FEMC016GMG-E440
| Part Description |
FEMC016GMG-E440 16GB eMMC 5.1 MLC |
|---|---|
| Quantity | 736 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | MLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Gbit | Grade | Industrial | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 16G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | N/A | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC016GMG-E440 – 16GB Industrial eMMC 5.1 Flash Memory with MLC Technology
The FEMC016GMG-E440 is a 16GB embedded MultiMediaCard (eMMC) 5.1 flash memory module from Flexxon's XTRA III series. Built with MLC (Multi-Level Cell) NAND technology and packaged in a compact 153-ball FBGA, this non-volatile memory solution delivers reliable, high-speed storage for embedded systems operating in demanding industrial environments. With a 200 MHz clock frequency and dual voltage support (1.8V/3.3V VCCQ), the FEMC016GMG-E440 provides an ideal balance of performance, capacity, and thermal resilience for space-constrained applications.
Designed for industrial-grade reliability, this eMMC module operates across a temperature range of -25°C to 85°C and is fully RoHS compliant. The XTRA III series combines proven MLC flash technology with the standardized eMMC 5.1 interface, simplifying integration into embedded designs while delivering consistent read/write performance for applications ranging from industrial control systems to networking equipment.
Key Features
- 16GB Storage Capacity (128 Gbit)
Organized as 16G × 8, providing ample non-volatile storage for embedded operating systems, application code, data logging, and multimedia content in a single, integrated module. - eMMC 5.1 Interface with 200 MHz Clock
Standardized embedded MultiMediaCard interface simplifies system design and enables high-speed data transfers, reducing development complexity and accelerating time-to-market for embedded products. - MLC NAND Flash Technology
Multi-Level Cell architecture delivers a proven balance between storage density, endurance, and cost-effectiveness for industrial applications requiring reliable long-term data retention. - Dual Voltage I/O Support
VCCQ operates at either 1.8V or 3.3V with VCC at 3.3V, offering design flexibility to match various system power architectures and enabling seamless integration with different processor platforms. - Industrial Temperature Range
Operates reliably across -25°C to 85°C, ensuring consistent performance in harsh industrial environments including factory automation, transportation systems, and outdoor installations. - Compact 153-FBGA Surface Mount Package
Space-efficient ball grid array package minimizes PCB footprint while providing robust mechanical connection and thermal performance for high-density embedded designs. - RoHS Compliant
Meets environmental standards for lead-free manufacturing, supporting global regulatory compliance and sustainable product development initiatives.
Typical Applications
- Industrial Control and Automation
Provides reliable storage for PLC firmware, HMI operating systems, configuration data, and event logging in factory automation, process control, and industrial monitoring equipment operating in temperature-variable environments. - Networking and Telecommunications Equipment
Stores router and switch firmware, configuration files, and system logs in network infrastructure devices, offering the capacity and reliability needed for always-on communication systems. - Medical Devices and Instrumentation
Enables embedded storage for diagnostic equipment, patient monitoring systems, and medical instrumentation requiring dependable data retention and industrial-grade temperature tolerance. - Transportation and Fleet Management
Supports onboard computers, telematics systems, and vehicle diagnostic equipment with robust storage capable of withstanding vibration and extended temperature ranges encountered in mobile applications. - Digital Signage and Point-of-Sale
Delivers sufficient capacity for multimedia content, operating systems, and transaction data in commercial display systems and retail terminals deployed in varied environmental conditions.
Unique Advantages
- Simplified System Integration:
The standardized eMMC 5.1 interface eliminates the need for external NAND controllers and complex firmware development, reducing BOM costs and engineering effort while improving design reliability. - Industrial-Grade Reliability:
Extended temperature operation from -25°C to 85°C ensures consistent performance across demanding industrial, transportation, and outdoor applications where consumer-grade components would fail. - Proven MLC Technology:
Multi-Level Cell NAND architecture provides thousands of program/erase cycles with well-characterized endurance and data retention characteristics, offering predictable lifetime performance for product planning. - Flexible Voltage Compatibility:
Dual VCCQ voltage support (1.8V/3.3V) enables direct connection to a wide range of processors and SoCs without additional level-shifting circuitry, simplifying power supply design and reducing component count. - Space-Efficient Form Factor:
The 153-ball FBGA package delivers 16GB of storage in a minimal footprint, ideal for compact embedded designs where PCB real estate is at a premium. - Environmental Compliance:
RoHS compliance ensures your designs meet global environmental regulations, supporting green initiatives and enabling worldwide product distribution without material restrictions.
Why Choose FEMC016GMG-E440?
The FEMC016GMG-E440 delivers industrial-grade embedded storage with the simplicity of the standardized eMMC 5.1 interface and the proven reliability of MLC NAND technology. With 16GB capacity, dual voltage I/O flexibility, and operation across -25°C to 85°C, this module is engineered for embedded systems that demand consistent performance in challenging environments. The compact 153-FBGA package and integrated controller architecture reduce design complexity, lower BOM costs, and accelerate development cycles compared to discrete NAND solutions.
Whether you're designing industrial control systems, networking infrastructure, medical devices, or transportation equipment, the FEMC016GMG-E440 provides the storage capacity, thermal resilience, and interface simplicity needed for reliable long-term operation. Backed by Flexxon's XTRA III series quality and comprehensive technical documentation, this eMMC module offers a dependable foundation for your next embedded design.
Ready to integrate reliable industrial-grade storage into your embedded system? Request a quote for the FEMC016GMG-E440 today to discuss your specific application requirements, volume pricing, and technical support options. Our team is available to help you evaluate how this eMMC solution fits your design constraints and performance objectives.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015