FDME064GMG-N230

The FDME064GMG-N230 is a high-capacity 64GB embedded SD (eSD) memory card from Flexxon, engineered for demanding industrial applications. Built on Multi-Level Cell (MLC) NAND flash technology in a compact 100-ball BGA package, this surface-mount memory solution delivers reliable non-volatile storage with compatibility across SD 2.0 and SD 3.0 interfaces. Designed to withstand extended industrial temperature ranges and harsh operating conditions, the FDME064GMG-N230 provides embedded systems designers with a robust, space-efficient memory solution.

With 512 Gbit (64GB) of storage capacity and support for high data transfer rates, this eSD card addresses the growing storage needs of industrial control systems, embedded computing platforms, and data logging applications. Its industrial-grade qualification and RoHS compliance make it suitable for deployment in equipment requiring long-term reliability and regulatory adherence.

Key Features

• High-Capacity MLC Flash Storage
  Features 512 Gbit (64GB) of MLC NAND flash memory, providing substantial storage capacity for data-intensive embedded applications while maintaining cost-effective scalability.
• SD 2.0/3.0 Interface Compatibility
  Supports both SD 2.0 and SD 3.0 specifications with multiple speed modes including SDR12, SDR25, SDR50, SDR104, and DDR50, enabling flexible integration with existing and next-generation host controllers. Includes SD SPI mode support for simplified interfacing.
• Industrial Temperature Range
  Operates reliably across -25°C to 85°C, ensuring consistent performance in industrial environments subject to temperature extremes and thermal cycling.
• Compact Surface-Mount Package
  100-ball BGA package optimized for space-constrained designs, offering a small footprint for direct PCB mounting in embedded systems where board real estate is at a premium.
• Wide Operating Voltage Range
  Functions across 2.7V to 3.6V supply voltage, providing compatibility with standard 3.3V logic systems and accommodating voltage variations in industrial power environments.
• Enhanced Data Integrity
  Incorporates Power Loss Protection and read/program disturb management, safeguarding data integrity during unexpected power interruptions and ensuring reliable long-term operation.
• RoHS Compliant
  Meets RoHS environmental compliance standards, supporting regulatory requirements for industrial and commercial equipment deployment.

Typical Applications

• Industrial Control Systems
  Provides embedded storage for configuration data, operational logs, and firmware in PLCs, HMIs, and industrial automation controllers requiring non-volatile memory with industrial temperature ratings.
• Data Logging Equipment
  Captures and stores sensor data, event logs, and time-series measurements in monitoring systems, instrumentation, and field-deployed data acquisition devices.
• Embedded Computing Platforms
  Serves as boot media and application storage for single-board computers, embedded Linux systems, and industrial gateways requiring reliable, high-capacity flash memory.
• Medical and Test Equipment
  Stores calibration parameters, test results, and operational data in measurement instruments and medical devices where data retention and reliability are critical.
• Transportation and Infrastructure
  Provides storage for transportation systems, traffic management equipment, and infrastructure monitoring devices operating in extended temperature environments.

Unique Advantages

• Proven JEDEC Standard Footprint:
  The 100-ball BGA package follows JEDEC standards, ensuring compatibility with established PCB layouts and manufacturing processes, reducing design risk and accelerating time-to-market.
• Industrial-Grade Reliability:
  Industrial temperature rating combined with Power Loss Protection and advanced disturb management delivers the reliability required for mission-critical applications where data loss is unacceptable.
• Flexible Integration Options:
  Multiple SD speed modes and SPI compatibility provide designers with flexible interface options to balance performance requirements against system complexity and host controller capabilities.
• Space-Efficient Design:
  Surface-mount BGA package eliminates the need for socketed SD card slots, reducing board space requirements, improving mechanical reliability, and lowering overall system BOM costs.
• Scalable Storage Solution:
  Part of Flexxon's eSD series offering capacities from 512MB to 64GB, enabling design reuse and platform scalability across product lines with varying storage requirements.
• High Random IOPS Performance:
  Optimized for high random input/output operations per second, supporting applications with frequent small read/write operations such as database management and real-time logging.

Why Choose the FDME064GMG-N230?

The FDME064GMG-N230 combines substantial storage capacity with industrial-grade reliability in a compact, surface-mountable form factor. Its compliance with SD 2.0/3.0 standards ensures broad host controller compatibility, while industrial temperature rating and enhanced data protection features address the demanding requirements of equipment deployed in harsh environments. Engineers benefit from a proven JEDEC-standard footprint that simplifies PCB design and manufacturing.

For embedded systems requiring non-volatile storage with proven reliability, the FDME064GMG-N230 delivers a complete solution backed by Flexxon's focus on industrial applications. Its integration of high capacity, multiple interface modes, and robust data protection mechanisms makes it an ideal choice for equipment manufacturers seeking long-term storage solutions without the mechanical vulnerabilities of socketed memory cards.

Ready to integrate reliable industrial-grade storage into your embedded design? Request a quote for the FDME064GMG-N230 today to discuss your application requirements and volume pricing. Our team is available to provide technical specifications and support your design-in process.