FEMC032GBB-T740

The FEMC032GBB-T740 is a high-capacity 32GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution from Flexxon's XTRA VIII Series. Built with advanced 3D TLC NAND technology and housed in a compact 153-ball FBGA package, this non-volatile memory device delivers reliable data storage for demanding embedded applications. With AEC-Q100 Grade 2 automotive qualification and an extended operating temperature range of -40°C to 105°C, the FEMC032GBB-T740 is engineered to perform in harsh environments where traditional storage solutions fail.

Designed for system integrators and embedded developers who require robust, high-performance storage, this eMMC solution provides 256 Gbit (32GB) of capacity organized as 32G × 8, operating at 200 MHz clock frequency. The device supports dual voltage operation (VCCQ: 1.8V/3.3V, VCC: 3.3V) and features surface mount technology for streamlined PCB integration. Full RoHS compliance ensures environmental responsibility without compromising performance.

Key Features

• High-Capacity 3D TLC Flash Storage
  Delivers 256 Gbit (32GB) of non-volatile flash memory utilizing advanced 3D TLC NAND technology, providing substantial storage capacity for data logging, firmware, media files, and application code in a single integrated package.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency enables simplified integration with host processors while delivering predictable performance characteristics and broad ecosystem support.
• Automotive-Grade Reliability (AEC-Q100 Grade 2)
  Fully qualified to AEC-Q100 Grade 2 automotive standards, ensuring the rigorous quality, reliability, and endurance required for automotive and industrial applications where failure is not an option.
• Extended Temperature Range
  Operates reliably across -40°C to 105°C ambient temperature range, making it suitable for automotive under-hood applications, industrial control systems, and outdoor equipment exposed to extreme thermal conditions.
• Flexible Voltage Operation
  Supports dual I/O voltage operation with VCCQ at 1.8V or 3.3V and VCC at 3.3V, providing design flexibility to interface with a wide range of host processors and system architectures while optimizing power consumption.
• Compact 153-Ball FBGA Package
  Surface-mount 153-FBGA package minimizes PCB footprint while providing robust mechanical connection and excellent thermal performance, ideal for space-constrained embedded designs.
• 32G × 8 Memory Organization
  Efficient memory organization with 8-bit wide data bus simplifies host controller design and enables straightforward integration into existing embedded system architectures.

Typical Applications

• Automotive Infotainment and Telematics
  Stores maps, media content, user profiles, and system firmware in automotive dashboard displays, navigation systems, and connected vehicle platforms where automotive qualification and temperature tolerance are essential.
• Industrial Control and Automation
  Provides reliable data logging, configuration storage, and firmware retention in PLCs, industrial controllers, and factory automation equipment operating in harsh industrial environments with wide temperature fluctuations.
• Medical and Healthcare Devices
  Enables secure storage of patient data, diagnostic images, and device firmware in portable medical equipment and bedside monitors where reliability, temperature stability, and long-term data retention are critical.
• Transportation and Fleet Management
  Supports event recording, GPS tracking data, and system logs in commercial vehicle systems, fleet telematics devices, and transportation monitoring equipment exposed to extreme operating conditions.
• Ruggedized Computing Platforms
  Serves as primary storage in embedded computing systems, industrial tablets, and outdoor kiosks requiring robust memory solutions that withstand temperature extremes and demanding operating environments.

Unique Advantages

• Proven Automotive-Grade Quality: AEC-Q100 Grade 2 qualification provides confidence in long-term reliability and performance for mission-critical automotive and industrial applications, reducing warranty risk and field failures.
• Simplified System Integration: Industry-standard eMMC 5.1 interface with broad host processor support eliminates complex NAND controller design, accelerates time-to-market, and reduces development costs compared to raw NAND implementations.
• Extended Environmental Capability: The -40°C to 105°C operating temperature range combined with automotive qualification enables deployment in the most demanding thermal environments without additional thermal management or derating.
• High Storage Density: 32GB capacity in a compact surface-mount package provides ample space for complex applications, high-resolution content, extensive data logging, and future firmware updates without oversizing system design.
• Design Flexibility: Dual I/O voltage support (1.8V/3.3V) allows seamless integration with both modern low-voltage processors and legacy 3.3V systems, protecting your design investment across product generations.
• Environmental Compliance: Full RoHS compliance ensures your products meet global environmental regulations and procurement requirements without compromise, simplifying certification and market access.

Why Choose the FEMC032GBB-T740?

The FEMC032GBB-T740 combines automotive-grade reliability, generous storage capacity, and proven eMMC 5.1 technology in a robust package designed for the real world. When your application demands reliable non-volatile storage that performs consistently from arctic cold to desert heat, this Flexxon XTRA VIII Series device delivers. The AEC-Q100 Grade 2 qualification isn't just a checkbox—it represents comprehensive testing and validation that your storage subsystem will perform reliably throughout your product's lifecycle, even in the harshest automotive and industrial environments.

Whether you're developing next-generation automotive systems, industrial IoT devices, or ruggedized computing platforms, the FEMC032GBB-T740 provides the perfect balance of capacity, reliability, and ease of integration. The 153-ball FBGA package keeps your PCB compact while the industry-standard eMMC 5.1 interface ensures compatibility with a vast ecosystem of host processors and development tools. Choose the FEMC032GBB-T740 when your design requires storage you can trust in environments where others fail.

Ready to integrate reliable automotive-grade storage into your next design? Request a quote today to discover how the FEMC032GBB-T740 can enhance your product's performance and reliability. Our team is standing by to provide technical support, pricing information, and volume availability to meet your project timeline.