FEMC016GMA-E440

The FEMC016GMA-E440 is a 16GB embedded MultiMediaCard (eMMC 5.1) flash memory module from Flexxon's XTRA III series, designed to deliver reliable, high-performance non-volatile storage for automotive and industrial embedded applications. Built with MLC (Multi-Level Cell) NAND technology and organized as 16G × 8 (128 Gbit total capacity), this surface-mount memory solution provides robust data retention and fast access in a compact 153-ball FBGA package.

Qualified to AEC-Q100 Grade 3 automotive standards and rated for operation from -25°C to 85°C, the FEMC016GMA-E440 is engineered for demanding environments where performance, temperature resilience, and long-term reliability are critical. Its dual voltage supply capability and standardized eMMC 5.1 interface make it an ideal drop-in storage solution for automotive infotainment, telematics, industrial controllers, and embedded computing platforms.

Key Features

• 16GB MLC NAND Flash Memory
  Delivers 128 Gbit of non-volatile storage organized as 16G × 8, providing ample capacity for operating systems, applications, logs, and multimedia content in embedded designs.
• eMMC 5.1 Interface
  Industry-standard embedded MultiMediaCard interface ensures broad compatibility with host processors and simplifies integration across a wide range of embedded platforms.
• AEC-Q100 Grade 3 Qualified
  Meets automotive-grade reliability standards with qualification to AEC-Q100 Grade 3, ensuring suitability for automotive applications with rigorous durability and quality requirements.
• Extended Operating Temperature Range
  Operates reliably across -25°C to 85°C, making it well-suited for automotive cabin, engine control unit peripherals, and industrial environments subject to temperature variation.
• Dual I/O Voltage Support
  Supports both 1.8V and 3.3V I/O (VCCQ) with 3.3V core supply (VCC), providing design flexibility and compatibility with a variety of host controller voltage domains.
• Compact 153-FBGA Surface Mount Package
  Fine-pitch ball grid array package enables space-efficient PCB layouts for size-constrained embedded systems without compromising pin count or thermal performance.
• RoHS Compliant
  Fully compliant with RoHS environmental regulations, supporting green manufacturing and export requirements for global markets.

Typical Applications

• Automotive Infotainment Systems
  Provides storage for navigation maps, multimedia libraries, user interface assets, and firmware in vehicle head units and display clusters, leveraging automotive-grade qualification for in-cabin reliability.
• Telematics and Connected Vehicle Platforms
  Stores software stacks, configuration data, and logging information for telematics control units, fleet management systems, and over-the-air update modules operating in harsh automotive environments.
• Industrial Automation and Control
  Serves as embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge gateways requiring non-volatile memory across extended temperature ranges.
• Embedded Computing and IoT Devices
  Offers reliable, standardized storage for single-board computers, edge AI appliances, and IoT hubs that demand proven eMMC compatibility and robust data retention.

Unique Advantages

• Automotive-Qualified Reliability:
  AEC-Q100 Grade 3 qualification ensures the memory module meets stringent automotive quality and reliability standards, reducing risk in safety-critical and mission-critical automotive deployments.
• Proven eMMC Standard:
  Adherence to the eMMC 5.1 specification guarantees interoperability with a vast ecosystem of SoCs, microprocessors, and development tools, accelerating time-to-market and simplifying supply chain management.
• Flexible Voltage Operation:
  Dual I/O voltage support (1.8V/3.3V) eliminates the need for external level shifters in many designs, reducing BOM cost and board complexity while accommodating legacy and modern host interfaces.
• Wide Temperature Tolerance:
  Operation from -25°C to 85°C ensures stable performance in automotive cabin, trunk-mounted, and industrial enclosure environments where ambient temperature fluctuates.
• Space-Efficient Form Factor:
  The 153-ball FBGA package minimizes PCB footprint while maintaining robust electrical and thermal characteristics, ideal for compact automotive modules and handheld industrial devices.
• MLC Endurance and Performance Balance:
  MLC NAND technology delivers a practical balance of write endurance, read/write performance, and cost-effectiveness for applications with moderate update cycles and high read demands.

Why Choose the FEMC016GMA-E440?

The FEMC016GMA-E440 combines automotive-grade quality, industry-standard interface compatibility, and flexible voltage operation in a compact, surface-mount package. Backed by Flexxon's XTRA III series design and AEC-Q100 Grade 3 qualification, this 16GB eMMC 5.1 module is engineered for embedded designers who require proven reliability, straightforward integration, and long-term supply stability. Its extended temperature range and dual voltage I/O make it adaptable to both next-generation automotive platforms and ruggedized industrial equipment.

Whether you are developing an infotainment system, telematics gateway, industrial controller, or embedded computing appliance, the FEMC016GMA-E440 delivers the storage capacity, interface standardization, and environmental resilience your project demands—without compromising board space or design flexibility.

Ready to integrate automotive-grade eMMC storage into your next embedded design? Request a quote today to ensure your project benefits from the proven reliability and industry-standard compatibility of the FEMC016GMA-E440.