FEMC016GMB-E440

The FEMC016GMB-E440 is a 16GB embedded MultiMediaCard (eMMC 5.1) flash memory solution from Flexxon's XTRA III series, engineered for demanding embedded applications requiring reliable, high-performance non-volatile storage. Built on MLC (Multi-Level Cell) NAND technology with a 153-ball FBGA package, this device delivers robust data retention and longevity in a compact, surface-mount form factor.

Qualified to AEC-Q100 Grade 2 standards and designed for automotive-grade applications, the FEMC016GMB-E440 operates reliably across an extended temperature range of -25°C to 85°C. With dual voltage support (VCCQ: 1.8V/3.3V, VCC: 3.3V) and eMMC 5.1 interface compliance, this memory module integrates seamlessly into automotive, industrial, and embedded systems where data integrity, environmental resilience, and space efficiency are critical.

Key Features

• 16GB Storage Capacity (128 Gbit)
  Organized as 16G × 8, providing ample non-volatile storage for firmware, operating systems, data logging, multimedia content, and application code in embedded designs.
• eMMC 5.1 Interface
  Industry-standard embedded MultiMediaCard protocol ensures broad compatibility with modern processors and controllers, simplifying integration and reducing development time.
• MLC NAND Flash Technology
  Multi-Level Cell architecture balances endurance, performance, and cost-effectiveness, making it well-suited for applications with moderate write cycles and long-term data retention requirements.
• Automotive-Grade Qualification (AEC-Q100 Grade 2)
  Meets stringent automotive reliability and quality standards, ensuring dependable operation in vehicular environments and other mission-critical applications.
• Extended Operating Temperature Range (-25°C to 85°C)
  Designed to perform reliably in harsh environmental conditions, from cold-start scenarios to elevated operating temperatures in enclosed systems.
• Dual Voltage Supply Support
  VCCQ supports both 1.8V and 3.3V, while VCC operates at 3.3V, offering flexibility in power design and compatibility with diverse system architectures.
• Compact 153-FBGA Package
  Surface-mount ball grid array package delivers high pin density and minimal PCB footprint, ideal for space-constrained embedded applications.
• RoHS Compliant
  Environmentally responsible manufacturing ensures compliance with global regulations for hazardous substance restrictions.

Typical Applications

• Automotive Infotainment and Telematics
  Stores multimedia content, navigation databases, and operating systems in dashboard displays, rear-seat entertainment systems, and connected vehicle platforms requiring AEC-Q100 qualified components.
• Industrial Control and Automation
  Provides reliable non-volatile storage for firmware, configuration data, and operational logs in PLCs, HMIs, and edge computing devices operating in demanding industrial environments.
• Embedded Computing Platforms
  Serves as boot storage and primary data repository in single-board computers, IoT gateways, and embedded controllers across commercial and industrial sectors.
• Medical and Instrumentation Devices
  Supports data logging, firmware storage, and system configuration in medical equipment and test instruments where reliability and extended temperature performance are essential.
• Smart Home and Building Automation
  Enables robust storage for firmware, user data, and system updates in smart thermostats, security systems, and connected building management controllers.

Unique Advantages

• Automotive-Qualified Reliability:
  AEC-Q100 Grade 2 qualification delivers the robustness and quality assurance required for automotive electronics and other mission-critical applications, reducing risk in demanding deployments.
• Wide Temperature Resilience:
  The -25°C to 85°C operating range ensures consistent performance across harsh environmental conditions, from outdoor installations to thermally challenging enclosures.
• Proven eMMC 5.1 Standard:
  Industry-standard interface reduces integration complexity, accelerates time-to-market, and ensures compatibility with a broad ecosystem of processors and development tools.
• Flexible Voltage Operation:
  Dual VCCQ voltage support (1.8V/3.3V) simplifies power management and enables seamless integration into diverse system architectures without additional level-shifting circuitry.
• Space-Efficient Design:
  The 153-ball FBGA package maximizes board real estate utilization, enabling compact product designs in space-constrained applications without sacrificing storage capacity.
• MLC Endurance and Cost Balance:
  Multi-Level Cell technology provides a practical balance of write endurance, performance, and cost-effectiveness for applications with moderate update frequencies and long operational lifetimes.

Why Choose the FEMC016GMB-E440?

The FEMC016GMB-E440 delivers a compelling combination of automotive-grade reliability, environmental resilience, and integration convenience for embedded system designers. Its AEC-Q100 Grade 2 qualification and extended temperature range make it an ideal choice for automotive, industrial, and mission-critical applications where component reliability directly impacts system uptime and safety. The eMMC 5.1 interface and dual voltage support streamline integration, reducing both design complexity and bill-of-materials costs.

Whether you're developing next-generation automotive infotainment systems, ruggedized industrial controllers, or long-lifecycle embedded platforms, the FEMC016GMB-E440 from Flexxon's XTRA III series provides the storage performance, environmental robustness, and quality assurance your design demands. Backed by Flexxon's expertise in industrial and automotive memory solutions, this eMMC module supports the long-term success and reliability of your embedded systems.

Ready to integrate automotive-grade embedded storage into your next design? Request a quote today to discuss volume pricing, technical specifications, and delivery options for the FEMC016GMB-E440. Our team is available to support your project from prototype through production.