Storage
    256 Gbit (32GB) flash memory capacity provides ample storage for data logging, firmware, operating systems, and application data in embedded industrial systems.
  • Pseudo-SLC (pSLC) Technology
    Combines the endurance and reliability characteristics of single-level cell technology with improved density, delivering superior performance and longevity compared to standard MLC while maintaining cost efficiency.
  • Industrial Temperature Range
    Operates reliably across -40°C to 85°C, ensuring consistent performance in harsh industrial environments, outdoor installations, and temperature-extreme applications.
  • SD 2.0/3.0 Interface Compatibility
    Supports multiple SD speed modes including default, high-speed, SDR12, SDR25, SDR50, SDR104, and DDR50 modes, providing flexible integration with a wide range of host controllers and enabling high data transfer rates.
  • Surface Mount BGA Package
    100-ball BGA package (JEDEC-compatible ball array) enables space-efficient PCB integration and is optimized for automated manufacturing processes in embedded applications.
  • Wide Operating Voltage Range
    2.7V to 3.6V supply voltage accommodates diverse system power architectures and enables compatibility with both 3.3V and lower-voltage embedded platforms.
  • Enhanced Data Reliability Features
    Built-in power loss protection safeguards data integrity during unexpected power interruptions, while read/program disturb management ensures long-term reliability of stored data.
  • RoHS Compliant
    Meets environmental compliance standards for lead-free manufacturing, supporting global regulatory requirements and sustainable design practices.

Typical Applications

  • Industrial Control and Automation
    Provides reliable storage for PLC firmware, configuration data, and operational logs in factory automation, process control systems, and industrial machinery where temperature extremes and high endurance are critical.
  • Embedded Computing Platforms
    Serves as boot media and primary storage for embedded Linux, real-time operating systems, and industrial single-board computers requiring high-reliability, non-volatile memory with power loss protection.
  • Data Logging and Monitoring Systems
    Captures and stores sensor data, event records, and diagnostic information in environmental monitoring, energy management, and infrastructure monitoring applications operating in harsh conditions.
  • Medical and Test Equipment
    Stores calibration data, configuration files, and measurement results in industrial instrumentation and test equipment where data integrity and wide temperature operation are essential.
  • Transportation and Infrastructure
    Enables reliable data storage in railway systems, traffic management equipment, and outdoor infrastructure applications exposed to extreme temperatures and requiring long-term data retention.

Unique Advantages

  • Superior Endurance with pSLC Architecture
    Pseudo-SLC technology significantly extends write/erase cycle endurance compared to standard MLC, reducing replacement frequency and total cost of ownership in write-intensive industrial applications.
  • Robust Power Loss Protection
    Integrated power failure management prevents data corruption during unexpected power interruptions, ensuring system reliability in industrial environments where power quality may be inconsistent.
  • Industrial-Grade Reliability
    Purpose-built for demanding industrial applications with extended temperature operation, enhanced error correction, and disturb management features that maintain data integrity over the product lifecycle.
  • Simplified System Integration
    Standard SD interface compatibility and surface-mount BGA package streamline design-in processes, reduce development time, and provide compatibility with widely available SD host controllers.
  • Space-Efficient Embedded Form Factor
    Compact 100-BGA footprint enables integration into space-constrained embedded designs while eliminating the need for card sockets and connectors required by removable SD cards.
  • High Random IOPS Performance
    Optimized for the random read/write access patterns typical of embedded systems running operating systems and applications, delivering responsive performance beyond sequential transfer rates alone.

Why Choose FDME032GPE-N230?

The FDME032GPE-N230 delivers an optimal balance of capacity, reliability, and performance for industrial embedded applications. Its pSLC technology provides SLC-like endurance and reliability while achieving the capacity needed for modern embedded systems. The combination of power loss protection, wide temperature operation, and robust data integrity features ensures your critical data remains secure even in the most demanding industrial environments. The surface-mount BGA package simplifies manufacturing while the standard SD interface provides broad compatibility with existing designs.

For embedded system designers requiring proven reliability and long-term availability in an industrial-grade memory solution, the FDME032GPE-N230 offers the performance, endurance, and environmental resilience necessary for mission-critical applications. Its comprehensive feature set and industrial-focused design make it an ideal choice for applications where data integrity and operational longevity are paramount.

Ready to integrate reliable industrial memory into your embedded design? Request a quote for the FDME032GPE-N230 today to discuss your specific application requirements, volume pricing, and technical support options.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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