FEMC016GCE-T740

The FEMC016GCE-T740 is a high-reliability 16GB embedded MultiMediaCard (eMMC) 5.1 memory solution from Flexxon's XTRA VII Series. Built on advanced 3D pseudo-Single Level Cell (pSLC) technology, this 153-ball FBGA device delivers robust non-volatile storage with enhanced endurance and data retention characteristics. Organized as 16G × 8 (128 Gbit total capacity), it operates at up to 200 MHz clock frequency and supports dual voltage operation (1.8V/3.3V VCCQ, 3.3V VCC) for flexible system integration.

Designed for industrial-grade applications requiring reliable, high-performance embedded storage, the FEMC016GCE-T740 combines the capacity advantages of modern NAND flash with the durability profile of pSLC conversion technology. Its eMMC 5.1 interface ensures broad compatibility with modern embedded processors while the industrial temperature range (-25°C to 85°C) makes it suitable for demanding operating environments across automation, transportation, medical, and industrial IoT applications.

Key Features

• 16GB Storage Capacity with 3D pSLC Technology
  Delivers 128 Gbit (16GB) of non-volatile flash memory utilizing 3D pSLC architecture. This technology provides superior endurance, faster write speeds, and improved data retention compared to conventional TLC, making it ideal for write-intensive industrial applications.
• eMMC 5.1 Interface at 200 MHz
  Features a standards-compliant eMMC 5.1 interface operating at up to 200 MHz clock frequency, ensuring compatibility with a wide range of embedded processors and SoCs while delivering high-speed data transfer performance.
• Flexible Dual-Voltage Operation
  Supports both 1.8V and 3.3V VCCQ operation with 3.3V VCC supply, providing design flexibility for various system architectures and enabling power optimization strategies.
• Industrial Temperature Range
  Operates reliably across -25°C to 85°C, meeting the thermal requirements of industrial equipment, outdoor installations, transportation systems, and other demanding environments where consumer-grade components may fail.
• Compact 153-FBGA Surface Mount Package
  Housed in a space-efficient 153-ball Fine-pitch Ball Grid Array package designed for surface mount assembly, enabling high-density PCB layouts and automated manufacturing processes.
• RoHS Compliant
  Fully compliant with RoHS environmental regulations, supporting green manufacturing initiatives and meeting global regulatory requirements for electronic components.

Typical Applications

• Industrial Automation and Control Systems
  Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial computers requiring persistent data logging, configuration storage, and firmware updates in factory environments.
• Medical Equipment and Instrumentation
  Serves as embedded storage in diagnostic devices, patient monitoring systems, and medical imaging equipment where data integrity, longevity, and consistent performance are critical requirements.
• Transportation and Telematics Systems
  Enables data recording and system operation in fleet management devices, digital tachographs, infotainment systems, and onboard computers that must withstand vibration, temperature fluctuations, and continuous operation.
• Industrial IoT Edge Devices
  Powers gateway devices, edge computing platforms, and smart sensors requiring local data buffering, analytics processing, and reliable storage for time-series data collection in distributed industrial networks.
• Network and Communications Equipment
  Supports configuration storage, logging, and software updates in industrial routers, switches, access points, and telecommunications infrastructure operating in extended temperature environments.

Unique Advantages

• Enhanced Endurance Through 3D pSLC Conversion:
  Unlike standard TLC-based eMMC solutions, the 3D pSLC technology significantly extends write endurance cycles, making this device suitable for applications with frequent data updates and long operational lifespans.
• Industrial-Grade Reliability:
  The -25°C to 85°C operating temperature range combined with industrial-grade construction ensures consistent performance in harsh environments where temperature extremes, vibration, and continuous operation are common.
• Simplified Integration with eMMC 5.1 Standard:
  The standardized eMMC 5.1 interface eliminates complex controller design requirements, reduces time-to-market, and ensures compatibility across multiple processor platforms without custom firmware development.
• Optimized Memory Organization:
  The 16G × 8 memory organization provides efficient data access patterns for embedded applications while the 200 MHz clock frequency delivers the throughput needed for modern embedded operating systems and applications.
• Dual Voltage Flexibility:
  Support for both 1.8V and 3.3V VCCQ operation allows designers to optimize power consumption and integrate the memory seamlessly into systems using either voltage standard without additional level-shifting circuitry.
• Space-Efficient Form Factor:
  The compact 153-FBGA package minimizes PCB footprint, enabling smaller product designs and allowing integration into space-constrained applications such as handheld devices and embedded modules.

Why Choose the FEMC016GCE-T740?

The FEMC016GCE-T740 represents a robust storage solution for industrial embedded systems that demand both capacity and reliability. By combining 16GB of 3D pSLC flash memory with eMMC 5.1 compatibility and industrial temperature performance, this device addresses the critical requirements of modern embedded applications where data integrity and operational longevity cannot be compromised. The use of 3D pSLC technology provides a significant advantage over consumer-grade eMMC solutions, delivering write endurance characteristics that support data-intensive applications while maintaining the cost-effectiveness and integration simplicity of the eMMC standard.

For design engineers and system architects developing industrial equipment, medical devices, transportation systems, or rugged IoT platforms, the FEMC016GCE-T740 offers a proven storage solution backed by Flexxon's XTRA VII Series engineering. Its combination of industrial-grade specifications, flexible voltage operation, and standards-based interface ensures straightforward integration and long-term availability for products requiring extended lifecycles. Whether you're upgrading existing designs or developing new platforms, this eMMC solution delivers the reliability and performance your industrial applications demand.

Ready to integrate reliable industrial storage into your next design? Request a quote for the FEMC016GCE-T740 today or contact our technical sales team to discuss your specific application requirements, volume pricing, and delivery schedules. Our team is ready to support your embedded storage needs with technical documentation, design resources, and application guidance.