FDME032GPG-N230

The FDME032GPG-N230 is a high-performance 32GB embedded SD (eSD) memory card from Flexxon's industrial memory solutions portfolio. Built on pseudo-SLC (pSLC) NAND technology, this surface-mount flash memory card delivers enterprise-class reliability and endurance in a compact 100-BGA package. Designed specifically for industrial applications requiring robust data storage, the FDME032GPG-N230 combines SD 2.0/3.0 interface compatibility with extended temperature operation from -25°C to 85°C, making it ideal for embedded systems that demand consistent performance under challenging environmental conditions.

This industrial-grade eSD memory card bridges the gap between consumer-grade solutions and pure SLC memory, offering superior write endurance and data retention compared to standard MLC flash while maintaining cost-effectiveness. With its wide operating voltage range of 2.7V to 3.6V and surface-mount BGA form factor, the FDME032GPG-N230 enables direct PCB integration for space-constrained designs across industrial automation, transportation systems, and embedded computing platforms.

Key Features

• Pseudo-SLC (pSLC) NAND Technology
  Leverages pSLC architecture to deliver significantly higher write endurance and improved data retention compared to standard MLC flash, providing industrial-grade reliability for mission-critical applications while optimizing cost per gigabyte.
• 32GB Storage Capacity (256 Gbit)
  Provides ample non-volatile flash storage for firmware, operating systems, data logging, and application files in embedded systems requiring persistent storage with high reliability.
• SD 2.0/3.0 Interface Compatibility
  Implements industry-standard SD interface protocols for broad compatibility with existing embedded system designs, enabling straightforward integration with processors and controllers supporting SD/MMC host interfaces.
• Industrial Temperature Range
  Operates reliably across -25°C to 85°C, ensuring consistent performance in harsh industrial environments including factory automation, outdoor equipment, and transportation systems subject to wide temperature variations.
• Surface Mount 100-BGA Package
  Compact BGA footprint enables direct PCB soldering for embedded applications, eliminating socket connectors while reducing system height and improving shock/vibration resistance in rugged deployments.
• Wide Operating Voltage Range
  Accepts 2.7V to 3.6V supply voltage, providing flexibility for integration with 3.3V and lower-voltage embedded systems while simplifying power supply design.
• RoHS Compliant
  Meets environmental compliance standards for lead-free manufacturing, supporting global regulatory requirements and sustainable product development.

Typical Applications

• Industrial Automation & Control Systems
  Provides reliable program storage, configuration data retention, and event logging for PLCs, industrial controllers, and HMI systems operating in factory environments with extended temperature ranges and high write-cycle requirements.
• Transportation & Fleet Management
  Stores firmware, maps, and telemetry data for GPS tracking devices, vehicle diagnostic systems, and transportation infrastructure equipment requiring robust operation across wide temperature swings.
• Embedded Computing Platforms
  Serves as boot media and application storage for industrial PCs, single-board computers, and embedded Linux/RTOS systems demanding reliable non-volatile memory with direct PCB integration.
• Data Logging & Instrumentation
  Captures sensor data, measurement records, and system logs in industrial instruments, environmental monitoring equipment, and test systems requiring high endurance for frequent write operations.
• Medical & Healthcare Equipment
  Provides dependable storage for firmware and patient data in medical devices and diagnostic equipment operating within industrial temperature specifications and requiring long-term data retention.

Unique Advantages

• Enhanced Endurance with pSLC Technology:
  Pseudo-SLC operation dramatically extends write/erase cycles compared to standard MLC flash, reducing total cost of ownership by extending service life and minimizing field replacements in write-intensive industrial applications.
• Direct PCB Integration:
  Surface-mount BGA package eliminates the need for SD card sockets, reducing BOM costs, improving mechanical reliability, saving board space, and enhancing resistance to shock and vibration in harsh environments.
• Industrial-Grade Operating Range:
  Extended -25°C to 85°C temperature specification ensures reliable operation in uncontrolled industrial environments, outdoor enclosures, and automotive cabins where consumer-grade memory would fail or degrade.
• Proven Interface Compatibility:
  SD 2.0/3.0 interface leverages widespread controller support and mature driver ecosystems, accelerating development and reducing integration risk compared to proprietary memory interfaces.
• Power Efficiency:
  Wide 2.7V to 3.6V operating range enables direct connection to standard 3.3V rails while supporting low-power embedded designs, simplifying power distribution and reducing regulator requirements.
• Environmental Compliance:
  RoHS-compliant construction ensures regulatory compliance for equipment sold globally, supporting sustainable manufacturing practices and simplifying certification processes.

Why Choose the FDME032GPG-N230?

The FDME032GPG-N230 delivers an optimal balance of capacity, endurance, and industrial reliability for embedded systems requiring dependable non-volatile storage. Its pSLC technology provides the write endurance characteristics essential for industrial applications while maintaining cost-effectiveness compared to pure SLC solutions. The surface-mount BGA form factor and wide operating specifications make it particularly well-suited for space-constrained designs in harsh environments where traditional removable SD cards would introduce mechanical vulnerabilities.

For design engineers developing industrial equipment, transportation systems, or embedded computing platforms, the FDME032GPG-N230 offers a proven, standards-based storage solution backed by Flexxon's industrial memory expertise. Its combination of generous 32GB capacity, extended temperature rating, and robust pSLC NAND technology provides the foundation for reliable long-term operation in demanding applications where data integrity and system uptime are critical.

Ready to integrate industrial-grade storage into your embedded design? Request a quote for the FDME032GPG-N230 today to discuss your specific application requirements, volume pricing, and technical support options for your next project.