FEMC004GPB-E440

XTRA III 5.1 153ball eMMC (MLC/pSLC)
Part Description

FEMC004GPB-E440 4GB eMMC 5.1 pSLC

Quantity 1,443 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnologypSLC
Memory Size32 GbitGradeAutomotive grade 2Clock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization4G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 2ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC004GPB-E440 – 4GB eMMC 5.1 Automotive-Grade Embedded Flash Memory

The FEMC004GPB-E440 is a 4GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution from Flexxon's XTRA III Series, engineered for demanding industrial and automotive applications. Built on pseudo-SLC (pSLC) technology, this non-volatile memory device delivers the enhanced endurance and reliability of SLC NAND while maintaining efficient capacity utilization. With AEC-Q100 Grade 2 automotive qualification and an operating temperature range of -25°C to 85°C, the FEMC004GPB-E440 provides robust, long-term storage for embedded systems requiring proven reliability under challenging environmental conditions.

Housed in a compact 153-ball FBGA surface-mount package, this memory module integrates seamlessly into space-constrained designs while offering the performance benefits of the eMMC 5.1 interface with 200 MHz clock frequency. The device supports flexible voltage operation with VCCQ at 1.8V/3.3V and VCC at 3.3V, enabling compatibility with a wide range of host system architectures in automotive, industrial control, and embedded computing applications.

Key Features

  • Pseudo-SLC (pSLC) Technology
    Utilizes pSLC mode to deliver significantly enhanced endurance and data retention compared to standard MLC NAND, providing SLC-like reliability characteristics ideal for write-intensive applications and extended product lifecycles.
  • eMMC 5.1 Interface with 200 MHz Performance
    Implements the industry-standard eMMC 5.1 specification operating at 200 MHz clock frequency, offering a simplified integration path with proven compatibility across embedded processors and SoCs while delivering reliable data throughput.
  • 4GB Storage Capacity (32 Gbit)
    Provides 4GB of user-accessible storage organized as 4G × 8, offering sufficient capacity for embedded operating systems, application code, data logging, and multimedia content in industrial and automotive systems.
  • AEC-Q100 Grade 2 Automotive Qualification
    Fully qualified to AEC-Q100 Grade 2 standards, ensuring the reliability and quality required for automotive electronics operating in the -25°C to 85°C temperature range, meeting stringent automotive industry requirements.
  • Dual Voltage Support
    Supports both 1.8V and 3.3V I/O voltage (VCCQ) along with 3.3V core supply (VCC), providing flexibility in system design and enabling compatibility with diverse host controller configurations without external level translation.
  • Compact 153-Ball FBGA Package
    Surface-mount 153-FBGA package delivers high density integration in a small footprint, ideal for space-constrained PCB layouts in automotive infotainment, industrial controllers, and embedded computing modules.
  • Industrial Operating Temperature Range
    Rated for -25°C to 85°C operation, ensuring reliable performance across industrial and automotive environments subject to temperature variation, thermal cycling, and extended exposure to elevated operating conditions.
  • RoHS Compliant
    Manufactured in compliance with RoHS environmental standards, supporting supply chain requirements for restricted substance compliance in global markets.

Typical Applications

  • Automotive Infotainment and Navigation Systems
    Provides reliable, high-endurance storage for operating systems, map data, multimedia files, and application software in automotive head units and instrument clusters where data integrity and temperature resilience are critical.
  • Industrial Controllers and HMI Devices
    Serves as embedded storage for PLC systems, industrial PCs, and human-machine interfaces requiring robust, long-life memory solutions capable of withstanding industrial temperature ranges and frequent write cycles.
  • Telematics and Fleet Management Systems
    Enables data logging, firmware storage, and configuration management in connected vehicle systems and fleet tracking devices operating in automotive-grade temperature environments with extended reliability requirements.
  • Transportation and Railway Electronics
    Supports embedded storage needs in railway signaling equipment, passenger information systems, and transportation infrastructure where automotive-grade qualification and extended temperature operation ensure long-term reliability.
  • Medical and Test Equipment
    Provides dependable embedded storage for diagnostic instruments, portable medical devices, and automated test equipment requiring enhanced endurance and data retention in industrial operating environments.

Unique Advantages

  • Enhanced Endurance with pSLC Technology:
    Pseudo-SLC operation dramatically increases program/erase cycle endurance compared to standard MLC, extending product lifetime and reducing field failure rates in write-intensive applications.
  • Automotive-Qualified Reliability:
    AEC-Q100 Grade 2 qualification ensures the device meets stringent automotive industry reliability standards, providing design confidence for automotive OEMs and Tier 1 suppliers with proven compliance.
  • Simplified Integration Path:
    eMMC 5.1 standard interface eliminates the complexity of raw NAND management, with integrated controller handling wear leveling, bad block management, and ECC, reducing host processor overhead and accelerating time-to-market.
  • Extended Temperature Performance:
    -25°C to 85°C operating range enables deployment in automotive and industrial environments where standard commercial-grade components cannot guarantee reliable operation, reducing system-level thermal management requirements.
  • Flexible Voltage Operation:
    Dual VCCQ voltage support (1.8V/3.3V) provides design flexibility for integration with both legacy 3.3V systems and modern low-voltage processors, simplifying board design and reducing external component count.
  • Proven XTRA III Series Platform:
    Part of Flexxon's XTRA III industrial eMMC family, leveraging a proven architecture with established supply chain availability and technical support for industrial and automotive design projects.

Why Choose FEMC004GPB-E440?

The FEMC004GPB-E440 combines automotive-grade qualification, pSLC endurance, and eMMC 5.1 integration in a single, robust embedded storage solution. For system designers developing automotive electronics, industrial controllers, or embedded computing platforms, this device eliminates the complexity and risk of managing raw NAND while delivering the enhanced reliability and write endurance required for mission-critical applications. The AEC-Q100 Grade 2 qualification provides documented compliance for automotive supply chains, while the extended temperature range and pSLC technology ensure long-term data integrity in demanding operating environments.

By selecting the FEMC004GPB-E440, engineering teams gain a field-proven, standards-based embedded storage solution backed by Flexxon's industrial memory expertise. The combination of automotive qualification, simplified integration, and enhanced endurance characteristics makes this device ideal for applications where reliability cannot be compromised and product lifecycles extend well beyond consumer electronics timeframes.

Ready to integrate automotive-grade embedded storage into your next design? Request a quote for the FEMC004GPB-E440 today to discuss volume pricing, technical specifications, and delivery schedules for your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


    Revenue: NA


    Certifications and Memberships: ISO9001:2015


    Featured Products
    Latest News
    keyboard_arrow_up