FDME016GPE-N230

The FDME016GPE-N230 is a high-performance 16GB embedded SD (eSD) memory card from Flexxon, built on pseudo-SLC (pSLC) NAND flash technology. Designed for industrial applications requiring exceptional reliability and endurance, this surface-mount BGA-100 flash memory solution combines the performance benefits of SLC with the capacity advantages of MLC technology. Compatible with SD 2.0/3.0 interfaces, it delivers high data transfer rates and robust read/program disturb management for mission-critical embedded systems.

Engineered to operate reliably in harsh industrial environments with an extended temperature range of -40°C to 85°C, the FDME016GPE-N230 provides 128 Gbit of non-volatile storage with power loss protection and high random IOPS performance. Its compact 100-BGA surface-mount package enables space-efficient integration into industrial controllers, edge computing devices, networking equipment, and embedded instrumentation where long-term data retention and operational reliability are essential.

Key Features

• Pseudo-SLC (pSLC) Flash Technology
  Combines the superior endurance and reliability characteristics of Single-Level Cell flash with increased storage density, delivering extended write cycles and improved data integrity compared to standard MLC solutions for demanding industrial workloads.
• 16GB Non-Volatile Storage Capacity
  Provides 128 Gbit of FLASH memory with data retention characteristics suitable for embedded applications requiring persistent storage across power cycles and extended deployment periods.
• SD 2.0/3.0 Interface Compatibility
  Standard SD interface ensures broad compatibility with existing embedded systems and microcontrollers, simplifying integration while supporting multiple speed modes including default, high-speed, SDR12, SDR25, SDR50, SDR104, and DDR50 operation.
• Industrial Temperature Range
  Qualified for operation from -40°C to 85°C, enabling reliable performance in automotive, outdoor, factory automation, and other demanding environmental conditions where consumer-grade components cannot operate.
• Flexible Voltage Supply
  Supports 2.7V to 3.6V supply voltage range, accommodating various system power architectures and enabling integration with both 3.3V and lower-voltage embedded platforms.
• Surface-Mount BGA-100 Package
  Compact 100-ball BGA package optimized for PCB mounting provides a small footprint and robust mechanical connection suitable for applications subject to vibration and thermal cycling.
• Power Loss Protection
  Integrated power loss protection mechanisms help safeguard data integrity during unexpected power interruptions, critical for industrial control systems and embedded applications where data corruption must be minimized.
• RoHS Compliant
  Meets environmental compliance requirements for lead-free manufacturing and deployment in regulated markets worldwide.

Typical Applications

• Industrial Automation and Control
  Provides reliable non-volatile storage for PLC systems, industrial controllers, and factory automation equipment requiring data logging, firmware storage, and configuration retention in harsh operating environments.
• Edge Computing and IoT Gateways
  Serves as local storage for edge processing nodes, IoT gateways, and intelligent sensors that collect, process, and temporarily store data before transmission to cloud or central systems.
• Networking and Telecommunications Equipment
  Supports configuration storage, firmware updates, and operational logging in routers, switches, wireless access points, and telecommunications infrastructure operating in extended temperature environments.
• Medical and Test Instrumentation
  Enables data acquisition, measurement logging, and system configuration storage in medical devices, laboratory equipment, and test instrumentation where reliability and data integrity are paramount.
• Transportation and Infrastructure Systems
  Provides robust storage for transportation control systems, traffic management equipment, and infrastructure monitoring devices exposed to wide temperature ranges and demanding operational conditions.

Unique Advantages

• Enhanced Endurance Through pSLC Technology: Pseudo-SLC operation significantly extends write endurance compared to standard MLC flash, reducing the frequency of field replacements and lowering total cost of ownership in write-intensive industrial applications.
• High Random IOPS Performance: Optimized for random read and write operations typical of embedded systems, delivering responsive performance for operating system execution, database operations, and real-time data logging tasks.
• Wide Operating Temperature Range: Industrial-grade -40°C to 85°C temperature qualification ensures reliable operation across seasonal variations, enclosed equipment environments, and outdoor installations without temperature management overhead.
• Standard SD Interface Ecosystem: Leverages the widely-adopted SD interface standard, enabling designers to utilize existing hardware designs, proven software drivers, and familiar development tools while ensuring compatibility with a broad range of host controllers.
• Space-Efficient Surface-Mount Design: BGA-100 package format eliminates the need for socketed SD card interfaces, reducing PCB space requirements, improving mechanical reliability, and enabling integration in compact embedded system designs.
• Data Protection Features: Integrated power loss protection and read/program disturb management enhance system reliability by protecting against data corruption scenarios common in industrial environments with unstable power or frequent write operations.

Why Choose FDME016GPE-N230?

The FDME016GPE-N230 delivers industrial-grade reliability and performance where standard consumer flash solutions fall short. By combining pseudo-SLC technology with an extended temperature range and surface-mount integration, this eSD memory card addresses the unique demands of embedded industrial systems requiring both endurance and environmental resilience. The SD interface compatibility ensures straightforward migration from socketed SD card designs to soldered-down embedded storage, improving mechanical reliability while maintaining software compatibility.

For engineers developing industrial controllers, edge computing platforms, networking equipment, or instrumentation, the FDME016GPE-N230 offers a proven storage foundation backed by Flexxon's focus on industrial-grade memory solutions. The combination of pSLC endurance, power loss protection, and wide temperature operation provides the reliability margins essential for long-lifecycle deployments where field service costs must be minimized and system uptime is critical.

Ready to integrate industrial-grade embedded storage into your next design? Request a quote for the FDME016GPE-N230 today to discuss your application requirements, volume pricing, and technical support options for your embedded system project.