FEMC032GBA-T740

The FEMC032GBA-T740 from Flexxon is a high-performance 32GB embedded MultiMediaCard (eMMC) solution built on 3D TLC NAND flash technology. As part of the XTRA VIII Series, this eMMC 5.1-compliant memory module delivers reliable, non-volatile storage in a compact 153-ball FBGA package, specifically designed to meet the demanding requirements of automotive and industrial applications.

With AEC-Q100 Grade 3 qualification and an operating temperature range of -40°C to +85°C, the FEMC032GBA-T740 provides robust data storage for systems requiring proven reliability under challenging environmental conditions. Its 200 MHz clock frequency and eMMC 5.1 interface ensure fast data throughput, while flexible voltage supply options (VCCQ: 1.8V/3.3V, VCC: 3.3V) enable integration into diverse system architectures.

Key Features

• 32GB Storage Capacity
  Organized as 256 Gbit (32G × 8) using advanced 3D TLC NAND technology, providing substantial embedded storage for data-intensive automotive and industrial applications.
• eMMC 5.1 Interface
  Compliant with the eMMC 5.1 standard, delivering high-speed data transfer at 200 MHz clock frequency for responsive system performance and efficient read/write operations.
• AEC-Q100 Grade 3 Qualified
  Meets automotive-grade reliability standards with AEC-Q100 Grade 3 qualification, ensuring consistent operation across a -40°C to +85°C temperature range for demanding automotive and industrial environments.
• 3D TLC Flash Technology
  Built on three-dimensional triple-level cell NAND architecture, balancing storage density, performance, and cost-effectiveness for embedded systems requiring substantial non-volatile memory.
• Flexible Voltage Support
  Dual voltage I/O capability (VCCQ: 1.8V/3.3V) with 3.3V core supply (VCC) enables compatibility with a wide range of host processors and system power architectures.
• Compact 153-FBGA Package
  Surface-mount 153-ball fine-pitch ball grid array package optimizes board space utilization while providing reliable electrical connectivity and thermal performance.
• RoHS Compliant
  Fully compliant with environmental regulations, supporting sustainable manufacturing and global market requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides reliable storage for operating systems, maps, media libraries, and user data in dashboard displays, navigation systems, and entertainment modules where automotive qualification is essential.
• Advanced Driver Assistance Systems (ADAS)
  Stores critical firmware, calibration data, and configuration parameters for camera systems, sensor fusion modules, and driver assistance features requiring automotive-grade reliability.
• Industrial Control and Automation
  Serves as embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge computing devices operating in industrial temperature ranges.
• Transportation and Fleet Management
  Powers data logging, telematics, and fleet tracking systems with robust non-volatile storage capable of withstanding vibration, temperature extremes, and extended operational lifecycles.
• Ruggedized Embedded Systems
  Ideal for outdoor equipment, railway systems, and harsh-environment applications where the extended temperature range and automotive-grade qualification ensure long-term reliability.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q100 Grade 3 certification ensures the FEMC032GBA-T740 meets stringent automotive industry standards for quality and longevity, reducing field failure risks in critical applications.
• Extended Temperature Operation: The -40°C to +85°C operating range enables deployment in environments where standard commercial-grade memory would fail, expanding design possibilities for outdoor and automotive use cases.
• Simplified Integration: The eMMC 5.1 interface provides a standardized, managed NAND solution with built-in wear leveling, bad block management, and error correction, reducing host processor overhead and accelerating time-to-market.
• Scalable Storage Architecture: As part of the XTRA VIII Series spanning 8GB to 128GB capacities, the 32GB model allows design scalability across product lines while maintaining consistent electrical and mechanical interfaces.
• Compact Footprint: The 153-FBGA surface-mount package delivers high storage density in a space-efficient form factor, critical for size-constrained automotive and embedded applications.
• Dual Voltage Flexibility: Support for both 1.8V and 3.3V I/O signaling simplifies integration with diverse host processors and system architectures without requiring additional level-shifting circuitry.

Why Choose the FEMC032GBA-T740?

The FEMC032GBA-T740 combines automotive-grade reliability with the performance and integration benefits of eMMC 5.1 technology. For engineers developing automotive infotainment, ADAS, industrial control systems, or ruggedized embedded platforms, this 32GB solution delivers the proven durability required for harsh environments alongside the managed NAND convenience that accelerates development and reduces system complexity.

Backed by Flexxon's XTRA VIII Series architecture and comprehensive qualification testing, the FEMC032GBA-T740 provides a dependable foundation for designs requiring non-volatile storage that performs consistently across automotive temperature ranges. Its combination of capacity, standardized interface, and automotive-grade qualification makes it an ideal choice for applications where reliability cannot be compromised.

Ready to integrate automotive-grade embedded storage into your next design? Request a quote for the FEMC032GBA-T740 today to discuss your specific application requirements, volume pricing, and technical support options. Our team is available to help you select the optimal memory configuration for your project.